Insulating material

An improved lead assembly adapted for utilization in a semiconductor device having a glass envelope, an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member adapted for extending through and bonding to said glass envelope...     

An article such as a plastic credit card contains concealed identifying information. The information is in the form of a series of binary information bits and it is stored in an electronic serial memory. The memory is on an integrated circuit chip imbedded in the credit card with electrical connections...     

A diode package comprising a compressible dielectric member having an aperture extending through its two major opposite surfaces. An electrically conductive lid is attached on one of the major surfaces of the dielectric member and an electrically conductive base is attached on the other surface. A semiconductor...     

Two surface electrodes are applied to an insulating substrate. The surface electrodes are totally surrounded by a metallic shield which is electrically floating, one of the electrodes being an emitter electrode emitting ac radiation and the other a receiving electrode. A portion of the emitted field...     

A hermetically sealed opto-electrical semiconductor device includes an opto-electrical semiconductor element centrally disposed in an envelope having at least two openings through which light beams are to pass, with flat plates made of a transparent material hermetically covering the respective openings...     

A hybrid package which includes a plastic shell having an integral interior configuration for support of a ceramic substrate and terminal pins, and an encapsulate for rigid retention of the pins and for sealing of the package.

Grammophone record sleeve made of thin material as paper or cardboard and comprising a first section and a second section (13), which sections are connected to each other and intended to store the record (9) in between them and have such a size and shape that they substantially cover the same. The sleeve...     

An optical transducer for determining the angular position of a rotating member relative to a fixed structure, comprises a notched disc 13 rotatable inside a support housing 12, a light emitter 18 and a plurality of photovoltaic cells 19 for detecting the passage of light through the disc notches. The...     

A thick-film multi-layer wiring board in which the thick-film resistor provided in the inner layer is coated with a glass material selected from (a) and (b) below: (a) crystallized glass which is crystallized at 850.degree. C. or above, and (b) amorphous glass having a softening temperature of 750.degree....     

A high frequency, hermetically-sealed, semiconductor device with the capability of being cascade-connected with corresponding devices in an advantageous manner. The device consists of a function element which includes at least one semiconductor and other circuit elements necessary for forming a functional...     

A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge...     

A semiconductor resistor device comprising a resistor region diffused in the surface area of a semiconductor substrate, resistor electrodes respectively ohmically contacted to the surface of the resistor region, and a protective layer coated on the surfaces of the resistor electrodes. A trimming electrode...     

The detector has a pyroelectric element sandwiched between two electrodes which are transparent to the wavelength of radiation to be detected. The pyroelectric element is maintained in spaced relationship to the surface of a header by a pillar and by a lead of a microminiature package which is mounted...     

In an insulated type semiconductor device, a metal member is disposed between an insulating member and a circuit element which includes a semiconductor substrate. The metal member is a composite metal member having at least two different kinds of metal layers bonded to each other. In a preferred embodiment,...     

In a thick film electronic circuit, a plurality of thick film capacitors are deposited on the surface of an insulating substrate. Each capacitor comprises a lower electrode and an upper electrode, which are essentially discrete for each capacitor, while a dielectric layer is deposited unitarily over...     

Conventionally, solid-state imager chips are packaged in ceramic IC packages. In accordance with the invention, unpackaged imager chips are bonded to a light transmissive carrier having an area substantially larger than the area of the imager chip. The light transmissive carrier both firmly supports...     

A power transistor module includes a housing having a frame forming a housing wall and a ceramic plate fastened to the frame forming a housing bottom, structured metallizations disposed on the ceramic plate forming conductor runs and terminal pads, components including at least one power transistor and...     

A microelectronic package for the protection, housing, cooling and interconnection of a microelectronic chip. The package is made of a plurality of ceramic layers, each of which carries a particular electrically conductive pattern and which have interior openings therein so as to provide recesses in...     

A semiconductor power module includes at least two mutually parallel ceramic substrates each having two sides, metallizations disposed on at least one side of each of the substrates, at least one controlled semiconductor power component disposed between each two respective substrates and contacted by...     

A two-terminal field effect transistor device which is capable of operation as an oscillator including a field effect transistor connected in a two-terminal manner. The transistor has the usual drain source and gate electrodes and oscillating instability is provided by means of an inductance means of...     

