Cap or lid

This disclosure relates to the packaging of microwave integrated circuits (MICs) whereby an MIC is hermetically sealed within an enclosure comprising a first plate of dielectric material which carries the circuit to be enclosed, a wall of dielectric material sealed to the surface of the first plate surrounding...     

A multi-component microcircuit package is formed from a plurality of separate components which are secured together to form a lower package portion using a base and a continuous composite side wall frame having irregularities on its upper surface as a result of the component junctions. Secured to the...     

A large scale integrated circuit package including a base or substrate section and a lid structure of thermally conductive material to which the chip or die of the package is mounted. A frame defining a recess for the chip is provided on the lid and the frame carries conductive tracks which are coupled...     

A semiconductor device having a semiconductor chip (102), a ceramic base (101), a ceramic frame (105) and a cover (106). The ceramic base (101) is formed with a through hole. One side of said hole is covered by a high-heat conductivity metal plate (100). Said semiconductor chip (102) is mounted through...     

Case for a semiconductor component, including at least two parts, one of the parts being a cap, at least the cap being formed of a material having low hydrogen permeability and a weak catalytic effect for an oxyhydrogen gas reaction.

Grammophone record sleeve made of thin material as paper or cardboard and comprising a first section and a second section (13), which sections are connected to each other and intended to store the record (9) in between them and have such a size and shape that they substantially cover the same. The sleeve...     

A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. An adhesive seals and bonds the metal base member...     

Case for a semiconductor component, including at least two parts, one of the parts being a cap, at least the cap being formed of a material having low hydrogen permeability and a weak catalytic effect for an oxyhydrogen gas reaction.

A cap and seal including a central cap (20) to be positioned over an electronic component such as an integrated circuit chip (12), has a spaced upstanding wall or dam (22) which may be staked to the circuit board in assembly forming with the peripheral side wall (21) of the cap a channel or moat (19)....     

A displacement compensating module is disclosed wherein a blocking article, such as a polyimide tape, is disposed between an epoxy composition and the back surface of a substrate and between the epoxy composition and the inner surface of a cap for blocking the movement of the epoxy composition into a...     

A package for a semiconductor device including a sealing frame with first and second opposing sides, the second side having a projected edge portion comprising a flash or a burr produced by blanking presswork of the sealing frame. A package substrate is fixed to the first side of the sealing frame while...     

Hermetic power chip packages are constructed in building block form to reduce the cost of electrical testing of power chips. The power chip packages utilized dielectric plates with metallic sheets bonded to the dielectric plates. Electric access to at least selected terminals of a power chip is gained...     

A semiconductor device with a semiconductor element encased in a hollow ceramic package. The portion of the package at which the semiconductor element is disposed is formed from SiC admixed with Be or a compound of Be.

An improved hermetically sealed semiconductor casing and a process for producing the casing are disclosed. This casing includes a lead frame having an electrical device affixed thereto. A base member is glass bonded to a matching surface of the lead frame. A metal window frame shaped device is provided...     

A semiconductor device comprises a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap to cover the...     

A semiconductor chip housing provides hermetic sealing and appropriate electrical characteristics for use at high frequencies. The housing comprises a substrate in which the chip is mounted and a cylindrical tube having a top cover and extending above the substrate which impinges on a base and thus hermetically...     

A multifaceted package is disclosed that permits VLSI and VHSIC integrated circuits in the form of integrated circuit die or chip carries to be mounted on the faces of the package to form a high-density circuit package. The package comprises a plurality of ceramic layers which are cofired and fused together...     

A semiconductor device which is designed to have a plurality of electrodes on an upper surface of a lid portion has a recessed portion which is provided on this upper surface of the lid portion. The recessed portion will accept an electrode after it is bent from its initial position to a position such...     

A semiconductor device which includes a substrate, a semiconductor element mounted on the substrate, a cap having an opening smaller than the external size of the semiconductor element for covering the semiconductor element to provide a hermetic seal, and a heatsink member mounted on the cap covering...     

