External connection to housing

An article such as a plastic credit card contains concealed identifying information. The information is in the form of a series of binary information bits and it is stored in an electronic serial memory. The memory is on an integrated circuit chip imbedded in the credit card with electrical connections...     

A circuit board is provided with a plurality of groups of connectors, so disposed and arranged in respect to each other that each group is capable of receiving a chip carrier. A fluid conduit, carrying a coolant, extends through each group so that when the contacts of a chip carrier are assembled to...     

An improved chip carrier of thin dieletric deformed into a dish configuration provided with flexible mounting flanges on which are plated or bonded solderable conductive traces and paths together with plated or bonded heat sinks which may be referenced to ground potential, and which provides structural...     

A coding technique and circuit implementation for reducing the number of electrical contacts to a memory device, which memory device is configured as part of a monolithic structure. Memory selection is achieved by changing at least one characteristic of a clock signal, such as pulse width. A read or...     

A connector assembly comprises a lead frame mounting one or more semiconductor chips, having optically active areas, a fiber guide and optical fibers held in optical communication with the chips. The fiber guide is formed of a plate like member having two or more reference points, in order to precisely...     

A thin disc-like device for attachment to the base end of an incandescent light bulb to provide an auxiliary voltage reducing circuit interfaced between the central base contacts of the light bulb and its cooperating lampholder for purposes of extending the rated life of the light bulb. The device is...     

An integrated semiconductor package containing circuitry capable of supporting separately packaged semiconductors to achieve greater circuit board density and to allow separate semiconductor packages which cooperate with the supporting semiconductor package and die to be interchanged. The supporting...     

A high power semiconductor package having a unitary extruded metal housing which serves as an efficient thermal heat sink and which includes integral constituents for retaining an encapsulating material. The extruded housing has open sides and an open top to facilitate installation of the semiconductor...     

To protect a weld connection between an external conductor (11, 12) and a projecting pin (5, 6) of an electronic component, the base plate (2) of the electronic component has a tubular element (8) attached thereto, for example formed with an insertion slit (9) through which the externally accessible...     

In a dimensionally precise electronic component mount, electrical terminals are affixed with dimensional precision to a rigid insulative base. An electronic component is affixed in precisely indexed abutment to the rigid insulative base. A protruding wire of the electronic component is conductively affixed...     

A module for a semiconductor chip is disclosed. The module includes a heat sink with a flat surface to which the back face of the semiconductor chip is directly bonded. The exposed face of the chip has an array of power, ground and signal contacts. A plurality of alternating power and ground bus bars...     

An improved electrical connection between a leadless chip carrier and one or more circuits on a printed circuit board is disclosed. A solder fillet connects a metallization layer on the groove face of the carrier to the printed circuit. The solder fillet is fused to only a portion of the full length...     

An integrated circuit package for high density applications comprises spring contacts on one face thereof for its removable mounting onto a printed circuit board, the mounting being accomplished by means of a frame assembly and the package being automatically fabricable in a continuous flow process involving...     

A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts...     

A cylindrical diode is terminated to a contact and mounted in a cylindrical countersunk recess of a dielectric insert mounted in a metal connector shell, the connector having an arrangement for grounding the contact to said shell. The diode has a first electrode defining a top face generally coplanar...     

A semiconductor device which is designed to have a plurality of electrodes on an upper surface of a lid portion has a recessed portion which is provided on this upper surface of the lid portion. The recessed portion will accept an electrode after it is bent from its initial position to a position such...     

Semiconductor module, including a metallic bottom plate, at least two semiconductor bodies disposed on the bottom plate, at least one of the semiconductor bodies being a thyristor tablet having at least one control electrode, a frame having an inner surface, the frame being connected to the bottom plate...     

A semiconductor package of the small outlined integrated circuit type is disclosed having an angled glass sealing surface. Another aspect of the invention relates to a shield disposed in a semiconductor package to prevent alpha radiation emitted from the sealing glass or other packaging components from...     

A flat thin package for semiconductor die has rigid leads extending perpendicularly from its length which can be plugged into a printed circuit board socket. The package has a low profile above the surface of the printed circuit board.

A semiconductor chip carrier having a ceramic base with a cavity for carrying a semiconductor chip and a cap for sealing the chip within the cavity. The base has a metallization pattern covering the chip contacts on the base and an outer contact castellated ring providing for the flow of excess solder...     

