Cooling electrical device

A cooling chamber is bonded to an electrical device to be cooled. The chamber includes a metal wall connecting the device into the working electrical circuit. A thinned portion of the metal wall forms a fuse which will burn out due to an excessive flow of current through the electrical device upon failure.

A semiconductor wafer is sandwiched between the ends of two heat pipes. One end of each heat pipe is in electrical and thermal contact with the wafer. The heat pipes are fastened together so that the wafer is held in compression between the two heat pipes. The ends of the heat pipe, are reinforced from...     

A heat transferring or transmitting apparatus characterized by an evaporator containing a semiconductive or heat generating device and being disposed below a condensor unit and connected thereto by two conduits substantially vertically arranged therebetween, such that a coolant gas is passed upwardly...     

A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains elongated openings therein extending towards the...     

A system wherein a plurality of thermoelectric modules are thermally connected by heat pipes forming a cascaded structure that is capable of operating effectively and reliably with large temperature gradients, the heat pipes providing relatively low temperature gradient interfaces between the thermoelectric...     

In a liquid cooled thyristor column in which disk thyristors are stacked along with heat sinks with the disk thyristors and heat sinks held elastically together each heat sink is equipped with a laterally projecting heat pipe having its free end emersed in a coolant line, with the free ends of the heat...     

A semiconductor device is carried in compressive contact relationship between two vapor cooling containers put in fluid communication with condensers disposed above them through connection tubes respectively. A condensible liquid coolant fully fills each container, and the associated connection tube...     

A streamlined electronic-component-containing pod is mounted on the exterior of a military aircraft in subjection to the airflow past the aircraft during flight. An evaporator in the pod is close coupled thermally to the electronic components for cooling. The outer skin of the pod acts as a condenser...     

An improved vapor-cooled terminal-bushing is provided for increased current-carrying capacity, such as 6,000 amperes, for example, in an oil-type circuit-breaker, being provided with a "dry" body portion, utilizing resinous materials, such as epoxy-resin formulations, for example. Preferably, the body...     

The present invention comprises a rotor for an electric motor which rotor is provided with cooling arrangement in the form of a heat pipe extending axially within the rotor. The heat pipe has an evaporating portion within the body of the rotor and a condensing portion extending out with the body of the...     

A printed circuit board package for high density packaging of electronic circuit components is disclosed. The circuit components are cooled by a liquid cooled, cold plate with a compliant mat interface. The interface is made of a heat conductive, electrically insulative compliant structure, such that...     

This panel-type radiator for extracting heat from liquid flowing therethrough comprises a panel through which the liquid flows in a downward direction. The panel is made from two dished metal sheets having aligned vertically-extending embossments welded together along a vertically-extending zone and...     

An ebullient cooling system employs a thyratron or other power device which is located within a hollow of a housing. The housing contains a liquid which completely surrounds the device. The liquid is of a type which provides high electrical insulation and which boils at a temperature compatible with...     

The invention concerns a shelter device in the form of a box-like structure for the protection of electronic apparatuses against atmospheric agents. The shelter comprises walls of insulating material forming a thermal resistance, as well as an amount of material(s) having a high specific heat operating...     

A cold bank tank in an enclosure for storing thermal energy in a very small area contains a liquid heat transfer fluid and has a top which is the top of the enclosure and a spaced opposite bottom. An inside heat exchanger extends from the bottom of the tank in the enclosure for cooling warm air in the...     

A closed two phase liquid-vapor heat transfer device is provided which is independent of orientation and requires no wick. A micro helix containment vessel contains liquid to form a coolant vapor phase. Heat input at the evaporator section results in evaporation of the liquid at the liquid-vapor interface....     

An electron discharge tube evaporation cooling system in which part of a tube to be cooled is immersed in coolant in a boiler (15), the cooling system further comprising a condenser (18) for vapor generated in the boiler (15), and a coolant reservoir (11). The flow of vapor from the boiler (15) to the...     

