Fluid supply apparatus

6178995
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Inventors

Ohmi, Tadahiro
Kagazume, Tetu
Sugiyama, Kazuhiko
Dohi, Ryousuke
Minami, Yukio
Nishino, Kouji
Kawata, Kouji
Ikeda, Nobukazu
Yamaji, Michio

Application #

355872

Filed

Aug-5-1999

Published

Jan-30-2001

Current US Class

137/486
137/487.5

International Classes

G05D 007/06

Field of Search

137/486 137/487.5

Assignee

Fujikin Incorporated (Osaka, JP); Tokyo Electron Ltd. (Tokyo, JP); Tadahiro Ohmi (Miyagi, JP)

Examiners

Michalsky; Gerald A.

Attorney, Agent or Firm

Griffin & Szipl, P.C.

US Patent References

5669408   Pressure type flow r...
5816285   Pressure type flow r...

Referenced by:

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Citation

Cite This Patent

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Abstract
A fluid feeding apparatus includes parallel flow passages connected at their downstream side, each parallel passage including a pressure flow controller (C) for regulating the flow of fluid and a fluid changeover valve (D) for opening and closing the passage on the downstream side of the pressure flow controller. A fluid feeding control unit (B) controls the pressure flow controllers and changeover valves so that when a changeover valve is closed a control valve (1) upstream of the changeover valve is also closed to prevent a pressure buildup at the changeover valve. In addition to the control valve (1), each pressure flow controller includes an orifice (5) downstream from the control valve, a pressure detector (3) for sensing pressure (P.sub.1) in the passage at a point between the control valve and the orifice, and a calculation control unit (6) for producing a control signal Qy for controlling the drive (2) for the control valve. The calculation control unit first calculates a flow rate signal Qc=KP.sub.1, where K is a constant and P.sub.1 is the pressure sensed by the pressure detector. The calculation control unit then calculates Qy as the difference between a set point or flow rate specifying signal Qs and the calculated value Qc. Thus, the flow rate on the downstream side of the orifice is controlled by regulating the pressure P.sub.1 on the upstream side of the orifice via the control valve. The fluid feeding apparatus avoids transient overshooting at the start of fluid feeding and at fluid changeover time and is suitable for use in semiconductor manufacturing facilities and other gas supply systems where high precision is required.
 
Claims
What is claimed is:

1. A fluid feeding apparatus comprising:

a fluid passage having a pressure flow controller therein for regulating fluid flow rate therethrough;

a fluid changeover valve, disposed in said fluid passage in a downstream direction from said pressure flow controller, for selectively opening and closing said fluid passage;

said pressure flow controller including,

an orifice,

a control valve disposed on an upstream side of said orifice, said orifice being disposed in said fluid passage in an upstream direction from said fluid changeover valve,

a pressure detector disposed between said control valve and said orifice, and,

a calculation control unit for producing a control signal Qy for controlling said control valve, said calculation control unit calculating said control signal according to the equation Qy=Qc-Qs, where Qc is a flow rate signal and Qs is a flow rate specifying signal, said calculation control unit calculating said flow rate signal Qc according to the equation Qc=KP1, where K is a constant, and P1 is a pressure detected by said pressure detector; and,



Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an improvement of an apparatus for feeding various kinds of fluids such as gas for use in the manufacture of semiconductors, chemicals, precision machine parts, and the like. More particularly, this invention relates to a fluid feeding apparatus which permits high precision control of the flow rate of fluid at the times of starting to feed a fluid and of switching fluids from one kind to another.

2. Description of the Prior Art

Fluid feeding apparatuses requiring control with high precision of the flow rate are used in semiconductor manufacturing facilities and chemical production plants. Most of those apparatuses are equipped with so-called mass flow controllers.

FIG. 8 shows an apparatus for feeding fluid (gas) for use in a high purity moisture generator in semiconductor manufacturing facilities. It is designed so that H.sub.2 and O.sub.2 are fed to a reactor 51 from a gas feeding apparatus 50 at specific flow rates and are radicalized with a platinum catalyst and allowed to react with each other in a non-combustion state to generate moisture gas (water vapor). The moisture gas thus generated in the reactor 51 is then supplied to an oxidizing furnace 52.
 
  A fluid regulator including, in a housing, a nozzle flapper mechanism, a diaphragm displaceable by the nozzle back pressure of the nozzle flapper mechanism,...  A fluid-switchable flow rate control system that permits free changing of the full scale flow rate and which can control a plurality of kinds of fluids...