A device for increasing the density of integrated circuit chips on a printed circuit board. A plurality of integrated circuits are packaged within chip carriers and stacked, on one top of the other, on a printed circuit board. Each of the input/output data terminals, power and ground terminals of the...     

An assembly is disclosed for releasably mounting a semiconductor package with respect to a rigid carrier, in a predetermined alignment with the carrier to protect the package leads and position the leads for electrical testing. Two substantially identical dielectric frames are positioned on opposite...     

Holes are formed in a major surface of a hybrid IC insulating substrate mounting an optical semiconductor element, and terminal pins of a package are connected and fixed to the substrate while head portions of the terminal pins are inserted in the corresponding holes. Since the terminal pins do not protrude...     

In one embodiment, a microwave package is constructed from a block of aluminum having layers of material clad to opposite sides thereof having a lower coefficient of thermal expansion than the aluminum block. A receptacle is formed by milling away a portion of one of the layers and a large portion of...     

A semiconductor device is provided with an electrically conductive cap having a sufficiently thick edge portion for preventing warpage due to the hardening of an encapsulating resin. Since the edge portion of the conductive cap is formed into the shape of a frame, and its thickness is made large, the...     

An electronic circuit packaging module includes a lower substrate, an upper cooling unit, and a frame disposed between the substrate and cooling unit. The substrate carries a plurality of integrated circuit chips with lead-outs to a plurality of downwardly protruding dimpled contact points disposed about...     

Disclosed is a semiconductor chip package comprising a plurality of programmable pads located on a surface of the package, each pad being adapted for interconnection with a semiconductor chip. The package also includes a plurality of signal connectors located on a surface of the package. In addition...     

A solid state image pick-up device is provided in which a photoelectric conversion element is configured so that a light reception portion of the photoelectric conversion element is covered with a member of light transmissible glass. A frame, used as a package, is filled with synthetic resin by a potting...     

In a photoelectric converter module, a chip carrier which carries a photoelectric converter chip on a side surface thereof is fixed on a metal base of the module via a metal member by means of welding, and the photoelectric converter chip is connected electrically with a pre-amplifier via a conductor...     

A package for a device comprises a header having a substantially flat upper surface. An insulating disk is affixed to the upper surface of the header for having the device mounted thereon. A barrel having upper and lower portions of respectively greater and smaller diameters, and having a step between...     

Disclosed is a means for packaging a plurality of semiconductor die into one component. Present designs comprise multiple singulated unpackaged die which have been probed, but not rigorously tested for complete functionality and adherence to required operating specifications. The yields of present designs...     

A semiconductor chip package comprising at least one semiconductor chip disposed in a package and a plurality of first and second pins extending from the package, which first pins are electrically connected to the at least one semiconductor chip and are adapted to conduct signals between the at least...     

Hermetic package designs for HDMI substrates are discussed. The designs for a hermetically sealed, perimeter-leaded package may have the following features: a) a flat monolithic dielectric base, the base having a flat upper surface and a flat lower surface; b) a zone on the upper surface, in which zone...     

An overcurrent-limiting type semiconductor device comprising a transistor chip fixed on the bottom of a package, the package being constructed of a bottom plate, side walls, and a lid, terminal conductors connected to electrodes of the transistor chip and drawn through the lid of the package to the outside...     

A stackable surface mount electronic component assembly 100 allowing for the stacking of electronic components 108, and 112 is disclosed. The stackable surface mount electronic component assembly 100 includes electronic component carriers 102, and 114, each having an electronic component 108, and 112...     

A chip carrier socket comprises a one piece insulating housing with a rectangular frame-like body portion surrounding a rectangular base-plate. Rows of contacts are force-fitted in cavities in the body portion with contact spring portions extending inwardly for electrical connection to leads on respective...     

In a large-area controlled-turn-off high-power semiconductor component containing a multiplicity of finely structured individual components, a semiconductor device (12) is formed by a multiplicity of small-area semiconductor chips (7) which are accommodated alongside one another in a common housing (13)...     

A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the...     

A semiconductor device (10) includes test-only leads (20) and operational leads (18). Operational leads (18) provide access to portions of a semiconductor die (12) needed for device operation. Test-only leads (20) provide access to portions of die (12) which are not needed for device operation, but which...     