A brazed leaded package is provided having buried brazed areas thereby eliminating the need of subsequent protective plating of the brazed areas. The package has a heat conductive support which supports a plurality of leads. The distal end of the leads terminate on the top of the heat conductive support...     

An IC card has supporting pieces which penetrate its module to firmly secure it such that the module is prevented from easily popping out of the card or cracking when an external force is applied on the card.

A package for an integrated circuit having conductor patterns which can be connected to an external circuit to connect the integrated circuit to the external circuit. The package includes a dielectric plate which is provided on one end face with a grounding conductor. The conductor patterns are provided...     

A chip carrier with improved packing density, wherein at least one layer of chips is bonded not directly to the substrate, but rather to a heat plate which attaches over the chip cavity and inside the hermetic sealing lid. The heat plate has openings in it to permit attachment of the leads from the chips...     

An assembly is disclosed for releasably mounting a semiconductor package with respect to a rigid carrier, in a predetermined alignment with the carrier to protect the package leads and position the leads for electrical testing. Two substantially identical dielectric frames are positioned on opposite...     

An IC card is provided in which an IC chip is packaged in an opening formed in the IC card. One surface of the IC chip is laid on a film substrate on which external contact terminals are formed, and the other surface is covered with a reinforcing plate, the IC chip. The film substrate and the reinforcing...     

A semiconductor chip module includes semiconductor chips each of which has contacts on its entire front face. A multi-layered organic circuit board having a small dielectric constant is provided for mounting the semiconductor chips. Intermediate ceramic substrates having the same thermal expansion coefficient...     

An optoelectronic assembly for providing bidirectional data transmission between fiber optic means (e.g., a pair of optical fibers) and an electrical circuit member (e.g., a printed circuit board). The assembly includes a two-part housing with first and second receptacle sections designed for accommodating...     

A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit...     

A surface-mountable opto-component capable of flexible use is disclosed. The opto-component has at least one base member that can be automatically assembled with the assistance of an assembly means and contains at least one optical transmitter and/or receiver. The opto-component also has at least one...     

Disclosed is a container package for a semiconductor element, which comprises an insulating vessel having in the interior thereof a space for containing a semiconductor element, which comprises an insulating substrate and a lid member, an external lead terminal for connecting the semiconductor element...     

A semiconductor device assembly is made without a molded package by using a tape having a patterned insulating layer and a conductive layer joined thereto. A semiconductor die is seated on the conductive layer and electrically connected to leads of the patterned conductive layer. A body frame is positioned...     

A semiconductor device includes a circuit pattern of a conductive thin film formed on a ceramic substrate by means of an etching, and an IC chip connected to the etched circuit pattern through a gang-bonding in which respective pads of conduction parts of the circuit pattern and of the IC chip directly...     

A ceramic chip carrier package for integrated circuits is described which provides reduced interlead capacitance. A cavity for the placement of the integrated circuit chip is centrally located on a substrate. The leads of the package are bridged between the cavity and the outer periphery of the substrate....     

In a ceramic joined body wherein a first metalizing layer formed on a surface of an aluminum nitride member on which semiconductor elements are installed and a second metalizing layer formed on a surface of an insulation substrate fireable at low temperatures are joined with each other via a solder used...     

A decoupling apparatus for a microcircuit provides for a custom capacitor to be placed directly on the passivated upper surface of the integrated circuit or alternatively to be placed directly under the integrated circuit. In another alternative, multiple standard chip capacitors are placed directly...     

A semiconductor integrated circuit device includes an internal circuit, input and output signal pads, a power source pad and a plurality of ground pads, a ground pattern, and a power source pattern. The internal circuit is formed in a predetermined region of a semiconductor substrate. The input and output...     

A carrier tape includes an insulating film supporting a plurality of leads. The film has a center device hole for receiving a semiconductor chip therein, a plurality of outer lead holes formed at the periphery of the center device hole, a lead supporting portion positioned between the center device hole...     

A high power, hermetic, low cost, high reliability package for electrical devices is described. The package includes in the preferred embodiment an aluminum nitride substrate, copper thick film ink screen printed and fired upon the substrate, a Kovar ring brazed to the copper thick film ink, a thermally...     