A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a semiconductor package to prevent alpha radiation emitted from the sealing glass or other packaging components from...     

A semiconductor chip carrier having a ceramic base with a cavity for carrying a semiconductor chip and a cap for sealing the chip within the cavity. The base has a metallization pattern covering the chip contacts on the base and an outer contact castellated ring providing for the flow of excess solder...     

An integrated circuit (IC) chip package is formed by extending the overall dimensions of a standard IC on a semiconductor substrate, typically a first silicon wafer, to provide an integral band of semiconductor material therearound on which are formed a series of spaced IC chip input/output pad areas...     

A semiconductor package comprises a package having a cavity for accommodating therein at least one semiconductor chip, at least one dielectric substrate with a peripheral circuit disposed thereon and one substrate cracking prevention plate, the cavity having therein a flat surface on which the semiconductor...     

A semiconductor device is provided with an electrically conductive cap having a sufficiently thick edge portion for preventing warpage due to the hardening of an encapsulating resin. Since the edge portion of the conductive cap is formed into the shape of a frame, and its thickness is made large, the...     

Disclosed is a cover for a semiconductor chip package. The cover comprises a sealing surface for providing a seal between the cover and a semiconductor chip package. A mounting surface for mounting a capacitor to the surface of cover is provided. The mounting surface comprises metalization including...     

A semiconductor device includes a successively disposed a radiating electrode and hard radiating layer at the rear surface of a semiconductor wafer substrate which is divided into a plurality of semiconductor chips wherein the semiconductor chip includes the hard radiating layer having outer dimensions...     

A mounting arrangement for electronic circuit chips in which at least one chip is mounted upon an appropriately electrically insulating chip plate. A connector board is mounted on top of the chip plate to electrically connect the chip with a cable allowing signals to be passed to and from the chip. The...     

A package for a device comprises a header having a substantially flat upper surface. An insulating disk is affixed to the upper surface of the header for having the device mounted thereon. A barrel having upper and lower portions of respectively greater and smaller diameters, and having a step between...     

Disclosed electronic apparatus comprises a ceramic substrate, a multilayered wiring portion disposed at a distance from the periphery of the main surface of the ceramic substrate and produced by alternately repeating a conductor pattern formed by the thin-film method using a conductive metal and a polyimide...     

Hermetic package designs for HDMI substrates are discussed. The designs for a hermetically sealed, perimeter-leaded package may have the following features: a) a flat monolithic dielectric base, the base having a flat upper surface and a flat lower surface; b) a zone on the upper surface, in which zone...     

A hermetically sealed package for one or more integrated circuit chips that is made of three metal, thick-film layers, and one dielectric, thick-film layer to form a mounting surface for the chip. The first applied metal layer includes the power plane, and the fan-out leads including power and ground...     

A high power, hermetic, low cost, high reliability package for electrical devices is described. The package includes in the preferred embodiment an aluminum nitride substrate, copper thick film ink screen printed and fired upon the substrate, a Kovar ring brazed to the copper thick film ink, a thermally...     

According to this invention, an optical semiconductor device includes a flat metal plate, a glass member, a plurality of lead wires, an optical semiconductor element, and a cap member. The flat metal plate has a through hole in a direction of a thickness of the flat metal plate. The glass member is buried...     

A ceramic package for a memory semiconductor accommodates therein the memory semiconductor and is sealingly closed by an ultraviolet ray transmissible ceramic lid. The ceramic lid is made of a polycrystalline alumina and formed with at least one groove in a sealing portion with the ceramic package. With...     

A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The voltage bus wraps around the chip carrier, thus providing a large area of metal. Through the selective...     

The present invention discloses a package for electronic components which reduces the unwanted electronic noise generated by the package and which can be fabricated by conventional manufacturing techniques. Accordingly, a lid for a package housing is fabricated from beryllium oxide and contains a small...     

A package (44) for a semiconductor device (10) includes a ceramic base (46, 146) with a mounting surface (50, 150) for supporting the device (10) and a light-transmissive cover (42, 142). A refractory seal ring (70) is fused to the base (46, 146) and to conductive paths (22) thereon. The upper surface...     