A multichip integrated circuit package comprises a substrate having a flat upper surface to which is affixed one or more integrated circuit chips having interconnection pads. A polymer encapsulant completely surrounds the integrated circuit chips. The encapsulant is provided with a plurality of via openings...     

A semiconductor package is described which has external connection points (pins, pads, etc.) which may be configured from outside of the package. In one embodiment, this is accomplished with programming holes which pass through and form contact surfaces with various conductors within the package. Conductive...     

Leadframes from a TAB tape having die attached are curved so that the free ends of the leads curve back over themselves. A separator, attached to the die, defines a pocket for receiving the free end of the leads. The die and separator form a subassembly which is combined with other subassemblies to make...     

External electrode terminal parts and a plastic terminal supporting body are individually formed, and the terminal parts are inserted into through holes of the terminal supporting body, thereby completing a terminal holder. Each of the terminal parts has a stopper portion at a predetermined position...     

A semiconductor wafer level package used to encapsulate a device fabricated on a semiconductor substrate wafer before dicing of the wafer into individual chips. A cap wafer is bonded to the semiconductor substrate wafer using a pre-patterned frit glass as a bonding agent such that the device is hermetically...     

The invention relates to an integrated circuit memory device 1 in which connecting terminals 11b for transmitting signals between itself and an external device are provided on a bottom surface of a coin-shaped case 10 containing an integrated circuit memory chip 12. A changeover switch 20 for changing...     

A semiconductor element module is adapted to be mounted on a main body by insertion in a predetermined direction. The semiconductor element module includes a substrate having first and second surfaces, one or a plurality of semiconductor elements mounted on at least one of the first and second surfaces...     

A semiconductor-device package includes: a printed circuit board which has a chip-accommodating hole in its center portion and which has external connection terminals formed on its one side and a flexible substrate which has a supporting film having a central hole coaxial with the chip-accommodating...     

A ceramic feedthrough for a package for an electronic device provides a plurality of electrical connections through an opening in the package. A method of making the feedthrough and of packaging the electronic device includes electrically conductive paths that are formed from a metal paste applied between...     

Disclosed is a stacked die carrier assembly and method for packaging and interconnecting silicon chips such as memory chips. The carrier is constructed from a metalized substrate onto which the chip is attached. The chip is wire bonded to the conductor pattern on the substrate. Each conductor then is...     

A charge-coupled device image sensor has a base of resin having a mount area on an upper surface with a charge-coupled device chip being connected to the mount area, leads mounted on the base and connected to the charge-coupled device chip through bonding wires, and a cover of resin joined to the upper...     

A surface mount semiconductor package having a novel lead configuration which facilitates a higher packing density than presently available semiconductor packages. More particularly, the package includes a plurality of electrical leads each having a laterally outwardly extending portion, a downwardly...     

A leadframe is provided for making semiconductor devices. The leadframe comprises at least one island arranged centrally widthwise of the leadframe and having four corner portions, four bridging legs radially extending from the respective corner portions of the island, the bridging legs being integral...     

In a semiconductor power module, a surge voltage on a power source line of a semiconductor element for electric power control is restrained. A power source terminal PS(NP) is comprised of power source terminals PS(P) and PS(N) which are arranged adjacent each other through an insulative sheet INS1 made...     

A three dimensional logic cube comprises a base plate having two vertically mounted backplanes attached thereto. A plurality of horizontally stacked substrates are coupled by connectors to the backplanes, with enough clearance between adjacent substrates to ensure heat dissipating air or fluid flow between...     

A hybrid integrated circuit of the invention is formed of an insulation substrate, a thick film conductor printed and sintered on the insulation substrate, and a terminal conductor and a circuit part connected to the first thick film conductor. A first electrically conductive metal plate is brazed on...     

A ball grid array (BGA) package which contains an integrated circuit die that is directly mounted to either a heat sink or a printed circuit board. In one embodiment, the package has an integrated circuit with surface pads that are coupled to a flexible circuit board. Solder balls are attached to the...     

A semiconductor chip package comprising at least one semiconductor chip disposed in a package and a plurality of first and second pins extending from the package, which first pins are electrically connected to the at least one semiconductor chip and are adapted to conduct signals between the at least...     

A leadframe for use in mounting and interconnecting an integrated circuit. A first or base metal layer of the leadframe comprises at least one of brass or other copper alloy. A second, conducting layer atop the base layer comprises at least one of aluminum or an aluminum alloy. A third, upper layer on...     

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the...     

