Feedthrough

Relates to printed circuit boards which are devoid of electrical discontinuities likely to arise in the production of two-sided circuit boards having plated-through-holes and solder fillets therein for improving the electrical interconnections. Research disclosed that the cause of these discontinuities...     

An electrical device assembly wherein a plurality of electrical components or conductors having opposing terminal ends are disposed within apertures in a flat dielectric substrate, at least one of the terminal ends of selected components or conductors extending beyond a flat surface of the substrate....     

A microcomputer board has a first section with fixedly mounted microcomputer components interconnected by a printed circuit, and a second section having unconnected wire-wrap terminals adapted to receive DIP components. Wire-wrap terminals are provided for interconnecting the printed circuit with the...     

This invention generally relates to prefabricated electric wire assemblies comprising an interconnected network of separately formed, integral, shaped conductors, and to materials and techniques used in the manufacture of such assemblies.

The present invention provides an apertured circuit board having self-locking terminals which partially cover at least some of the apertures. The terminals, which are integral extensions of the circuit pathways, are adhesively anchored to the circuit board at the terminal peripheries and are covered...     

A printed circuit board, preferably, including a feed-through capacitor having outer and inner conductors separated by a dielectric through which the outer and inner conductors capacitively couple. An electrical energy carrying printed circuit line which is to be filtered is connected to the capacitor...     

Disclosed is a method of fabricating bi-level circuits which include metallization of via holes (14 and 15) in insulating subustrates (10). A thick film metal paste (13) is prepared which according to one embodiment comprises copper, glass frit and an organic vehicle including a low molecular weight...     

The present invention provides an apertured circuit board having self-locking terminals which partially cover at least some of the apertures. The terminals, which are integral extensions of the circuit pathways, each include a pair of inwardly disposed generally L-shaped fingers. The terminals are adhesively...     

Multilayer printed wiring boards are conventionally laminated using epoxy adhesives. When the boards are drilled, a residual smear often remains within the drilled holes. This smear prevents proper through plating of the holes and the layers are left without some of the intended interconnections. In...     

A circuit board apparatus of the type which has multiple connection regions that can each make a solder connection to the lead of a component and a weld connection to a wire, which minimizes the possibility of damage to the region during wire welding and which facilitates repair. Each connection region...     

A multilayer printed circuit board is disclosed having appropriate ground and voltage planes. The multilayer printed circuit board includes a mounting plane, a plurality of dielectric sheets stacked upon the mounting plane, a plurality of conductive sheets positioned between adjacent dielectric sheets,...     

An improved printed circuit board for use in electrical and electronic appliances includes an electronic part for a jumper having crossover wiring and disposed on an electrically insulative substrate or base plate for the printed circuit board provided with a cross pattern of conductors in which sets...     

The present invention provides an apertured circuit board having self-locking terminals which partially cover at least some of the apertures. The terminals, which are integral extensions of the circuit pathways, each include a pair of inwardly disposed generally L-shaped fingers. The terminals are adhesively...     

A printed board comprising a plurality of through holes formed therein and located on intersecting points of an X-Y orthogonal basic grid, and an oblique conductor pattern, wherein conductors are formed along channels arranged in accordance with a principle that one conductor passes between adjacent...     

A thick film multilayer substrate using a green ceramic sheet is constructed such that at least three conductor layers and at least two dielectric layers are alternately arranged in turn on the green ceramic sheet substrate, a power supply line being formed in the second conductor layer and thus interposed...     

A three layer printed circuit board comprises upper and lower layers which provide terminal locations for connection to pins of electrical connectors or electronic components which are to be connected in parallel by conductor tracks of the circuit board. In order to achieve an even distribution of conductor...     

An electronic circuit interconnection system provides high density mounting on ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable,...     

A panel board has a first voltage layer sandwiched between two ground layers at a close spacing to produce a large distributed capacitance; the two ground layers are connected by plated-through conductive holes spaced regularly across the board; a second (exposed) voltage layer is connected by regularly...     

An improved process for making a printed circuit board of the type comprising solder-rooted pads and a solder-coated internal wall of each hole in the circuit board. The new process comprises the step of masking over a dry film, e.g. an alkaline ink film, after copper plating and before solder plating....     

