Solution applying apparatus

5439519
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Inventors

Sago, Hiroyoshi
Kumazawa, Hirotsugu
Shimai, Futoshi
Fujiyama, Shigemi
Endo, Hiroki
Kobari, Hideya

Application #

176204

Filed

Jan-3-1994

Published

Aug-8-1995

Current US Class

118/501
118/52

International Classes

B05C 011/02; B05C 005/00

Field of Search

118/52 118/500 118/501

Assignee

Tokyo Ohka Kogyo Co., Ltd. (Kanagawa, JP)

Examiners

Ball; Michael W.

Attorney, Agent or Firm

Weiner, Carrier & Burt, Carrier; Joseph P., Weiner; Irving M.

US Patent References

4157931   Process for produci...
4201149   Apparatus for spin...
4519846   Process for washin...
4640846   Semiconductor spi...
4889069   Substrate coating e...
5009185   Apparatus for appl...
5234499   Spin coating appar...

Referenced by:

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Citation

Cite This Patent

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Abstract
A solution applying apparatus has inner and outer cups each having an upper opening, the inner cup being rotatably disposed in the outer cup. The inner cup houses a planar workpiece such as a glass substrate therein which is to be coated with a coating solution such as a resist solution. The solution applying apparatus also has a lid assembly having an outer cup lid for closing the upper opening of the outer cup and an inner cup lid for closing the upper opening of the inner cup, the inner cup lid being rotatable with respect to the outer cup lid. The inner cup has drain holes defined in an outer circumferential portion thereof for providing communication between a space within the inner cup and a space outside of the inner cup to drain an excessive coating solution from the inner cup. The outer cup has an annular collection passage defined therein along the outer circumferential portion of the inner cup, the drain holes opening into the annular collection passage. The lid assembly includes a self-centering valve body that can be vertically movable into and out of snugly fitting relation to a through hole defined in the inner cup lid and a lost motion mechanism for moving the valve body to an open position thereof while the first and second cup lids remain closed and for opening the outer cup lid while the inner cup lid remains closed. After the workpiece has been coated with the coating solution, the valve body is lifted out of the through hole to smoothly eliminate a vacuum developed in the inner cup, and then the inner cup is opened.
 
Claims
What is claimed is:

1. A solution applying apparatus comprising:

an outer cup having an upper opening;

a rotatable inner cup disposed in said outer cup and having an upper opening, for housing a planar workpiece therein which is to be coated with a coating solution;

a lid assembly having an outer cup lid for closing the upper opening of said outer cup and an inner cup lid for closing the upper opening of said inner cup, said inner cup lid being rotatable with respect to said outer cup lid;

said inner and outer cup lids having respective engagement surfaces selectively engageable together such that said inner and outer cup lids are movable together in a vertical direction; and



Description
BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to an apparatus for applying a resist solution or the like to a surface of a planar workpiece such as a glass substrate for use in a liquid-crystal display panel or a semiconductor wafer, and more particularly to such a solution applying apparatus having a rotatable cup for holding a planar workpiece therein.

Description of the Relevant

Semiconductor devices such as thin-film transistors (TFT) or metal-insulator-metal (MIM) semiconductors are fabricated on a glass substrate according to a fabrication process that includes the step of applying a resist solution to the glass substrate. One known apparatus for applying a resist solution has a rotatable cup for holding a workpiece therein as disclosed in Japanese laid-open patent publication No. 4-146615.

The disclosed solution applying apparatus comprises a cup rotatable by a spinner and a chuck disposed in the cup. A wafer is fixedly supported on the chuck, and a solution such as a resist solution to be coated on the wafer is dropped onto the upper surface of the wafer, after which the upper open end of the cup is closed by a lid, covering the entire exposed upper surface of the wafer in the cup. Then, the chuck and the wafer are rotated together to cause the solution dropped on the upper surface of the wafer to spread uniformly thereover.
 
  A glass substrate is supported on a pedestal in a rotatable cup having an upper opening. The pedestal, which is substantially similar in shape to the glass...  Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from...