A ceramic package comprising an aluminum nitride substrate, an IC on the substrate, leads attached to the substrate, a metal cap covering the substrate, a resin layer for adhesion of the above elements, and a water-resistant coating on the inner surface of the resin layer.

A CCD package and a method for assembling a CCD package utilizing a TAB process. The method comprises the steps of preparing a tape for TAB which has outer leads, inner leads and die bonding paddles, bonding a chip on the paddles and then bonding the free ends of the inner leads on the bonding pads of...     

In a semiconductor package in which a cover and a substrate are combined with each other in a sealed state, metallized portions consisting of a material of a high solder wettability are provided on the joint surface, which is opposed to the substrate, of the cover, outer side surfaces of the cover, and...     

A package for a semiconductor device includes multiple layers which are fused together to encapsulate the device in a package which has a size approaching the size of the unpackaged device. The compact package facilitates heat transfer from the device, thus making it particularly advantageous for high...     

A tamper resistant structure has a pattern which covers portions of an IC but exposes other portions of the IC so that etching away the tamper resistant structure destroys the exposed portions. The IC can not be easily disassembled and reverse engineered because the tamper resistant structure hides active...     

Three-dimensional multichip module. The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each incorporating at least one chip (10a-10d), a support (6a-6d) on which is placed the chip and a conductive interconnection...     

Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for...     

The semiconductor chip module comprises a substrate on which a wiring portion is formed, a semiconductor chip mounted so as to face a circuit side down to the wiring portion, a heat sink with one end in contact with a side opposite to the circuit side of the semiconductor chip, and a cap enclosing the...     

A ceramic hermetic package is provided having conductive material bonded into apertures in the ceramic housing that connect with a die mounted on a thin substrate through wire and pad connections. The substrate has a heat sink affixed to the bottom and electrical connections are formed on the opposite...     

In a high frequency circuit device, inductive circuit elements constituting a matching circuit are constructed of so-called helical coils having fine metal wires wound in a hollow solenoid form, which are disposed inside a package in which a high frequency circuit element such as a surface acoustic wave...     

Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for...     

A sealed semiconductor unit includes an electrical component within a defined area on a semiconductor material. A cover with the dimensions of the semiconductor defined area is placed over the semiconductor material with a sealant there between. The dimensions of the cover are aligned with the dimensions...     

A charge-coupled device image sensor has a base of resin having a mount area on an upper surface with a charge-coupled device chip being connected to the mount area, leads mounted on the base and connected to the charge-coupled device chip through bonding wires, and a cover of resin joined to the upper...     

A multichip circuit package is formed for use with an EPROM chip. The active circuitry on the EPROM die surface is revealed. An EPROM die (14) is mounted on an insulating substrate (10). The active circuitry (15) on the die is connected to a conductive circuit pattern (13) on the substrate by wire bonds...     

An improved millimeter wave device package design in which the package includes a dielectric substrate disposed upon a supporting base such that the substrate extends substantially along the peripheral edge of the base, defining a central aperture. A solid conductive layer substantially covers the first...     

A novel lid for sealing an encapsulant within a cavity of an integrated circuit package is disclosed herein. A ring is formed around a cavity opening, where a semiconductor die is located in an integrated circuit package. A lid, having a radially extending potion biased toward the die, is adapted to...     

A semiconductor device package includes a semiconductor package element for containing a semiconductor chip, a lid bonded to the semiconductor package using an adhesive agent, and a cooler bonded to a surface of the lid. The bonded surface between the semiconductor package and the lid is positioned inside...     

A lightweight composite lid for a package containing a semiconductor device formed of a porous ceramic body filled with a material having a thermal conductivity greater than air.

The semiconductor device of the present invention includes a semiconductor substrate on which an integrated circuit equipped with a connection electrode is formed on its main surface. At the center of the main surface, a substrate mounting portion having a cavity portion in which the semiconductor substrate...     

