Substrate support system

5897108
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Inventors

Gordon, Thomas A.
Farlow, Douglas
Farlow, Kathleen

Application #

012977

Filed

Jan-26-1998

Published

Apr-27-1999

Current US Class

269/310
269/50
269/53
269/903

International Classes

B23Q 001/00

Field of Search

269/50 269/53 269/69 269/289

Examiners

Eley; Timothy V.

Attorney, Agent or Firm

Gilliam; Frank D., Duncan; John R.

US Patent References

5692286   Method for shaping...

Referenced by:

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Citation

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Abstract
An apparatus for supporting a substrate such as a printed circuit board (PCB) having various electronic components installed on one side with that side down so that other components can be installed on the opposite side. An assembly of three perforated plates has deformable, typically rubber-like, pins projecting through the perforations. Springs below the assembly bias the pins to a position extending above the plate. When a PCB is laid on the pins with mounted electronic components downward, the components with pres the pins down distances corresponding to component thickness. The pins provide uniform support while working on the opposite side. The center perforated plate of the three is moved to the side, clamping the pins in position, so that the PCB can be removed and replaced with another identical PCB. Different devices for causing the plate clamping action and devices for indexing PCB position and for maintaining the PCB flat and level are also provided.
 
Claims
I claim:

1. Apparatus for supporting a substrate having components installed on one side while installing components on the opposite side, which comprises:

a base plate assembly having a plurality of uniform recesses across a distal surface in a predetermined recess pattern;

an elastically compressible element positioned in at least some of said base plate assembly recesses;

an upper plate assembly comprising:

a first, proximal, plate having a plurality of uniform apertures in a pattern corresponding to said recess pattern;

a second plate overlying said first plate and having a plurality of uniform apertures in a pattern corresponding to said recess pattern;



Description
FIELD OF THE INVENTION

This invention relates to apparatus for supporting a printed circuit board or other substrate typically having components mounted on one side during installation of other components on the opposite side.

BACKGROUND OF THE INVENTION

Printed circuit boards (PCB) have long been used as the base for sophisticated electronic systems. An electrically insulating sheet, originally phenolic impregnated fabrics and now generally fiberglass reinforced resins, is coated with copper cladding and has appropriate patterns etched into the cladding. In years past, most electronic components had wire leads that extended through holes drilled into the cladding pattern and filled with solder to make the required connections. More recently, surface bonding of relatively short leads to the cladding has become common, allowing for thigh speed robotic placement of components.

Today, electronic devices are increasing miniaturized and it has become desirable to mount component on both sides of a PCB. However, there are a number of problems in installing parts on the second side after components have been mounted on the first side. The board cannot be held flat with downwardly projecting components of various sizes and thicknesses mounted on the lower side. This problem is most acute when solder paste is to be printed on the second side. Holding the PCB flat and level under a paste application stencil during solder paste application and then during component placement is very difficult.
 
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