Thermal dissipation problems characteristic of micropackaging applications in integrated circuits can be eliminated by the use of a semiconductor heat pipe package. Additionally, the heat pipe package as herein disclosed can be employed for the creation of substantially constant temperature surfaces....     

A vapor-cooled power transformer characterized by a transformer within a sealed housing, and means for applying ultrasonic vibrations to a dielectric liquid within the housing in order to vaporize the fluid and to apply it to the exposed surfaces of the transformer.

A mechanically assisted evaporator layer for use in both open and evacuated heat transfer systems, in which a pump and spray nozzle operate in conjunction with a sintered metal evaporator layer to reduce the temperature difference required to transfer heat across the thickness of the surface and to permit...     

A heat exchanger including a heat-dissipating element, a heat-receiving element and a circulating means for circulating a liquid in a closed cycle between the heat-dissipating element and the heat-receiving element. The circulating means includes an air/liquid siphon consisting of one of the elements,...     

A silicon substrate adapted for large scale integrated electronic circuits upon a lower surface has its upper surface coated with a highly porous heat sink film. The film is composed of a porous metal, preferably aluminum, formed by vacuum deposition (evaporation or sputtering) at a high pressure of...     

A rotary electric motor of a sealed type comprising a heat pipe in a rotor shaft and a plurality of air vents in a stator. In the operation of this motor, a rotor mounted on the rotor shaft is cooled by the heat pipe and simultaneously, the stator is cooled directly by the air flowing therethrough.

The two preferred and illustrated embodiments set forth downhole tool cooling systems. In a downhole oil well tool exposed to extremely high working temperatures, a cooling system is provided for the printed circuit boards and various electronic components thereon. In one embodiment, the cooling system...     

A transformer cooling structure characterized by a plurality of coolant fluid cooling panels extending outwardly from the transformer tank wall, and the panels being comprised of a pair of sheet-like sides formed to a corrugated configuration through which the fluid flows in heat exchange with ambient...     

The PC-boards are contained in sealed enclosures, and serially effective heat pipe systems conduct thermal energy from the respective sources of development (e.g., power transmitters) to the top and from there to a heat pump system. Stacking such units and operating the heat transfer partially in parallel...     

A heat releasing device comprises an extruded aluminum main body including a horizontal wall for attaching heat emitting elements thereto and a vertical wall formed with a large number of gouged fins on at least one of its opposite sides, and a heat pipe portion provided on or in the vertical wall. The...     

A heat pipe formed by metal deposition, on porous metal wick parts, which forms the enclosure and provides both a metallurgical bond to the wick and a hermetic seal.

A closed-loop heat transfer system comprises a heat pipe (10) and an external liquid-phase pump (11). The heat pipe (10) includes an evaporator (12) and a condenser (13) connected by a conduit (14). The evaporator (12) is a hollow structure having an interior surface defining an evaporation region in...     

A system for cooling a substrate via a continuous enclosed path within the substrate that passes closely adjacent heat producing components on or adjacent the substrate. According to a first embodiment, heat, where located on the substrate, is transmitted to a heat sink in the vapor phase by a change...     

The boiling cooling apparatus is comprised of a heat generating device which is completely immersed in a liquid coolant which partially fills a sealed container. At least one vertically extending passage is provided through the heat producing device whereby ascending bubbles formed in the passage by...     

A heat releasing device comprises an extruded aluminum main body including a horizontal wall for attaching heat emitting elements thereto and a vertical wall formed with a large number of gouged fins on at least one of its opposite sides, and a heat pipe portion provided on or in the vertical wall. The...     

A heat exchanger assembly for cooling the interior of a closed cabinet containing electronic components or the like includes a finned heat pipe core. The core has a plurality of spaced heat pipes positioned in at least two rows and a plurality of spaced fins which are provided with colinear apertures...     