A multi-chip carrier array in which the individual carriers are defined by two perpendicular sets of parallel scribe lines which bisect the major axes of a plurality of equally-spaced oblong perforations. At the point of intersection of any two perpendicular scribe lines, the major axes of two such perforations...     

A multilayered ceramic circuit board, formed by sintering together a plurality of unit ceramic circuit boards, wherein each unit ceramic circuit board includes a ceramic layer, a patterned electrically conductive layer and through hole conductors formed in the ceramic layer for connecting the patterned...     

A multilayer ceramic circuit board and method of forming such circuit board are disclosed. The wiring pattern for the multilayer ceramic circuit board includes multiple-layer portions, the multiple-layer portions including first and second electrically conductive layers, respectively a tungsten layer...     

A compact and dense hybrid integrated circuit device which can be encapsulated by transfer molding can be manufactured by forming through holes in a ceramic or glass substrate, which through holes have a diameter of less than 0.2 mm, preferably less than 0.1 mm, a thin film circuit element being formed...     

A system for measuring the amount and direction of misregistration of each layer of a panel from which multilayer printed circuit boards are separated. The system utilizes a conductor pattern having a conductive trace positioned on each layer of the panel. Each conductive trace includes two trace portions...     

A via (64, 66, 68) comprises a conductor (45, 46, 48) having a first surface (58, 60, 62) and at least one second surface (49) that forms at least one edge (52) with the first surface (58, 60, 62). A first insulator layer (33) is formed on the first surface and defines a first area (58, 60, 62) on the...     

A filter arrangement is described for filtering a plurality of conductors which are guided from a space comprising electromagnetic fields through a separating wall to a device located in a shielded space, in which the separating wall (24) is formed by a multilayer printed circuit card (86). The printed...     

Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This...     

Circuit boards with imbedded traces, which may form grooves or trenches are provided. The traces may be at least partially filled with a reflowable conductive material such as solder. The grooves may be selectively furnished with solder while other regions may be empty or void of solder. In assembling...     

A rotary digital contacting encoder (FIG. 1) including a base (5), comprising - a base epoxy disk (501) with three external, pre-molded in place, connector pins (P.sub.1 -P.sub.3) on its exterior side extending through it, and a conductive layer in the form of two concentric layer rings (502 & 503; FIG....     

A backplane having a layer of insulation material, a plurality of lead segments arranged in line and spaced from one another on a first surface of the insulation material, a plurality of cooperating lead segments arranged in line and spaced from one another on a second surface of the insulation material,...     

Circuit boards with imbedded traces, which may form grooves or trenches are provided. The traces may be at least partially filled with a reflowable conductive material such as solder. The grooves may be selectively furnished with solder while other regions may be empty or void of solder. In assembling...     

Via patterns (16, 18) are applied to a first interlevel oxide layer (58) down to a metal layer (52) to define a plurality of orifices. These orifices (61, 63) are filled with tungsten by selective chemical vapor deposition. A first level conductor pattern (10, 12, 14) is then used to etch away the first...     

A technique for forming metal interconnect signal lines provides for planarization of an interlevel dielectric layer. A thin layer of material which can function as an etch stop, such as a metal oxide, is formed over the interlevel dielectric. An alignment process is used to pattern and define openings...     

A high-frequency circuit package including a conductive substrate, and upper and lower shielding cases which come tightly into contact with opposite surfaces of the conductive substrate to define therein upper and lower shielding chambers. High-frequency circuits are mounted on the surfaces of the conductive...     

A semiconductor device of a multilayer interconnection structure which includes a plurality of insulating layers and a plurality of metal interconnection layers. The uppermost metal interconnection layer is formed in a hall in the uppermost interlayer insulating layer. The uppermost interconnection layer...     

A process for electroplating a nonconducting substrate comprising formation of a catalytic metal sulfide on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The catalytic metal chalcogenide is preferably palladium sulfide.

A multilayer connector is provided, in which at least a first wiring layer is formed, a second wiring layer is formed on the first wiring layer through an interlevel insulator, a contact hole is bored through the interlevel insulator at its portion in which the first and second wiring layers are connected,...     

