Curable composition

4980086
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Inventors

Hiraiwa, Akihiko
Kimura, Kaoru
Sato, Mitsuyoshi

Application #

469674

Filed

Jan-24-1990

Published

Dec-25-1990

Current US Class

252/500
252/503
252/511
252/512
252/513
252/514
252/62.3T
524/157
524/165
524/183
524/377
524/404
524/412
524/415
524/439
524/440
524/441
524/445
524/451

International Classes

H01B 001/06

Field of Search

252/511 252/500 252/502 252/503 252/504 252/512 252/513 252/514 252/516 252/518 252/520 252/521 252/62.3 524/495 524/496 524/401 524/439 524/404 524/444 524/445 524/412 524/415 524/409 524/411 524/414 524/157 524/158 524/165 524/183 524/377 524/378 524/184

Assignee

Toagosei Chemical Industry, Co., Ltd. (Tokyo, JP)

Examiners

Barr; Josephine

Attorney, Agent or Firm

Wyatt, Gerber, Burke and Badie

US Patent References

4378457   Cyanacrylic acid e...

Referenced by:

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Citation

Cite This Patent

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Abstract
A curable composition, in which powder of an organic or inorganic compound is added to and dispersed in a 2-cyanoacrylate and an acidic substance and a basic substance are contained as the stabilizer. In the curable composition of the invention, powder of organic or inorganic compound can be stably dispersed into the composition by the combined use of the acidic substance and the basic substance, thereby providing desired properties with ease while giving excellent storage stability and maintaining the instantaneous curing property of the composition. The curable composition can generally be used as adhesives, coating agents, paints, potting agents, etc.
 
Claims
What is claimed is:

1. A composition comprising a 2-cyanoacrylate ester containing from 10 to 400 parts by weight of the 2-cyanoacrylate of an electroconductive powder or a heat conductive powder; the electroconductive powder being selected from the group consisting of silver, copper, nickel, aluminum, gold, palladium, platinum, ruthenium, graphite, and mixtures thereof; the heat conductive powder being selected from the group consisting of silicon nitride, aluminum nitride, boron nitride, titanium nitride, sialon, silicon carbide, aluminum carbide, boron carbide, titanium carbide, aluminum oxide, glass fibers, boron oxide, aluminum, talc, silica, beryllin, clay, metal powders and mixtures thereof together with an electron acceptor or a coordination complex thereof selected from the group consisting of boron trifluoride and derivatives thereof, sulfonic acids, halogenated aliphatic carboxylic acids, antimony pentafluoride, phosphor hexafluoride, and mixtures thereof and a substantially equimolar amount of an electron donor selected from the group consisting of amines, crown-ethers, polyaklylene glycol and derivatives thereof, fatty acid amides and mixtures thereof.



Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates curable compositions and, more specifically, compositions containing 2-cyanoacrylic acid esters which are main ingredients of 2-cyanoacrylic ester type instant curing adhesives utilized broadly for bonding, repairing and covering of products in various field of industries. Curable composition can be utilized in those fields of industries where such instant adhesives have been used broadly, as well as in beauty parlor or like other service area and further in home uses.

2. Description of Related Art Including Information Disclosed under 1.97-1.99

Upon contact with the moisture in the atmosphere or a trace quantity of water adsorbed to the surface of a material to be coated with adhesives, 2-cyanoacrylic acid esters rapidly polymerize to cure and show excellent adhesive performance under ambient temperature and, accordingly, they have been widely used for instant adhesiveness for the bonding of plastic, rubber, glass and metal.
 
  A copper-type conductive coating composition which comprises: (A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with...  A die-bonding electroconductive paste containing at least one element having the same valence as the valence of a semiconductor element to be die-bonded...