In an apparatus wherein heat generating bodies such as integrated circuit chips are cooled by utilizing boiling of a liquid; a heat transfer apparatus characterized in that a heat conductive member which has a plurality of layers of cavity groups and apertures for bringing the cavity groups into communication...     

A dual mode heat exchanger 10 for cooling airborne electronics 12 through a cold plate 14. The heat exchanger either radiates heat to air through radiator fins 18 or absorbs heat by evaporative cooling. A liquid coolant contained in grooves 16 of the cold plate 14 boils at a preselected temperature and...     

To provide a cooling arrangement utilizing liquid coolant, and capable of operating at or near the freeze point of the liquid coolant so as not to freeze solid, a steady state heat exchanger is provided. The heat exchanger includes a liquid impingement plate having a liquid carrying channel therein,...     

Relatively small diameter heat pipes having generally horizontally arranged evaporator sections and inclined or vertically oriented condenser sections are provided with a flow separator for conducting working fluid vapor from the evaporator section to the condenser section and liquid working fluid is...     

The boiling cooling apparatus is comprised of a heat generating device which is completely immersed in a liquid coolant which partially fills a sealed container. At least one vertically extending passage is provided through the heat producing device whereby ascending bubbles formed in the passage by...     

Well bore logging apparatus including electrical components cooling apparatus. An operating chamber and a heat sink chamber are incorporated. A heat transfer chamber encloses both operating chamber and heat sink chamber. A wicking material fills a portion of the transfer chamber to be in thermal connection...     

A diode assembly includes a base plate in which a plurality of diodes are mounted in a circle, uniformly spaced. A heat pipe within the diode circle extends perpendicular to the plate and is surrounded by radiating, heat-dissipating fins extending radially outwardly to support rings. Insulators mounted...     

A boiling refrigerant-type cooling system for cooling an electric apparatus includes a refrigerant containing chamber in which the electric apparatus is disposed, a condensing chamber, and a vapor reservoir all in flow communication with each other. A cooling chamber open to the atmosphere adjoins the...     

A heat exchanger assembly for cooling the interior of a closed cabinet containing electronic components or the like includes a finned heat pipe core. The core has a plurality of spaced substantially parallel heat bodies as well as a plurality of spaced fins which are provided with colinear apertures...     

A heat releasing device comprising a heat transmitting block having a heat source attaching portion and a bore extending therethrough, a looped heat pipe having at least one pair of straight tubular portions, the first of the straight tubular portions being intimately fitted in the bore, and a multiplicity...     

A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module. The heat conduit includes a condensation area...     

A cast iron or steel heat transfer member is used in network protectors to provide optimum cooling while avoiding prior corrosion problems.

A heat-pipe device for transferring heat generated by a heat-generating element, having at least one heat-pipe body which is an extrudate of plate-like configuration made of aluminum or its alloy, the heat-pipe body including a planer-structure portion which has on one side thereof a flat face to which...     

An integral heat pipe for transferring heat away from electronic components is disclosed. The heat pipe comprises at least one electronic component mounted to a substrate. A condenser cap is fastened over the substrate to define a sealed pipe chamber around the electronic component. The top of the condenser...     

An apparatus for circulating cooling fluid through a plurality of cooling modules for cooling electronic components, such as IC'S or LSI'S. A plurality of cooling fluid supply systems are independently connected to the respective cooling modules. Each of the supply systems includes a fluid line connected...     

A thermal management system for a spacecraft includes a plurality of T-shaped pallets each having a radiator panel and mounting panel. The radiator panels are connected end to end to enclose an interior space including the mounting panels. The mounting panels have electronic equipment mounted thereon....     

An omni-directional heat pipe for cooling a local heat area, such as in electronic circuitry, including a sealed cavity for containment of multiple capillary-like coolant paths which may be inter-connectable or otherwise disposed in order to facilitate wide angle heat transfer dispersion. Said sealed...     