An electronic component which is employed in the frequency range in the microwave band or above is mounted on a circuit board. The circuit board comprises two linear transmission line members, a ground electrode, and an electric insulating substrate provided with the transmission line members and the...     

An IC carrier comprises a carrier body having a wiring sheet with a pattern of leads on an upper surface thereof and an IC body on which the wiring sheet is superimposed. Each of the leads on the wiring sheet are provided with a first contact pad and a second contact pad. Each of contact pads is subjected...     

A hybrid integrated circuit includes a plurality of metal plates supporting circuit elements and connectable directly to external power/output lines. The direct connection eliminates the need for solder terminals, allowing for reduced size and cost with increased reliability and lifespan. The metal plates...     

A bipolar device having a level difference between the contact area level of a base electrode and a base region in a silicon substrate, and the contact area level of an emitter electrode and an emitter region in the silicon substrate in the range of 0.03 .mu.m to 0.1 .mu.m by removing undesirable impurities...     

A film integrated circuit includes at least one row of connection terminals to be connected in metallized holes of a given diameter formed in a printed circuit board. The connection terminals have a widened portion, one side with a pocket-like clamping contour to be connected to pads of a film IC, and...     

A package for housing a semiconductor element is provided which allows effective prevention of adverse effects of power supply noise on the semiconductor, and normal and steady operation of the semiconductor element over a long period of time. The package for housing a semiconductor element is assembled...     

A multi-terminal surface-mounted electronic device with contact surfaces placed entirely or partly around several sides, as well as to a method for manufacturing it. The parts according to the invention allow assembly on a circuit board such as p.c.b. and foil in forward, backward and sideward direction....     

Semiconductor hybrid components, especially linear infrared detectors produced by hybridization. A main substrate has integrated thereon active elements which cannot be produced on a silicon substrate. The substrate is made, for example, of AsGa, InP, HgCdTe or PbTe. Several silicon chips are mounted...     

An impact load effected on the single body of an acceleration sensor device is absorbed with a relatively simple construction, thereby protecting a semiconductor sensor element provided in the sensor. The acceleration sensor device comprises a semiconductor sensor element 2 which can sense an acceleration...     

A semiconductor package is described which is constructed from a rectangular tape film, a wiring pattern formed on the tape film constituted by wiring composed of a conductive material, a semiconductor chip electrically connected to one end of the wiring pattern, and holes formed on the other end of...     

A transaction processing system and method includes a transaction interface for conveying transactions; a memory for storing the transactions in a queue; and a processor. The processor includes an identifier generator for generating an identifier for each transaction in the queue; and a transaction controller...     

In order to reduce the chip size of a semiconductor device as well as to separate noises between at least two types of pads having different functions, at least one Vcc and at least one Vss are provided on opposite edges of a package (101) so that output pins or I/O pins are arranged therebetween and...     

An integrated circuit probing method and apparatus therefor. The apparatus includes a main system controller coupled to a network interface, graphic user interface, and equipment interface. A high speed bus connects the main system controller to a group of subsystems. The subsystems includes subsystems...     

A method for manufacturing an electronic component by seal-molding with resin a die pad mounted by an electronic element thereon and loads of input-and-output terminals which are supported by a lead frame having an outer frame and removing such sealed electronic component with mold materials from the...     

Solder bumps (3) are provided with reinforcing resins (4), which are formed by applying resins thickly at the roots and gradually thinly toward the tips so as to surround the bumps. Thus, long-time reliability of solder connection parts is improved and repairability is simultaneously improved.

A semiconductor package of the present invention includes a paddle layer having a metal wiring pattern formed therein, semiconductor chips bonded on at least one surface of the paddle layer. A plurality of wires electrically connecting a plurality of chip pads formed on the semiconductor chips with the...     

In order to reduce the chip size of a semiconductor device as well as to separate noises between at least two types of pads having different functions, power supply pins and ground pins are provided on opposite edges of a package with input address pins being arranged therebetween and output data pins...     

In order to provide a semiconductor device of high reliability which suppresses a degradation of the fatigue strength of solder connection portions and warping of a tape-type wiring substrate forming the cause of the inferior contact between solder bumps and an external substrate, and a method of manufacturing...     

An electrical device (400) includes a substrate (300) having solder pads (215, 220) formed thereon and a self aligning electrical component (200) mounted to the solder pads (215, 220). The self aligning electrical component (200) includes a body having a cylindrical shape, a first terminal (205) formed...     