A package for electronic components, especially MMIC components, is disclosed. The package is constructed from layers of ceramic cofired to form an annular piece. Metal pieces are brazed onto the top and bottom of the annular piece to hermetically seal the package. Certain of the ceramic pieces are coated...     

An IC packing device comprises a semiconductor device, a piece of flexible resin film provided with an opening for receiving the semiconductor, wires arranged on the piece of flexible resin film and slits cut into the piece of film from the edges of the opening. The slits cut into the flexible resin...     

A stackable three-dimensional multi-chip module (MCM) is provided whereby each level of chip carrier is interconnected to another level of chip carrier through reflowing of solder balls pre-bumped onto each carrier. Each level of chip carrier, except for the top carrier, has solder balls on both top...     

A ceramic semiconductor package has a ceramic bridge to provide shorter bond wire lengths and other interconnections for the semiconductor device.

A semiconductor device such as a semiconductor memory has a semiconductor chip bonded to an upper surface of a lead frame die pad, a polyimide film bonded to the upper surface of the semiconductor chip, and a quartz plate having a recess defined in a lower surface thereof, the quartz plate being bonded...     

The present invention provides a sintered body of aluminum nitride comprising (i) aluminum nitride as a main component and (ii) at least one component selected from the group consisting of Zr, Hf, V, Nb, Ta, Cr, Mo, W, Fe, Co, Ni, Nd, Ho, Ti and compounds thereof in the total amounts of not greater than...     

A semiconductor assembly which includes a carrier and a semiconductor die is mounted on a printed wiring board. The die includes a top active surface and a bottom active surface. The two active surfaces are non-coplanar. The carrier is made from layers of a ceramic material. Holes are formed through...     

A heat-conductive composite material usable as a substrate (heat sink) for mounting a semiconductor thereon or a lead frame includes which comprises a core sheet and metal foil layers welded to the both surfaces of the core sheet. The core sheet is composed of a metal sheet of high thermal expansion...     

A ceramic package comprising an aluminum nitride substrate, an IC on the substrate, leads attached to the substrate, a metal cap covering the substrate, a resin layer for adhesion of the above elements, and a water-resistant coating on the inner surface of the resin layer.

Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively...     

A chip type varistor in which first and second inner electrodes are embedded in a sintered body obtained by laminating a plurality of semiconductor ceramics layers so as not to be overlapped with each other in the direction of thickness of the ceramics layers, respective one edges of the first and second...     

The present invention is a reusable fixture for holding a TCP carrier tape that is of simple structure, allows the carrier tape to be held securely, and eliminates powder produced by friction during mounting of the carrier tape. The structure includes a reusable fixture with a bottom element for receiving...     

A ceramic hermetic package is provided having conductive material bonded into apertures in the ceramic housing that connect with a die mounted on a thin substrate through wire and pad connections. The substrate has a heat sink affixed to the bottom and electrical connections are formed on the opposite...     

A heat-conductive honeycomb ceramic spacer having an array of apertures for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks using a low-profile contact comprising a foil with raised portions corresponding to the locations of apertures in the ceramic spacer...     

An IC package receptacle is disclosed in which, as an actuator is pushed down, a pushing surface thereof pushes down pressure bearing portions of a plurality of contacts against an elastic force to bring the contacts into and out of contact with leads of an IC package. To cope with an increase of the...     

An improved millimeter wave device package design in which the package includes a dielectric substrate disposed upon a supporting base such that the substrate extends substantially along the peripheral edge of the base, defining a central aperture. A solid conductive layer substantially covers the first...     

A thick film hybrid multilayer circuit is provided in which circuit devices are electrically interconnected with a multilayer structure composed of multiple layers of conductors interlaid with layers of a dielectric material in order to achieve high component density. The circuit devices of the hybrid...     

A semiconductor device package includes a semiconductor package element for containing a semiconductor chip, a lid bonded to the semiconductor package using an adhesive agent, and a cooler bonded to a surface of the lid. The bonded surface between the semiconductor package and the lid is positioned inside...     

This invention relates to integrated circuits which are protected from the environment. Such circuits are hermetically sealed by applying ceramic layers to the top metallization.