Option-equippable apparatus such as a computer that is not fully equipped with option circuit boards (14) has filler boards (15,16) connected to free board slots (13). In one embodiment, the filler boards (15) simulate the effect of circuit boards on airflow and act to evenly distribute the cooling air...     

A cooling mechanism for power semiconductors comprises a metallic evaporator (1) filled with a heat-carrying fluid and designed to be brought into close contact with one face of a smeiconductor (2); at least one condenser constituted by a tube (5) whose inner wall bears a capillary structure, and which...     

A cooling system for use in an enclosure housing heat-emitting electrical and/or electronic apparatus comprises, in combination, a fan unit and, separately formed with respect to the fan unit, a cooling unit 12. The fan unit includes electrically driven fans mounted with their axes vertical and the cooling...     

A packaging and cooling structure for integrated circuit chips in electronic equipment is provided in which the chips are resiliently mounted on wafers which are centrally located in chambers within a housing. A liquid coolant is forced through orifices to spray the coolant on the wafers behind the chips...     

A printed circuit board assembly is disclosed which includes a number of rigid printed circuit boards connected by a number of flexible printed circuit panels. Integrated circuits and similar components are mounted on the rigid printed circuit boards. The components are interconnected by printed circuit...     

An expandable and contractable sealed environment is provided by a rigid frame member and a pair of deformable heat transfer elements fixed to the frame member. The frame member is located between two heat-producing electronic assemblies. A coolant agent is pumped into the sealed environment to flex...     

A cabinet for housing electronic equipment includes an integrally formed cooling system which includes an air conduct running longitudianlly between the opposite end walls of the cabinet in an upper portion thereof. A cooling fin assembly is fitted into a lower wall of the air duct so as to have its...     

The electronic package (10) is comprised of a plurality of support plates (12-24), each of which has a plenum therein and preferably webs extending into the plenum for fluid flow control and heat transfer. A wafer (104) is mounted in a recess (100) in the support plate (12) so that fluid in the plenum...     

Flexible cooling paths are connected to semiconductor elements which are heated members. A cooling apparatus comprises cooling blocks connected to cooling blocks, coolant flow paths through which the coolant flows, coolant branching mechanisms provided in the coolant flow paths and connecting mechanism...     

A thermal transfer means comprising a flexible bag or pouch filled with a chemically inert, electrically nonconductive, nonflammable, essentially gas-free, thermally stable, thermally conductive, body of liquid comprising fluorochemical liquid. Said bag is fabricated from a flexible, durable plastic...     

A heat exchanger including a plate of heat conductive material having a first major face and second major face. An array of a plurality of integral heat transfer elements projecting from the first face and a fan to cause a flow of a heat transfer fluid past the heat transfer elements thereby transferring...     

A multi-chip module or a like device having a sealed structure for being cooled with a liquid cooling medium, and in which the semiconductor integrated circuit chips or the chip carriers mounting the chips are individually cooled with the forced convection cooling using a cooling liquid. The cooling...     

A plurality of semiconductor elements are mounted on a substrate. A plurality of cooling elements are inserted between a thermal conductor for conducting a heat generated from the semiconductor elements to a cooling medium and the semiconductor elements. A channel for conducting the generated heat of...     

A lamp cooling system is provided in which a liquid-cooled lamp is connected to a flow circuit conduit for cooling liquid circulating through the lamp. A liquid/air heat exchanger is positioned in the flow circuit conduit to cool liquid flowing in the flow circuit conduit by heat exchange with air.

An LSI temperature controlling system has closed LSI cooling water circuit, and a refrigeration circuit including a motor-driven refrigerant compressor, a first heat exchanger for exchanging the heat of the LSI cooling water and the refrigerant and a second heat exchanger for exchanging the heats of...     

The invention is a cooling system for electronic circuit modules such as a printed circuit boards. In detail the invention comprises a housing assembly having first and second opposed plates. The opposed plates include a plurality of spaced guide rails thereon. A plurality of electronic modules each...     