An electronic device having high density wiring formed in a multi-level layer structure which has a plurality of conductors distributed with high density. Each conductor is formed to have a sectional area which is determined on the basis of length thereof such that ones of the plurality of conductors...     

The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noises between the conductor poles. The conductor poles are received within holes in an insulating substrate. The insulating substrate has a laminated, multi-layer ceramic substrate structure...     

An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a second layer. The improvement comprises having at least one of the vias with a cross-section such that the...     

A portable and connectable chip-based electronic system has one or more chips integrated into a package. The electronic component obtained is mounted, in a first embodiment, on the upper surface of metal contacts. A lower surface has metal contacts that constitute the connector of the system. Each of...     

A laminated groundplane structure for shielding electrical equipment such as printed circuit boards has a conductive sheet sandwiched between a soft foam layer and a rigid foam layer. A connection pin coupled to the printed circuit board or the like pierces the soft foam layer to engage in the conductive...     

A low cost Surface Mount Carrier (SMC) for carrying integrated circuit chips mounted thereon. The carrier, or interposer, is a thin-small single layer or, a multi-layer deck of printed circuit board (FR-4) material with at least one direct chip attach (DCA) site for mounting a semiconductor chip. The...     

A structure and method for forming contact vias in integrated circuits. An interconnect layer is formed on an underlying layer in an integrated circuit. A buffer region is then formed adjacent to the interconnect layer, followed by forming an insulating layer over the integrated circuit. Preferably,...     

Polyetherimide-metal laminates are formed by etching the surfaces of a polyetherimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.

A multilayer circuit card is disclosed that interconnects multichip modules to each other electrically, and simultaneously acts to dissipate otherwise destructive thermal energy. The circuit card is comprised by an aluminum nitride core and two opposed low temperature co-fired ceramic laminates, all...     

A multi-layer interposer in which the X-Y engineering change wiring pattern in the interposer terminates in a pattern of pads on the upper surface of the interposer around the periphery of the chip. In order to make an engineering change, a jumper wire connect pads on adjacent interposers mounted on...     

An electrical circuit has a substrate and a surface mount capacitor having a connector pad at each end. The substrate has two separate contact pads that are both soldered to the same connector pad on the capacitor. Two further contact pads on the substrate are soldered to the other connector pad on the...     

A process for making metallized vias in diamond substrates is disclosed. The process involves laser-drilling a plurality of holes in a CVD diamond substrate and depositing tungsten, or a similar refractory metal, in the holes by low pressure CVD to provide substantially void-free metallized vias. Diamond...     

An electronic device includes a flat flexible dielectric substrate which is less than 0.050 inch thick and has a generally round hole of a given diameter. A ductile conductive film is deposited on the substrate in an area at least about the hole. A generally round terminal pin is inserted into the hole...     

An electrical interconnection board (e.g., a backplane) in which connection positions are spaced along one dimension of the board. Each connection position includes holes for making electrical connections. Layers of the board each have a pattern of conductive path segments connecting holes at each connection...     

An improved surface mount package and method of making such a package is provided. A conventional surface mount package is modified by fabricating a U-shaped via around the lead via to form a quasi-coaxial transmission line through the insulating substrate. This permits the electrical impedance in the...     

A stepped via is formed in a circuit board. Large holes are punched in a predetermined pattern in two insulating sheets and small holes are punched in the same pattern in another insulating sheet. The holes are dimensioned so that their diameters are larger than the thicknesses of their respective sheets....     

A transmission line structure including a central signal conductor stack of elongated conductive strips separated from each other by contiguous dielectric layers of a unitized multilayer circuit structure, a first ground conductor stack of elongated conductive strips separated from each other by contiguous...     

An electrical interconnection medium having first and second overlying interconnection layers, each interconnection layer including parallel conductors, the conductors of the first and second interconnection layers being oriented orthogonal to each other, the conductors being interconnected so as to...     

A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at least one wiring...     

A low-profile printed circuit board has discrete components mounted within openings provided in a rigid substrate forming art of the board. The components are mounted with leads soldered to mounting pads on the surface of the board, and arranged around the periphery of the openings. The stand-off design...     