A semiconductor package applicable to integrated circuits and other semiconductor devices of the kind needing high integration and high speed operation. The package has a printed circuit board implemented by a glass cloth impregnated with epoxy, bismaleimide-triazine (BT) or similar resin, a power source...     

The semiconductor device of the present invention includes a semiconductor substrate on which an integrated circuit equipped with a connection electrode is formed on its main surface. At the center of the main surface, a substrate mounting portion having a cavity portion in which the semiconductor substrate...     

A semiconductor device which includes device bonding pads exposed through oxide windows formed in a passivation oxide layer providing electrical connections to the metallized regions, a bonding pad of a different material electrically connected to the device bonding pad through a barrier layer, and a...     

Disclosed is a resin-sealed semiconductor device which has an insulation substrate 1 having a chip-mounting portion is, leads which are radially disposed around the chip-mounting portion, an IC chip mounted on the chip-mounting portion and connected electrically with inner portions of the leads, a resin...     

A semiconductor device which includes device bonding pads exposed through oxide windows formed in a passivation oxide layer providing electrical connections to the metallized regions, a bonding pad of a different material electrically connected to the device bonding pad through a barrier layer, and a...     

The present invention discloses the use of a dielectric substrate panel suitable for supporting a plurality of independently packaged ICs. The substrate panel has a plurality of conductive landings arranged on its top surface, a plurality of conductive contacts arranged on its bottom surface and a multiplicity...     

A heat spreader formed of copper or copper alloys is direct bonded to an electronic device package which includes a multilayer substrate formed of alternating layers of ceramic and metallic plating.

An improved semiconductor module comprising a molded frame and a composite semiconductor substrate subassembly received in a cavity in said frame. The composite semiconductor substrate subassembly comprises a plurality of semiconductor devices which are connected to electrical contacts on an edge of...     

It is an object to downsize a device while maintaining a high breakdown voltage. An external terminal (7) protrudes to the outside from the side wall of a sealing resin (2) and a heat sink (1) is exposed in the bottom of the sealing resin (2). A step surface (21) retracted from the exposed surface of...     

An apparatus for integrating wafer scale semiconductor integrated circuits and interfacing them with other systems. A wafer, partial wafer, die or plurality of same are mated to a printed circuit board (PCB) which electrically contacts the pads on each die using small conductive pillars. The PCB in turn...     

The invention relates to components such as pyroelectric sensors which are particularly sensitive to piezoelectric effects and which, consequently, are disturbed by the mechanical deformations or the vibrations which the component may experience. In order to limit these disturbances, it is proposed to...     

A semiconductor module includes a ceramic substrate for mounting plural semiconductor chips. Even if cracks and cleavages are formed in the ceramic substrate, further damages, such as lowering dielectric or insulation strength is prevented. The semiconductor module includes IGBTs arranged on one ceramic...     

A configurable package for mounting an integrated circuit to a circuit board. The package has a substrate for receiving the integrated circuit. On the substrate are contacts for making electrical connections between the substrate and the integrated circuit. The substrate also has solder balls for making...     

A method for packaging a semiconductor die includes forming an additional protective layer and conductive traces on the die. The die is then placed in a multi-die holder having electrical connectors for establishing an electrical connection to the conductive traces. The protective layer is formed as...     

An apparatus for integrating wafer scale semiconductor integrated circuits and interfacing them with other systems. A wafer, partial wafer, die or plurality of same are mated to a printed circuit board (PCB) which electrically contacts the pads on each die using small conductive pillars. The PCB in turn...     

A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method...     

A semiconductor assembly having contacts on a peripheral region of the top surface of a chip and a backing element overlying the bottom surface of the chip. The backing element has terminals such that at least some of the terminals overlie the bottom surface of the chip. Leads including bonding wires...     

A low-temperature calcined ceramic of the present invention comprises a sintered body obtained by calcining a mixture of a glass and an SiO.sub.2 filler such as quartz or cristobalite, wherein the sintered body contains an SiO.sub.2 crystal having an X-ray diffraction image that the peak at the (101)...     

A substrate having a vent (20) and a method of forming the vent (20). A substrate (11) has conductive traces (14) and a semiconductor chip attach pad (17) on a top surface and conductive traces (12) and a bonding pad (13) on the bottom surface. A masking layer (18) is formed over the substrate (11) and...     

A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted...     