A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling...     

A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip. A dielectric coolant, such as liquid nitrogen...     

A cooling system for cooling electronic components mounted in a cabinet of a computer includes an air circulation device mounted in the cabinet. The air circulation device draws cool, outside air through an air inlet in the cabinet and circulates the cool air over the electronic components. After passing...     

A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation....     

A cooling fluid is circulated around a closed circuit including a heat source, for example by a pump. The system includes a heat exchanger for removing heat from the fluid. Valve means are provided which are operated by changes in volume of the cooling fluid to cause the fluid to bypass the heat exchanger...     

A compact acoustic refrigeration system actively cools components, e.g., electrical circuits (22), in a borehole environment. An acoustic engine (12, 14) includes first thermodynamic elements (12) for generating a standing acoustic wave in a selected medium. An acoustic refrigerator (16, 26, 28) includes...     

Disclosed is a conduction cooling type multistage collector for use in an electron beam tube in which a plurality of collector electrodes are electrically insulated with insulators, wherein one collector electrode is brazed on the inner surface of one ring-shaped insulator and a metal cylinder is brazed...     

A cooling rack is provided for cooperating with a chassis, the chassis having both electrical and fluid connectors, the fluid connectors being interconnected by a manifold for distributing cooling fluid to and from the rack, the rack having a cooling support including at least one electrical component...     

A micro heat pipe, formed in a semiconductor substrate, carries heat from a region of heat flux in the substrate to a region of lower heat flux. The micro heat pipe is formed by cutting a groove into the substrate opposite a site where devices have been formed or are to be formed. Vapor deposited layers...     

A buffer solution being used in an electrophoresis cell as both an electrode buffer and a cooling medium is circulated through a refrigeration system external to the cell without risk of arcing or other danger despite the electrified state of the buffer solution. The refrigeration system contains a circulating...     

A closed-cycle expansion-valve impingement cooling system provides cooling for electronic components that have a high-density heat flux. Coolant passes from a compressor to a supply heat exchanger where its temperature is reduced and from there to an impingement plenum of a cooling chamber. Expanded...     

A control system for controlling cooling equipment comprising a refrigerant circuit for cooling water by heat exchange, a plurality of cooling modules in a backup relationship with an adjusting apparatus for adjusting the cooling capability of the refrigerant circuit and a controller controlling the...     

A cooling apparatus as one embodiment of a heat transfer apparatus of the present invention comprises a closing loop pipe line means enclosing a predetermined amount of liquid heating medium inside, a heat receiving section receiving heat from an object to be cooled, and transferring heat to said heating...     

A radiating device 10 has a rectangular parallelepiped block 11. Block 11 includes a first group of holes 12 to 19 and a second group of holes 20 to 23 causing convection of air. Passages for circulating gas and liquid serving as a heat pipe, are formed to extend in X, Y and Z directions in block 11....     

A gas-insulated transformer comprises a transformer body and a radiator both filled with SF.sub.6 gas. The radiator comprises a gas introducing header, a gas discharging header, a plurality of radiation panels, and couplers for coupling the gas introducing header, gas discharging header and radiation...     

A miniature heat exchanger. A small housing provides a heat exchanger surface, contains a spray shower head. A cooling fluid enters through a base plate and is sprayed through holes in the shower head on to the underside of the cooling surface. The heated coolant exists through exit holes in the nozzle...     

The present invention is a closed-loop cooling system in combination with a thermoelectric heat exchanger whereby heat exchange liquid provides quick and efficient heat exchange with a thermoelectric device and is heated or cooled by passing the heat exchange liquid through an air core heat exchanger...     

A cooling structure cools integrated circuits (I.C.'s) by circulating a liquid coolant in the vicinity of the I.C.'s and causing the heat generated by the I.C.'s to be conducted to the liquid coolant. The cooling structure includes a wiring substrate, an I.C. mounted on the wiring substrate, storage...     

