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Inventors
Goodson, Kenneth E.
Chen, Chuan-Hua
Huber, David E.
Jiang, Linan
Kenny, Thomas W.
Koo, Jae-Mo
Laser, Daniel J.
Mikkelsen, James C.
Santiago, Juan G.
Wang, Evelyn Ning-Yi
Zeng, Shulin
Zhang, Lian
Application #
053859
Filed
Jan-19-2002
Published
Sep-13-2005
Current US Class
165/104.21 165/104.33 165/185 165/80.4 174/15.1 174/15.2 257/714 361/699 361/700
International Classes
F28F 007/00
Field of Search
165/804 165/104.21 165/104.33 165/185 361/699 361/700 257/714-716 174/152
Assignee
The Board of Trustees of the Leland Stanford Junior University (Stanford, CA)
Examiners
Mckinnon; Terrell L.
Attorney, Agent or Firm
Womble Carlyle, Sandridge & Rice, PLLC
US Patent References
| 4009423 |
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Liquid cooled heat... |
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| 4067237 |
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Novel heat pipe co... |
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| 4120019 |
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Apparatus for cooli... |
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| 4151548 |
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Cooling container f... |
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| 4312012 |
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Nucleate boiling su... |
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| 4392362 |
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Micro miniature ref... |
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| 4450472 |
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Method and means... |
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| 4516632 |
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Microchannel cross... |
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| 4561632 |
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Solenoid valve |
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| 4567505 |
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Heat sink and meth... |
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| 4573067 |
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Method and means... |
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| 4638854 |
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Heat pipe assembly |
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| 4675783 |
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Heat pipe heat sink... |
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| 4697427 |
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Forced flow evapor... |
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| 4758926 |
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Fluid-cooled integr... |
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| 4829432 |
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Apparatus for shiel... |
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| 4858093 |
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Integrated magneti... |
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| 4868712 |
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Three dimensional... |
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| 4894709 |
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Forced-convection,... |
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| 4908112 |
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Silicon semiconduc... |
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| 4938280 |
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Liquid-cooled, flat... |
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| 4951740 |
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Bellows heat pipe f... |
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| 4975825 |
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Stacked power conv... |
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| 5010292 |
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Voltage regulator w... |
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| 5016138 |
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Three dimensional... |
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| 5057908 |
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High power semico... |
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| 5070040 |
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Method and appar... |
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| 5083194 |
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Air jet impingemen... |
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| 5096388 |
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Microfabricated pu... |
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| 5099311 |
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Microchannel heat... |
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| 5099910 |
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Microchannel heat... |
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| 5125451 |
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Heat exchanger for... |
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| 5131233 |
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Gas-liquid forced t... |
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| 5131859 |
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Quick disconnect sy... |
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| 5144531 |
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Electronic apparat... |
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| 5162974 |
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Heat sink assembly... |
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| 5199165 |
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Heat pipe-electrical... |
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| 5203401 |
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Wet micro-channel... |
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| 5216580 |
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Optimized integral... |
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| 5218515 |
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Microchannel cooli... |
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| 5219278 |
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Micropump with i... |
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| 5229915 |
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Power semiconduct... |
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| 5230564 |
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Temperature monit... |
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| 5232047 |
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Heat exchanger for... |
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| 5239200 |
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Apparatus for cooli... |
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| 5263251 |
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Method of fabricati... |
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| 5274920 |
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Method of fabricati... |
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| 5281026 |
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Printed circuit boar... |
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| 5309319 |
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Integral cooling sys... |
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| 5311397 |
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Computer with mod... |
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| 5313099 |
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Heat sink assembly... |
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| 5317805 |
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Method of making... |
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| 5325265 |
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High performance... |
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| 5336062 |
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Microminiaturized... |
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| 5339214 |
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Multiple-fan micro... |
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| 5365749 |
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Computer compone... |
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| 5383340 |
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Two-phase cooling... |
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| 5427174 |
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Method and appar... |
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| 5436793 |
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Apparatus for cont... |
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| 5459099 |
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Method of fabricati... |
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| 5461541 |
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Enclosure for an el... |
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| 5471850 |
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Refrigeration syste... |
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| 5504650 |
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Heat sink for coolin... |
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| 5504924 |
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Cooling system of e... |
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| 5508234 |
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Microcavity structur... |
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| 5508908 |
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Motor control unit w... |
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| 5513070 |
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Dissipation of heat t... |
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| 5514832 |
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Microcavity structur... |
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| 5514906 |
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Apparatus for cooli... |
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| 5544412 |
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Method for couplin... |
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| 5560423 |
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Flexible heat pipe f... |
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| 5565705 |
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Electronic module f... |
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| 5575929 |
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Method for making... |
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| 5579827 |
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Heat sink arrange... |
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| 5598320 |
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Rotable and slideb... |
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| 5608262 |
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Packaging multi-c... |
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| 5621635 |
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Integrated circuit p... |
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| 5641400 |
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Use of temperature... |