An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a second layer. The improvement comprises having at least on of the vias with a cross-section such that the via...     

A connection for mounting an IC die directly to a substrate includes circuit runs deposited on the substrate with bond pad portions having metallization patterns forming ridges and cutout areas. Metal bumps made of gold or other highly conductive malleable material are placed atop the metallization patterns...     

In a mounting board, two through-holes are formed which are used for inserting both ends of a supporting member for a vibrator. On a surface of the mounting board, a ground conductor pattern is formed. In the ground conductor pattern, two portions of arcs, where the ground conductor pattern is removed,...     

An electrical interconnect structure for connecting a substrate to the next level of packaging or to a semiconductor device. The interconnect structure includes at least two layers of polymeric material, one of the layers having a capture pad and the second of the layers having a bonding pad electrically...     

The invention provides a packaging technique implementing an electronic circuit, comprising several individually packaged sub-circuits, on a circuit board within the footprint of a single package. The embodiment of the present invention is particularly advantageous when implementing application specific...     

A method of making a multilayered circuit board wherein at least two layered subassemblies, each comprising a dielectric layer and at least one conductive layer therein, are bonded together. Each subassembly includes a through-hole extending therethrough which is aligned with a respective through-hole...     

A system and method for reducing coupled noise in a multilayer circuit board having signal lines disposed within a set of wiring channels on each of a plurality of the layers; and, a vias disposed within a set of via channels. According to a first embodiment, otherwise unused vias traverse the layers...     

The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so...     

A TAB tape having multiple metallic conductors arranged on the surface of a base film with substantially square device holes is formed with designed areas of stress refief formed by one or more slits and/or arrays of holes which extend outward from the corners or sides of the device holes, such that...     

An electronic device comprises a three dimensional electronic element holder of a non-conducting material having at least one cavity in a first surface and a plurality of lead through holes with inlet guides extending from the cavity to a second surface having a circuit thereon, an electronic element...     

An electronic device (11) has on one surface a first ball grid array (12) having a first area. The first ball grid array is bonded to a first intermediate interconnection member (13) having on an opposite surface a second ball grid array having the same number of solder balls (23) as the first array,...     

Low dielectric absorption component connection points are created on a printed circuit board by cutting apertures in the board surrounding the points, leaving only narrow stems still connecting the resulting island to the board.

An interposer (100) for connecting two or more printed circuit boards (302, 304) is a circuit-carrying substrate (102) with two or more solder pads (104, 109)on each of two sides (105, 107). Each of the solder pads are connected to an electrically conductive via (106) in the substrate, providing electrical...     

A connector is disclosed for electrically coupling groups of contact points formed on a first and second electronic circuit chip. The connector is constructed by applying a layer of dielectric material to a planar electrically conductive base, lithographically printing a pattern onto the dielectric material,...     

A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips attached to the substrate. A plurality of head pads are located on...     

An array of closely spaced uniform solder balls located on a substrate of an electronic module and electrically connected with terminals of circuitry, to connect the module to a complementary array of terminals as on a printed circuit board. The array is fabricated by preparing an array of terminal pads...     

A multilayer inductor 1 is fabricated, for example, by sandwiching a first magnetic material sheet (21) between a second magnetic material sheet (22) and a third magnetic material sheet (23) and integrating the three layers. The first magnetic material sheet (21) is preferably at least 0.2 mm thick and...     

An improved surface mount package and method of making such a package is provided. A conventional surface mount package is modified by fabricating a U-shaped via around the lead via to form a quasi-coaxial transmission line through the insulating substrate. This permits the electrical impedance in the...     

A multilayer circuit is provided characterized by a multilayer conductor structure. The multilayer conductor structure is composed of at least two conductor layers, with each adjacent layer being separated by a dielectric material in the form of one or more dielectric layers. The multilayer circuit further...     

A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous...     

A printed circuit is provided that is capable of operating at temperatures above 200.degree. C. A printed wiring board has a plating scheme of Tin plating over sulfamate nickel plated over copper. The materials are electroplated in the pattern of the desired circuit. The copper provides a conductive...     