An assembly for mounting circuit cards having high power electrical and optical alloy MCM chip devices installed thereon. The assembly has a central vertical coolant supply pipe extending from a pump to a heat exchanger unit through a refrigeration unit separated from the heat exchanger unit by circuit...     

A heat pipe includes an air tight elongated container and a heat carrier sealed in the container. The elongated container has a flat bottom wall serving as a heat receiving portion and a top wall serving as a heat dissipating portion. A liquid passage for moving condensed heat carrier in a slanted direction...     

A cooling system for a plurality of circuit boards, each circuit board having a substantially planar thermally conductive thermal sink having longitudinal sides and being in thermal contact with a plurality of electronic components dissipating heat, includes a heat exchanger for delivering heat to a...     

An arrangement for cooling electronic components in a system. Several circuit boards are connected to a backplane electrically and through heat pipes, which are mounted on the boards and provide connections between the electronic components on the board and the cooling system. The circuit boards, including...     

A flexible heat transfer device includes a closed flexible envelopment which is made of a plastic film and which has a receiving space provided therein. The envelopment has a first section and a second section spaced from the first section. The receiving space of the envelopment contains a heat transfer...     

A cooling apparatus for an electronic system, includes a coolant tank, main pumps, heat exchangers, a common supplementary pump, and supplementary check valves. The coolant tank temporarily stores a coolant. The main pumps are respectively arranged in a plurality of heat generators in the electronic...     

A plug-in circuit card assembly for mounting high power electrical and optical components. The apparatus comprises a printed wiring circuit mounting high power electrical and optical components and connectors with conducting paths interconnecting the components and ones of the components with the connectors....     

Pin-finned heat sink having good heat dissipating characteristics satisfy the following inequality: ##EQU1## where d is the diameter of pins, c is the distance between pins, and h is the height of pins. This heat sink can increase the level of integration of semiconductor devices with which it is used.

A heat pipe includes a pipe, a bottom plate, and a cap plate. The cap plate includes a vertical aperture extending so as to be penetrated vertically and a horizontal aperture extending from the side surface to the vertical aperture. A sleeve having a through hole extending vertically is attached to the...     

A radiating device 10 includes a radiating plate 11 having a flat bottom surface 12 serving as a heat receiving surface, a top surface 13, and a column 14 . Column 14 includes a protruding base portion 15 integrally connected to top surface 13 of radiating plate 11 and extending so as to protrude upward,...     

A housing for accommodation of a plurality of electric circuitry packages, a method for assembling the housing, a cooling arrangement, and an electrical connection arrangement are disclosed. The housing can accommodate a plurality of packages, supply the packages with power, connect them electrically,...     

A wafer cooling device includes a wafer chuck; a heat exchanger having an internal structure for circulation of cooling water therethrough; and a flexible heat pipe for providing heat communication between the wafer chuck and the heat exchanger.

A Cryogenic Cooling System generally comprises a portable Dewar and a charging station for the Dewar. In the preferred embodiment, a HTSC device, such as a MRI coil, is contained in the Dewar which uses liquid nitrogen as a cryogenic coolant. The Dewar includes a reservoir for holding cryogenic fluid,...     

A heat transfer apparatus is disclosed. The heat transfer apparatus includes a heat pipe containing heat transfer liquid. Disposed in the heat pipe is a centrifugal rotor assembly having fixed magnets on the rotor blades. A magnetic field is generated by a magnetic coil assembly that surrounds the heat...     

A cooling device formed in a thermally conductive substrate having at least one microchannel of dimensions that induce capillary action and a surface in thermal contact with a heated region. The microchannel has a longitudinal opening oriented away from the heated region and is supplied with liquid coolant...     

A two-phase liquid cooling system has a container structure that has at least one wall with sufficient flexibility that the wall expands as the coolant vapor expands thereby maintaining the internal container pressure substantially the same as the ambient environmental pressure. Coolant boiling overshoot...