Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards)

An ultrasonic soldering system is described. Electrical and electronic components are assembled in a circuit board with their leads extending through holes in the board. The components are temporarily held in position in the board by means of a solid, solder-compatible, stabilizer material having a melting...     

Sets of finger-like leads for attachment to semiconductive devices which have a plurality of metallic electrical contacts are etched in a copper foil mounted on a temporary carrier strip simultaneously with indexing holes. The indexing holes are then used to index or register the set of leads when it...     

Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material...     

A mass soldering system is described in which a standing wave of molten solder is formed. The solder wave is characterized by having a substantially horizontal crest, and the wave has varying pressures along its flow path. In a preferred embodiment of the invention the wave pressures are varied to produce...     

A method of forming a laminate is disclosed. The method comprises placing a metal film in juxtaposition to a surface to be joined thereto. A buffer medium having an explosive charge on at least one surface thereof is positioned proximate the film. The explosive charge is detonated to propel the film...     

A printed wiring board is oriented with a wiring surface facing up for mass soldering. Molten solder is pumped from a tank onto a trough and flows in a thin, wide stream across the upper surface of the printed wiring board which is held down to prevent the board from floating on top of the solder.

A method and apparatus for dip-soldering semiconductor components is disclosed as including a temperature-controlled solder bath and a gas supply line disposed along one edge of the upper surface of the bath. Hydrogen and nitrogen gases are selectively supplied and discharged from nozzles of the supply...     

An electric fuse having blind metal fusion joints, e.g. solder joints, between the two ferrules and the fusible element, or the fusible elements, thereof. One of these conductive connection joints is situated adjacent the center region of the inner end surface of one of the two ferrules. The other of...     

Stripped wire ends are coated with a "solder friendly" resin such that when they are placed in physical contact with terminals during assembly of electrical circuitry preparatory to soldering the same to the terminals, there is no appreciable conduction. After a routine soldering operation, the resin...     

A printed circuit board has a coating comprising a selected deformable material which is solder-compatible, and has a melting point below that of solder. Electrical and electronic components are then loaded in position on the board with their leads extending through holes in the board, and imbedded into...     

A wave solder machine is provided which includes an endless moving mesh belt that is made of a nonsolderable material such as titanium wire. The belt is supported so as to be totally immersed in the solder wave as it passes the latter. This causes the undersides of stuffed printed circuit boards on the...     

Apparatus is disclosed herein for extending the length of a trailing wave of a double sided laminar wave of solder by the use of a dam in an oil intermix wave soldering system to create a dead zone while still being able to remove oil from the surface of the dead zone area on a continuous basis to prevent...     

A system for measuring time/temperature profiles of a mass soldering operation is described. In accordance with the invention a data probe and miniature transmitter is carried through the soldering operation on top of the circuit board being soldered. A plurality of probes are attached to various components,...     

A quartz oscillator comprises a quartz blank having electrode films deposited on opposite parallel faces thereof. Holding wires which are parallel to the quartz blank extend along and spaced slightly from the opposite faces of the blank and are locally soldered to the quartz blank. The holding wires...     

A method of alignment of two parts comprises separating the two parts and producing images of the separated parts, breaking down the images into image points with a spacing smaller than the required accuracy, digitalizing the information content of the image points and comparing the actual position of...     

A printed circuit board is formed from a metal-clad substrate by applying a solvent-free, non-dryable ink in a predetermined pattern on the substrate, dusting powdered resin over the surface, removing any resin powder not retained by the ink from the surface, heating the substrate having the ink powder...     

A method of applying solder to gold by applying a gold-tin intermediate layer to the gold and applying the solder over at least a portion of the intermediate layer. The method can be employed to produce a printed circuit unit composed of a printed circuit board, at least one gold member mounted on the...     

Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material...     

An apparatus for soldering printed circuit boards includes a carrier adapted to support a printed circuit board and to be moved along a predetermined transfer path, preferably in the form of a closed loop; a pair of laterally spaced movable rails defining a part of the transfer path and adapted for supporting...     

An apparatus or a method for heating a component by the condensation thereon of a suitable vapor, for example to make a soldered connection in condensation soldering. The vapor is produced by passing a heat transfer oil through a vaporizer comprising permeable electrically conductive material, and is...     

Soldering techniques, where a circuit component having a row of closely spaced leads (e.g., dual in-line packages) are to be soldered to a printed circuit board and the leads are oriented on the printed circuit board such that the row of leads is arranged parallel to the direction of motion of the printed...     

The present invention relates to a method of wave soldering an assembly composed of a plurality of electrical conductors disposed on a surface of a sheet of insulating material. In accordance with this method, the surface of the sheet and the conductors are contacted with a stationary wave of molten...     

