This subclass is indented under the class definition. Apparatus having means to positively force at least two
layers out of bonded relationship one to the other.
(1)
Note. The devices must apply a separating force to the parts.
The mere destruction of a bond by heat or solvent treatment is
not sufficient for this subclass, being provided for in the classes that
detail the operation, per se.
(2)
Note. Where a blade or sharp tool is used acting along the
plane of the bond to force or wedge the laminae apart, the blade
must be free-floating to follow the plane of weakness. A device
having a rigidly fixed blade, set for a given thickness of cut is
provided for in Class 83, Cutting.
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