A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the...     

There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at...     

A "lead-under-paddle" (LUP) leadframe employs a thermally conductive paddle/heat sink, the top side of which is adhered to an I.C. die with a thermally conductive adhesive. The inner portions of an I.C. package's leads extend along and are attached to the bottom side of the paddle with a thermally conductive...     

A semiconductor device package includes a carrier substrate molded of a non-laminate material. A plurality of conductive metal balls are molded within the non-laminate carrier substrate to provide an electrical connection between opposite sides of the substrate. The conductive metal balls provide conductive...     

The present invention is a method and apparatus for programming a stack of segments wherein each segment includes a plurality of die which are interconnected through metal interconnects patterned on the surface of each segment. Once the segments are arranged into a stack, the stack is connected to external...     

A semiconductor with dedicated wire bond sites that are routed and via'd only to a top surface of a semiconductor package to flush mount pads where they are probed during debug, thus reducing the overall inductance and capacitance of the path from the wire bond site to the debug probing site over conventional...     

A chip type electronic part of the present invention includes tapered notches rising from the bottom of the body of a molding. With this configuration, the electronic part achieves a high volume efficiency and a great bonding strength to a circuit board after soldering.

A condensed memory matrix is fabricated by conductively connecting the attachment bumps of a substrate with the attachment bumps of a wafer of DRAM chips and physically bonding the juxtaposed surfaces of the substrate and the wafer with a dielectric curable resin. An array of heat fins is bonded to the...     

A semiconductor package and a method of fabrication are provided. The package includes multiple semiconductor dice contained in a housing, and mounted on edge to a substrate. Each die includes a polymer interconnect which attaches to a face of the die, and wraps around an end (or side) of the die. The...     

A lead frame having a plurality of metallic conductors with each conductor having a coined or stamped region near its proximal end but spaced therefrom to provide pressure points to assure substantial even joining of the conductor to semiconductor chip via an insulative adhesive medium. The lead frame,...     

A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer;...     

A semiconductor package is provided that includes a semiconductor chip that is mounted on a mount board with metal bumps interposed therebetween so as to create a gap. A structure is provided in the gap for limiting the flow of a resin, which is deposited along side the semiconductor chip, around the...     

A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such...     

A semiconductor device is provided which can improve a heat radiation characteristic of the package, and also can solve an uniform characteristic of ball sizes when a projection electrode such as soldering balls is formed by way of the electrolytic plating method. A semiconductor device is comprised...     

An integrated circuit package which contains an integrated circuit. The internal integrated circuit is coupled to external lands located on a first outer surface of the package by a plurality of vias. The vias extend through the package from the first outer surface to an opposite second outer surface....     

The present invention relates to semiconductor devices packaged using overcasting. The overcast devices of the present invention incorporate encapsulative materials, such as ultraviolet-curing material, which are cast in open stencils at approximately ambient pressure (and potentially at approximately...     

A bottom lead package is capable of increasing a memory capacity for a mounting position on a mother board by stacking several semiconductor packages such that exposed surfaces of leads on upper and lower surfaces of the package are aligned. The package includes a semiconductor chip, a plurality of lower...     

Disclosed herein is a semiconductor package having a wire bonding structure. The semiconductor package includes a packaging substrate having a multi-stepped opening extending to a selected depth from the surface of the substrate. The area of the opening decreases as the level from the upper surface decreases....     

A parallel dual switch module that is characterized by improved mechanical and electrical packaging efficiency and low cost. The module includes a common terminal defined by a first stamped elongate metal plate insert molded into the module housing, and positive and negative terminals defined by second...     

The integrated semiconductor circuit has a semiconductor chip, a housing that accommodates the semiconductor chip, and a lead frame that connects the contact areas of the semiconductor chip and forms external terminals of the integrated semiconductor circuit. The conductors of the lead frame are sunk,...     

The goal of the present invention is in the manufacture of BGA type semiconductor IC packages, to obviate the processing step in which the through-holes in the insulating substrate are filled with solder paste, and to reduce the thermal stress at the bonding portion of the solder balls. This goal is...     

In a lead frame, leads are formed on a surface of protective insulation film having a device hole. Protruding electrodes (solder balls) are formed on the surface of the leads opposite the surface closer to the protective insulation film. A reinforcement plate is also formed on the rear surface of the...