Method for engaging a substrate

4646419
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Inventors

Glessner, Jr., Charles W.
Przydzial, Kazimierz

Application #

852001

Filed

Apr-14-1986

Published

Mar-3-1987

Current US Class

029/271
029/559
269/329
269/52
269/903

International Classes

B23Q 001/00

Field of Search

269/47 269/50-52 269/310 269/74 269/77 269/82 269/70 269/903 269/329 279/1 29/271 29/559

Assignee

AT&T (New York, NY)

Examiners

Watson; Robert C.

Attorney, Agent or Firm

Levy; R. B.

US Patent References

3988815   Apparatus for termi...
4078302   Module board asse...
4516318   Methods of processi...
4555840   Process for position...
4565358   Plate positioning a...

Referenced by:

View Backward References

Other References

General Instrument Corp., Technical Information Bulletin MCA8-MCA81, Slotted Optical Limit Switch.

Citation

Cite This Patent

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Abstract
An apparatus (10) for engaging a printed circuit board (12) positioned in rough alignment therewith comprises an housing (14) having a bore (16) which is partially tapered (20). Loosely mounted within the bore is a sleeve (24) having a tapered portion (30) complementary to the tapered portion (20) of the bore. A pin (36) is spring-biased within the sleeve and extends therefrom beyond the housing for insertion into a tooling hole (76) in the printed circuit board upon movement of the sleeve into the bore in the housing. While the tapered portion (30) on the sleeve remains spaced from the tapered section (20) of the bore, the pin is capable of limited lateral movement about the axis of the bore which virtually eliminates wedging or sticking thereof in the tooling hole. Once the sleeve is fully inserted into the housing, the tapered portion on the sleeve nests with the tapered section of the bore, rigidly locking the pin in place.
 
Claims
What is claimed is:

1. A method of engaging a substrate, having an aperture therein, comprising the steps of:

roughly aligning the aperture in the substrate with a pin capable of limited lateral movement about an axis perpendicular to the plane of the substrate;

imparting a relative motion between the pin and the substrate to locate the pin within the aperture; and

locking the pin against any lateral movement as the pin enters the aperture so that the pin rigidly engages the substrate to hold it in place.

2. The method according to claim 1, further including the step of sensing whether the pin has entered the aperture after relative motion has been imparted between the pin and the substrate.



Description
TECHNICAL FIELD

This invention relates generally to a method and apparatus for engaging a substrate, such as a printed circuit board.

BACKGROUND OF THE INVENTION

Most electronic equipment produced today incorporates one or more printed circuit boards, each having electronic components mounted thereon. The mounting of components on the printed circuit board is usually accomplished automatically by machines constructed for this purpose. Machines for mounting components to printed circuit boards are known in the art and are available from a number of commercial vendors. While the structural details of such machines vary, each typically includes a stage for supporting a printed circuit board thereon in registration with a mechanism for placing components on the circuit board. In practice, the stage carries two or more machanisms for engaging the circuit board to fix the location thereof on the stage a set distance from the component placement mechanism.

In order for a component mounting machine to achieve high circuit board throughput, the mechanisms theron for engaging the circuit board must be capable of rapid and reliable operation. Further, the circuit board engagement mechanisms must be capable of rigidly holding the circuit board in place to avoid shifting thereof during the placement of components thereon. Shifting of the circuit board on the stage can cause misplacement of components. This problem is especially critical when components such as chip carriers are placed with the leads therof in contact with bonding pads on the circuit board. In some instances the spacing between chip carrier leads is as small as 0.025 inches so even very small shifts in the position of the circuit board can result in misalignment of the leads with the bonding pads on the circuit board.
 
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