The present invention increases real estate by providing non-annular lands which do not completely encircle the through holes. The non-annular lands are non-annular, that is they do not extend 360.degree. around the through hole. Preferably the non-annular lands contact no more than one side of the through...     

A multi-layer module that has incorporated therein an additional sheet with a heat generating film resistor formed thereon. A temperature responsive controller regulates the film resistor current in order to regulate the temperature at the surface of the module. The invention is applicable to both single...     

A method for forming one or more conductive paths by providing a first pattern of pre-formed conductive elements and a second pattern of preformed conductive elements in a substrate and forming, at a single level, one or more lateral conductive links between selected ones of the first and second conductive...     

An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit...     

High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature....     

An electrical device is provided having a conductive coating or layer chemically grafted to a support substrate to produce a durable, conductive surface permanently attached to the underlying substrate material. The grafted layer can be embodied in an electrical contact, and can also be embodied as electrical...     

A multilayer thin-film wiring board formed by laminating at least three wiring layers including first, second, and third wiring layers together with a dielectric layer. The first wiring layer includes a first pattern having a plurality of first windows arranged with the same pitch both in a lateral direction...     

A method for electrically connecting a surface conductor to an edge conductor on an intersecting side of a non-conductive substrate, includes the steps of forming a through-hole in the substrate, and metallizing the through-hole to form a conductive via. Then, the substrate through the via is cut to...     

A multilevel interconnect structure for use in a semiconductor device includes a lower metal wiring having an aluminum or aluminum alloy film and a high melting point metal or high melting point metal alloy film. An interlayer insulating film is deposited on the lower metal wiring and a via hole is formed...     

Multilayer circuit assemblies are made by stacking circuit panels having contacts on their top surfaces, through conductors extending between top and bottom surfaces and terminals connected to the bottom end of each through conductor. The terminals and contacts are arranged so that when the panels are...     

A cover layer of a flexible printed circuit includes a first hole and a plurality of openings. The first hole has substantially the same diameter as that of a positioning piece of an inspection machine. A distance between the first hole and each of the openings is predetermined. After the cover layer...     

An alignment board for interfacing arrays of infrared detectors to a multi-layer module concerns an insulating board having a multiplicity of conductive vias with insulating sealing plugs and enlarged metallic pads that are attached to the ends of the vias. Preferably, an insulating layer is formed on...     

A printed circuit board for connectors in symmetrical communications and data systems engineering distribution systems, which includes a pair of substantially parallel circuit board tracks on a front face thereof arranged substantially congruently with a pair of substantially parallel circuit board tracks...     

The present invention increases real estate by providing non-annular lands which do not completely encircle the through holes. The non-annular lands are non-annular, that is they do not extend 360.degree. around the through hole. Preferably the non-annular lands contact no more than one side of the through...     

A high-density multilayer printed circuit board is provided such that crosstalk noise between through holes is avoided and wiring efficiency is increased. Power supply through holes which connect to power supply pins of component parts are combined to make room for via holes in certain portions of the...     

A special so called BLOCKADE-Via.TM. apparatus and technique for more efficient circuiting and assembly of electronic components on a multilayer parallel-conductivity "printed-circuit board" employing high-density conductor-pins and solder-ball construction. A BGA(ball-grid array) component may be placed...     

A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability,...     

In a printed circuit board on which a plurality of electronic components are mounted, a first electronic component having the largest number of input and output pins among the electronic components is arranged at or near the center of the printed circuit board. Wiring patterns including a signal line...     

A circuit board manufacturing method for manufacturing a printed circuit board with improved characteristics for machine soldering. The circuit board manufacturing method includes the addition of a polyimide "B" semicured material to a printed circuit board prior to preheating and then machine soldering...     

A film heater and thick-film electrode pads are provided on one main surface of a heat-resistant insulating substrate and are connected by through holes to a metal oxide semiconductor film on the tail surface. Pads are made of a gold alloy such as Au--Pt and connected to leads of Pt--W, etc.

A ball grid array (BGA) integrated circuit package which has a plurality of vias connected to a plurality of solder pads located on a bottom surface of a package substrate. Each via has a portion located within a solder pad to increase the routing space of the substrate, and a portion located outside...     

A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.