A resin-sealed semiconductor device includes a heat sink on which a semiconductor chip is provided. An output terminal is connected to the semiconductor chip. A casing surrounds the chip and part of the output terminal. The inside of the casing is filled with a sealing resin containing an aggregate such...     

A first thermal conductive member and a plurality of second thermal conductive members are formed on one major surface of an insulating board. A TCP is mounted on the first thermal conductive member. A heat sink is mounted on the plurality of second thermal conductive members. A third thermal conductive...     

A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsulated by glob top technology. The metal coating...     

The hermetically sealed package for an electronic device of the present invention comprises a body containing an electronic device therein and a covering member, such as a cap or a lid, for covering the body. The package is characterized in that the covering member of the package comprises a metal foil,...     

A semiconductor package has a guide in the form of a lug only at least two diagonally opposite corners on the upper surface thereof. A cap to be adhered to the package is configured to mate with the inside surfaces of the guides. The package is, therefore, surely seated and held in close adhesion to...     

A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a heat sink to either the top or bottom thereof...     

An improved semiconductor module comprising a molded frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of...     

The power cap includes a power supply positioned between a cover and a base. The cover is provided with clips to permit the attachment and detachment of the cover to the power supply and the base. The base is provided with surface mounted NRTC or NVSRAM chips and electrical contacts. The power supply...     

A semiconductor device comprising a substrate having a hollow cavity for mounting a semiconductor element therein and a lowered step surface at a periphery of the cavity for mounting a chip component thereon. A semiconductor element is mounted within the cavity and a chip capacitor is mounted to the...     

A modular multi-pin package for an integrated circuit die is formed of simple standardized parts and a readily redesigned, integrated circuit specific circuit substrate possessing a design pattern for providing electrical connection between die pads and output pins. The substrate includes a pattern of...     

A power semiconductor module (201) is disclosed comprising at least one semiconductor chip, which is arranged on a baseplate (202) and is surrounded by a housing (204) arranged above the baseplate (202), and which can be externally connected by means of connecting lugs (205). The connecting lugs (205)...     

A hermetically sealed housing for plural GaAs chips includes a body made from Al/SiC. The body defines a peripheral seal ring support surface, an electrical connector insert support surface and an end wall to which a ceramic insert is mounted. The insert includes a first portion with an upper surface...     

A semiconductor package is described which is constructed from a rectangular tape film, a wiring pattern formed on the tape film constituted by wiring composed of a conductive material, a semiconductor chip electrically connected to one end of the wiring pattern, and holes formed on the other end of...     

A method for manufacturing a cap for use in a semiconductor package is disclosed. The semiconductor package includes a semiconductor chip and a substrate. The chip is mounted with the substrate at a chip locus. The method preferably comprises the steps of placing a slug in a die, and exercising the die...     

A semiconductor package has a guide in the form of a lug only at least two diagonally opposite corners on the upper surface thereof. A cap to be adhered to the package is configured to mate with the inside surfaces of the guides. The package is, therefore, surely sealed and held in close adhesion to...     

An aluminum nitride housing is molded which includes open holes that pass through the walls. A lead frame is formed by machining or chemically milling individual leads and details therein to form desired circuitry patterns. The lead frame is inserted through the open holes in the aluminum nitride housing...     

A semiconductor device includes a substrate having a recess; a semiconductor chip disposed in the recess; a plurality of external electrodes disposed on the substrate; a lid covering the recess; and a heat radiator disposed between the semiconductor chip and the substrate for transmitting heat generated...     

A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically...     

A circuit device, for example, a hybrid integrated circuit device, for improving the positioning accuracy of a frame element is disclosed. At least two thick film electrodes (7a) of circular configuration having a diameter of 0.3 mm or greater are formed on a component mounting surface (7S) of a thick...     

A chip cover for complete or partial covering of electrical, electronic, optoelectronic and/or electromechanical components includes an activator capable of fully or partially destroying the electrical, electronic, optoelectronic and/or electromechanical components of the chip when activated. The activator...     

A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having...     