A pad grid array plastic package includes a laminated plastic body with a centrally located cavity, an IC unit secured within the cavity, and an encapsulating organic polymer, such as epoxy, enclosing the cavity. The laminated body includes a substrate and a structural member on top of the substrate...     

A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface,...     

According to one aspect of the invention there is provided a semiconductor chip comprising a semiconductor die, an array of electrical contacts on an integrated circuit in a frontside of the die, and a protective layer on a backside of the die.

A lead finger immobilization apparatus is disclosed. The apparatus utilizes a perforated layer of a nonconductive material.

A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive...     

A semiconductor wafer having one or more pad electrodes is joined to a reinforcing insulator plate formed with a plurality of through holes. On both sides of the reinforcing plate, there are formed conductive layers which are electrically connected through the through holes filled with a first solder....     

A semiconductor package includes at least one structure having a central hole formed at a center portion of the structure, a plurality of outer holes around the center hole, and a plurality of conductor pieces buried in the outer holes; at least one TAB having lead lines extending from sides of the TAB,...     

A gasket sealed integrated circuit package (10) including a top member (12) clamped to a bottom member (18) with a gasket seal ring (26) sealed therebetween. Seal ring (26) encompasses an active portion (30) of an integrated circuit (22) to seal an active portion (30) from the ambient without inducing...     

A package for an integrated circuit is described, as is a method of making the package. The package is comprised of a substrate having a substantially planar first surface on which an integrated circuit die is placed. An imperforate adhesive bead on the first surface of the substrate surrounds the die....     

A programmable substrate and a method of making a programmable substrate for use with array-type packages, including Ball Grid Arrays(BGA), Pin Grid Arrays (PGA) and Column Grid Arrays (CGA) includes a nonconductive programmable substrate with a cavity in the top of the substrate. The cavity is sized...     

An electronic circuit package is provided in which a substrate accommodating chamber for accommodating a circuit substrate is formed in a case made of resin. The case has a plurality of terminals fixed thereto each having an internal connecting portion extending in parallel with the substrate. An electronic...     

A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into the cavity, which is framed at least by an anisotropically-conductive adhesive layer. Bond pads on the die...     

In a semiconductor device, a ceramic package having a first surface and a second surface and having a recession section provided on the first surface side is provided. The recession section has a first opening provided at a center portion of the recession section and penetrating to the second surface,...     

A substrate structure for surface mount devices includes: a plurality of substrate layers including at least a base layer and an outer layer; the base layer having a contact surface and a first array of conductive pads on the contact surface; the outer layer having a contact surface, a cutout and a second...     

A hermetic thin pack semiconductor device. The semiconductor device has a semiconductor substrate and at least one electrode on the upper surface of the semiconductor substrate. A lid of a ceramic material for the semiconductor device has at least one opening extending through the lid. A first electrically...     

An improved interface pad or layer for use in combination with solid state electronic components adapted to be interposed along a heat dissipating path between the electronic device and a mounting chassis or heat-sink surface. The interface pads comprise a polyphenylsulfone binder or matrix blended with...     

A semiconductor package has a first region having a thickness equivalent to or slightly larger than a semiconductor chip 4 (0.35 to 0.7 mm) and sealed with resin, and a second region provided on the outside of the first region, having a thickness smaller than that of the first region (0.15 mm to 0.35...     

In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of...     

A tiny ball grid array package based on a substrate. The substrate has at least an insulation layer and two copper foils laminated together. A hole is formed near the center of the substrate. A second one of the copper foils is patterned into multiple conductive traces formed on a surface of the substrate,...     

A multi-chip chip scale package. A film carrier is in use. Two chips with different sizes can be disposed on the same film carrier. The flip chip technique is used to arrange each chip on each side of the film carrier face to face. A bump is formed on each chip to electrically connect with the film carrier....     

A structural shape has an injection molded, three-dimensional substrate composed of an electrically insulating polymer, polymer studs planarly arranged on the underside of the substrate and co-formed during injection molding, outside terminals formed on the polymer studs by a solderable end surface,...     

An insulating material of high electrically insulating properties and high thermal conductivity is provided wherein the high thermal conductivity is attained by having a liquid crystal resin comprising a polymerization product of a resin composition containing a monomer which has a mesogen group.