A soldering installation (1) is provided for run-through and shuttle operation, in particular for the run-through soldering of printed circuit boards on a soldering machine. It is equipped with a feeder mechanism (4) for the transport of soldering frames (18) to which printed circuit boards are fixed....     

A system of composition, apparatuses and process provides for a rapid and reliable development and location of a web fabric structure to position and hold each member of a closely spaced assembly of positioned but not electrically connected units comprising discrete electrical components and integrated...     

Apparatus augmenting a wave soldering machine for mitigating warpage of a printed wiring board after it is processed by the soldering machine comprises heat dissipation means (200) and cooling means (202). The dissipation means directs a first gaseous stream over the a narrow, transverse strip on the...     

A coating composition, which is suitable for the production of photopolymerizable coatings on circuit boards for the production of solder resists, comprises: (a) an ethylenically unsaturated polymerizable reaction product of a polyepoxide and an ethylenically unsaturated carboxylic acid, which product...     

An apparatus or a method for heating a component by the condensation thereon of a suitable vapor, for example to make a soldered connection in condensation soldering. The vapor is produced by passing a heat transfer oil through a vaporizer comprising permeable electrically conductive material, and is...     

A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board....     

A soldering system is described in which a freshly soldered board is heated substantially immediately following deposition of molten solder onto the board so as to maintain the freshly applied solder in molten condition, and a fluid stream is then directed onto the molten solder. Preferably, but not...     

A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board....     

Two substrates carrying printed circuit patterns are coupled together back-to-back with an adhesive tape interposed therebetween. A plurality of holes are formed through the substrates, and apertures of small diameter are punched in the portions of the adhesive tape backing these holes. Electric components...     

An apparatus for wave soldering component leads to a conductor on a printed circuit board surface includes a fountain for forming a standing wave of hot molten solder. A pool of hot oil having a specific gravity lower than the solder floats in a depression in the surface of the solder adjacent to the...     

Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered using first and second molten solder, successively. The first molten solder is forced to overflow from a nozzle member to form a wave of overflowing solder extending...     

A displacement soldering device comprising a container for molten solder, a support structure for supporting a printed circuit board (PCB) over the surface of solder in the container, means for displacing the surface using a partial vacuum, when molten, vertically relative to the container and support...     

Carriers each carrying a printed circuit board is conveyed successively through a soldering zone to dip each printed circuit board in molten solder contained in a vessel disposed below a space defined by two pairs of parallel front and rear rails. The four rails are engageable with four wheels of the...     

Method and apparatus for forming an electrical contact between mounting pins extending from an electrical component and insulated wires from the component that are wrapped around the pins in which the tips of the pins are held in a flowing pool of molten solder until the heat travelling up the pins loosens...     

An improved solder wave apparatus and method that minimizes the undesirable phenomenon of solder splash is presented. A V-shaped trough is placed across the top of the inner container or box of an otherwise conventional solder wave machine. The V-shaped trough is positioned so that the bottom thereof...     

Wave soldering apparatus particularly adapted for soldering printed circuit boards which have closely packed chip components adhesively mounted on one side of the boards is described. A novel nozzle assembly is dimensioned to be mounted to the solder supply conduit of a conventional wave soldering reservoir....     

Printed circuit boards bearing chip type electric parts on its underside surface and travelling along a predetermined path are soldered by contact with a progressive wave of a molten solder progressing in a direction transverse to the path of travel of the printed circuit board. A nozzle member provided...     

An apparatus for soldering workpieces (29) has a main solder bath (20) with main solder wave (15) and the workpiece (29) is brought into contact with the surface of the main solder wave. The surface can be modulated by means of at least one additional solder outlet or inlet nozzle (11), in order to solder...     

An automated discreet soldering system for plated holes of a printed wiring board, having a free piston type crucible mode of graphitic material, which is propelled along a guided path by pressurized nitrogen. A laser beam is directed along a path substantially coincident with the path of travel of the...     

A method of manufacturing a solar battery by serially connecting a plurality of solar battery elements arranged spaced from each other. A pair of flexible films are used to sandwich the arrangement of the solar battery elements, and each of the flexible films has a plurality of conductive members formed...     

Contact of a soldered board by a soldering oil supplied from within a solder wave takes place immediately following deposition of molten solder onto the board. The oil causes relocation of solder on and/or removal of excess solder from the underside of the board, and any interconnections, component leads...     

A soldering apparatus has a base, and a solder tank and a nozzle arranged in tandem with the base. A partition plate is arranged in the solder tank. The partition plate, a bottom plate disposed at the bottom of the solder tank, and a lower plate covering the bottom of the solder tank define a channel...     