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| 5646828 |
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Thin packaging of... |
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| 5692558 |
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Microchannel cooli... |
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| 5696405 |
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Microelectronic pa... |
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| 5703536 |
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Liquid cooling syst... |
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| 5704416 |
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Two phase compon... |
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| 5727618 |
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Modular microcha... |
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| 5759014 |
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Micropump |
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| 5763951 |
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Non-mechanical m... |
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| 5774779 |
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Multi-channel struc... |
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| 5801442 |
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Microchannel cooli... |
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| 5835345 |
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Cooler for removin... |
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| 5836750 |
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Electrostatically act... |
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| 5858188 |
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Acrylic microchan... |
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| 5863708 |
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Partitioned microel... |
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| 5869894 |
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RF IC package |
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| 5870823 |
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Method of forming... |
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| 5880071 |
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Electropipettor and... |
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| 5880524 |
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Heat pipe lid for el... |
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| 5901037 |
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Closed loop liquid... |
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| 5901040 |
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Heat sink and Fara... |
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| 5940240 |
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Constant velocity se... |
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| 5942093 |
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Electro-osmotically... |
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| 5965001 |
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Variable control of... |
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| 5965813 |
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Integrated flow sens... |
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| 5978220 |
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Liquid cooling devi... |
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| 5997713 |
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Silicon etching pro... |
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| 5998240 |
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Method of extractin... |
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| 6007309 |
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Micromachined pe... |
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| 6010316 |
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Acoustic micropump |
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| 6013164 |
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Electokinetic high... |
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| 6019165 |
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Heat exchange ap... |
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| 6019882 |
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Electrokinetic high... |
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| 6025208 |
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Method of making... |
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| 6034425 |
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Flat multiple-chip... |
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| 6034872 |
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Cooling computer s... |
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| 6052287 |
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Silicon ball grid ar... |
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| 6054034 |
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Acrylic microchan... |
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| 6068752 |
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Microfluidic device... |
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| 6090251 |
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Microfabricated str... |
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| 6096656 |
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Formation of micro... |
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| 6100541 |
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Microfluidic device... |
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| 6101715 |
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Microcooling devic... |
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| 6121682 |
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Multi-chip package |
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| 6127726 |
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Cavity down plastic... |
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| 6129145 |
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Heat dissipator incl... |
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| 6133631 |
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Semiconductor pac... |
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| 6137693 |
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High-frequency ele... |
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| 6146103 |
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Micromachined m... |
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| 6154363 |
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Electronic device c... |
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| 6154370 |
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Recessed flip-chip... |
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| 6171067 |
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Micropump |
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| 6174675 |
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Electrical current f... |
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| 6176962 |
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Methods for fabrica... |
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| 6186660 |
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Microfluidic system... |
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| 6191945 |
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Cold plate arrange... |
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| 6201302 |
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Semiconductor pac... |
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| 6204562 |
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Wafer-level chip sc... |
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| 6210986 |
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Microfluidic chann... |
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| 6215193 |
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Multichip modules... |
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| 6216343 |
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Method of making... |
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| 6221226 |
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Methods and syste... |
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| 6227809 |
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Method for making... |
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| 6234240 |
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Fanless cooling syst... |
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| 6238538 |
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Controlled fluid tra... |
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| 6268660 |
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Silicon packaging... |
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| 6277257 |
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Electrokinetic high... |
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| 6278190 |
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Semiconductor dev... |
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| 6287440 |
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Method for eliminat... |
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| 6297551 |
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Integrated circuit p... |
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| 6301109 |
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Isothermal heat sin... |
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| 6313992 |
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Method and appar... |
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| 6321791 |
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Multi-layer microfl... |
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| 6322753 |
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Integrated microflu... |
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| 6324058 |
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Heat-dissipating ap... |
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| 6335566 |
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Semiconductor dev... |
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| 6344682 |
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Semiconductor dev... |
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| 6351384 |
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Device and method... |
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| 6415860 |
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Crossflow micro he... |
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| 6437981 |
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Thermally enhanc... |
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| 6457515 |
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Two-layered micro... |
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| 6572830 |
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Integrated multilay... |
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| 6631077 |
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Heat spreader with... |
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Referenced by:
View Backward References
Other References
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