A package for shielding a circuit containing magnetically sensitive materials from external magnetic fields. A shield attached to a base of the package is connected by vias to a first conductive plane. A shield attached to a lid of the package is connected by vias to a second conductive plane. The first...     

A semiconductor package structure that includes placing self-adjusting stand-offs between the substrate and sealband of the cap, such that the gap between the cap and the chip can be controlled, thereby improving the thermal and fatigue performance of the overall package. The height of the stand-off...     

A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. The...     

An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead...     

A large non-hermetic packaging approach that produces a large multichip module or SuperMCM package. The present invention integrates a plurality of multichip module technologies including removable and/or standard high density multilayer interconnect (HDMI) decal substrates, and a reworkable chip on...     

A package for an integrated circuit is described, as is a method of making the package. The package is comprised of a substrate having a substantially planar first surface on which an integrated circuit die is placed. An imperforate adhesive bead on the first surface of the substrate surrounds the die....     

Packaging of high resolution linear solid state image sensors can result in a significant cost savings over conventional packaging processes, while adding several features. Cost reduction is accomplished by drastically reducing the cover glass size, eliminating the need for rounded corners as well as...     

A semiconductor device which includes a first semiconductor chip mounted on top of a lead frame which is molded within a plastic body. During the molding process a cavity is formed on the bottom of the lead frame. After testing or burn-in of the first chip a second semiconductor chip is mounted and electrically...     

A semiconductor package includes a substrate having one or more dice mounted thereto, and a cover adapted to protect and form a sealed space for the dice. The cover can be pre-fabricated of molded plastic, or stamped metal, and attached to the substrate using a cured seal. A hole can also be provided...     

The present invention is directed to a multifunction structure (MFS) in which electrical/electronic componentry, thermal control and structural support are integrated into a monolithic structure that is particularly useful in spacecraft applications. The multifunctional structure is also designed to...     

A thermally enhanced semiconductor package includes a sheet metal cap having flexible flanges provided with solder contacts for reliable attachment to a circuit board. The package assembly further includes a semiconductor chip with a contact-bearing front surface facing forwardly, and chip bonding contacts...     

High power semiconductor module device constituted in such a manner that a circuit board to which semiconductor pellets are bonded is bonded onto a heat sink, and an electrically insulating case with elasticity which has a tubular portion surrounding the sides of the circuit board is mounted on the heat...     

A bump chip scale semiconductor package. In the bump chip scale semiconductor package, the chip bumps are directly formed on the chip pads of a semiconductor chip. The above chip bumps are used as the signal input and output terminals of the package and are used as surface mounting joints when the chip...     

An electronic packaging assembly is disclosed. An electronic component is disposed on a socketing substrate utilizing a ball grid array or land grid array. The socketing substrate contains a series of pins that are embedded within the thickness of the socketing substrate. The pins correspond with the...     

The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of...     

A hermetic thin pack semiconductor device. The semiconductor device has a semiconductor substrate and at least one electrode on the upper surface of the semiconductor substrate. A lid of a ceramic material for the semiconductor device has at least one opening extending through the lid. A first electrically...     

A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.

A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics...     

A semiconductor device according to the invention of the present application comprises a substrate having a surface on which interconnections are formed, a semiconductor element connected to the interconnections and mounted on the substrate, and a conductive map for covering the semiconductor element...     

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment...     

A crystal oscillator in which IC control terminal electrodes for writing temperature compensation data in an IC chip are formed on side surfaces of a main body while being distanced from the top and bottom surfaces of the main body. The IC control terminal electrodes will not be short-circuited with...     

The semiconductor device includes a substrate, a semiconductor component, and a cap covering the semiconductor component and attached to the substrate. The cap has a top wall, a plurality of side walls 14 extending downward from the top wall and a bottom wall. Opening are provided in the side walls of...     

A semiconductor packaging structure for packaging a semiconductor element comprises: a flat substrate having a chip seat and having a plurality of outer lead wires for electrically connecting the packaging element and the liner. A wall is formed by molding compound and is installed at periphery of the...