In a process for wave soldering a work-piece in an atmosphere consisting essentially of air wherein (i) there is a first portion of the solder wave in which fluid motion can be observed, said first portion including an active dross forming area and (ii) there is a second portion of the solder wave, which...     

A printed circuit board which facilitates the removal and replacement of components. The circuit board (1) has unplated holes (8) extending therethrough for receiving connection pins (3) of components (2) mounted on one face of the circuit board (1). The pins (3) protrude from the opposite face of the...     

A process for soldering circuit boards comprising the steps of: (a) applying a solder flux coating to the solder side of a board; (b) drying the flux on the board and preheating the solder side of the board by sequentially (i) directing a stream of warm gas over the solder side of the board, (ii) positioning...     

A soldering apparatus comprises a solder bath, an applicator for applying solder to a joint or the like to be soldered and a pump for pumping solder substantially continuously through the applicator. The applicator is movable vertically relative to the solder bath to solder a joint positioned above the...     

A vapor phase processing apparatus of the type wherein an article is heated to a preselected temperature for vapor phase processing, comprises a vessel containing a liquid having a boiling point at least equal to the preselected temperature, into and out of which the article is transported, and a heating...     

A method of solder leveling in printed circuit boards or other circuitized substrates. Flux is first applied to the surface of the substrate to be soldered. Molten solder is then applied to the fluxed surface after which the soldered substrate is cooled to a temperature below 300.degree. F. Molten solder...     

A vapor phase soldering apparatus for soldering printed circuit boards, including a vessel for containing a heat transfer liquid, partition plates provided within the vessel for dividing the inside space of the vessel into inner and outer chambers which are in fluid communication with each other at upper...     

A machine for soldering a work product. Work product is conveyed through the machine and an applicator directs an extended liquid stream against the conveyed work product. The applicator is rotatable about a horizontal axis and a rotatable manifold assembly delivers liquid to the applicator and the manifold...     

Wave soldering process and apparatus for the soldering of elements such as, for example, printed circuit assemblies with surface mounted components and the like which yield improved soldering results by promoting the penetration of solder into narrow spaces between components, the filling of small holes...     

A multilayer printed wiring board having an air gap between neighboring printed wiring boards of the multilayer printed wiring board by inserting plated spacers to both end faces of through-hole pads which are provided to each printed wiring board so that each through-hole pad opposes to another through-hole...     

A soldering system for applying molten solder to a work product. The system includes a solder applicator having a cylindrical barrel having an elongated orifice wall extending parallel to the axis of the barrel and a nozzle secured to the barrel. The nozzle which has an elongated orifice surface can...     

It is often required to solder an electrical connection to a component or a lead thereto via a contact pad. At present pads are commonly of materials that tend to oxidize during any subsequent heat processing of the device, and are then difficult to solder. It has now been discovered that certain alloys...     

A soldering apparatus is disclosed having a first vessel through which printed circuit boards are transferred for soldering by a combination of a solder wave and hot vapors of a heat transfer liquid, a second vessel in which heat transfer liquid is heated and vaporized, a gas feed conduit extending between...     

A process for vapor phase soldering of electronic components comprises applying to the surface of a substrate or to the surface of components on such substrate a solder cream comprising 85 to 90% of finely divided solder metal and 10 to 15% of a fluorinated tertiary alkylamine, preferably a perfluorotrihexyl...     

An apparatus for reflowing solder terminals that join an electronic element to a support substrate, which apparatus includes (1) a stage for supporting the substrate, (2) a quantity of liquid capable of being heated to a temperature in excess of the melting point of the solder of the solder terminals,...     

A technique is disclosed for attaching a variety of device types to the same side of a printed circuit board including a single solder application step for both surface mountable and leaded components, placement of the devices, drying of the solder and solder reflow.

A processing vessel has two adjacent tanks each holding different electronic liquids. When heated the first will generate saturated vapor having a temperature below the liquidus temperature of eutectic solder and the second, when heated, will generate saturated vapor having a temperature above the liquidus...     

An electrical component having an elongated contact element provided with a premeasured bead of solder thereon such that, in reflow operation, it can be joined to a contact on another component. In one embodiment, the solder bead can be formed on the pins of a component adapted for mounting on a printed...     

An electronic component tinning apparatus comprising a longitudinal base unit having two longitudinally extending sides connected to a first end and an opposing second end, a top portion connected to and bounded by said sides and ends with an open longitudinal central cavity, and two spaced-apart, parallel...     

A soldering apparatus comprising a soldering station (10) with a system for producing at least one soldering wave (P2, P3) and a transport device extending above the soldering station (10). Several resilient supporting elements (18) are arranged in one or more rows at right angles to the direction of...     

A method and apparatus for producing flush solder fill over recessed pins and over passage holes in circuitized substrates. A substrate carrying rack is immersed in a vessel of molten solder after it has been similarly immersed in a flux bath. While in the molten solder, the rack is vigorously agitated....     

A printed circuit board has a copper foil pattern formed thereon in the shape of exclamation marks oriented in the direction of solder flow such that undesirable peelback effects can be isolated and the amount of solder attached to the pattern can be uniformly controlled.

A printed wiring board includes a dielectric base plate, a circuit pattern at least on one surface of the base plate, and a solder resist film containing silicon series and/or fluorine series and covering the base plate except a desired soldering area of the circuit pattern. The solder resist film has...     

Disclosed herewith is a single in-line type semiconductor device having external leads drawn out from a package in staggered fashion. According to the single in-line type semiconductor device of this invention, a narrow portion to be fitted in an opening formed in a printed circuit board is provided...     

A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application...     

In the chip type component installation structure wherein chips are arranged to be joined by solder to a fitting pattern provided on a printed substrate, resist films are set separately in the space of the fitting pattern in order to reduce the quantity of solder. The resist films are set in the space...     

An easily automated and heat-stable semiconductor contacting system for linear and planar SMD components, particularly LED arrangements. SMD components are applied to a carrier film coated with interconnects. The interconnects are entirely or partly formed of solderable material for simpler contacting...     

A solder leveller comprises a solder bath into which a printed circuit board can be dipped to be preliminarily tinned. A pair of upright laterally acting jaws are adapted along an extended part of their length to hold the board at its opposite side edges and operate to insert in and withdraw the board...     

An improved method for double sided attachment of components to a printed circuit board is described wherein surface mount components soldered to a first surface of the circuit board (backside) are, once the board is inverted during reflow, retained in place only by force of molten solder surface tension.

A method and structure includes a solder plate assembly (20) includes a high temperature plastic having apertures (22) arranged in a grid to receive contact pins (14) of a connector (12) inserted therethrough with solder rings (28) cast into the said apertures and adapted to be reflowed to join pins...     

A tunnel for fluxless soldering, is a straight linear tunnel which contains vibrating means to vibrate a solder wave and a non-explosive gas atmosphere. The gas atmosphere includes a small portion of hydrogen or other gaseous reducing agent, sufficient to achieve a fluxing action. A process for soldering...     

A water soluble solder paste, which does not adversely impact the surface insulation resistance (SIR) of a circuit board, is comprised of powdered solder, a water soluble flux (containing an activator within a water soluble vehicle), a hydrophobic surfactant preferentially absorbed over the water soluble...     

A soldering process uses a plurality of individual heating elements (204) to solder a plurality of solder locations. The process consists of the steps of substantially simultaneously picking up a plurality of solder preforms (202); placing the plurality of solder preforms substantially simultaneously...     

A reflow soldering apparatus having a pre-heating chamber and a reflow chamber, wherein a hot gas recirculation system including a cross-flow blower, a diverging nozzle and a heater is provided in the reflow chamber or both in the pre-heating chamber and the reflow chamber, so that a hot gas such as...     

A soldering apparatus for selectively soldering designated areas on the surface of a printed circuit (PC) board for mounting multi-pin, through hole circuit components thereto includes a wave solder pot, a fixture for receiving and positioning the PC board over the solder pot, and a plurality of spaced...     

A cover plate extends over a solder reservoir and has a slot for a solder wave to extend up above the plate, a gas excluding oxygen is supplied under the cover plate and flows up through the slot on both sides of the solder wave to blanket the solder wave. It has been found that oxygen content on the...     

A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit to other surfaces or layers of a printed wiring board. Plated-through holes are used...     

The application of electrochemical reduction treatment liquids and electroless reduction treatment liquids to elements such as circuit boards for cleaning metallic surfaces in preparation for soldering is accomplished using a wave of the treatment liquid over a liquid tank. A wave treatment has advantages...     

An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e.g.,...     

A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit other surfaces or layers of a printed wiring board. Plated-through holes are used as...     

Improved printed circuit boards and methods of soldering them are provided in which a snap bar is provided on the conductor side of a printed circuit board for reducing defects, such as bridging, during soldering. This and other provided process and design techniques, such as lead lengths, orientation,...     

Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum...     

A solder spacer device and method for use in positioning a grid pin array having a plurality of pins over a circuit board having a plurality of pin holes respectively receiving the pins. The spacer is pulled through a central opening in the circuit board after the pins are soldered in the holes to the...     

A method of fabricating a substrate module is provided that includes cavities of a diameter and depth which take into account the statistical variance in the dimensions of C4 solder balls. By constructing cavities with the proper dimensions, electrical connection between the chip and substrate, via the...     

A cover plate extends over at least part of a solder reservoir and has a slot for a solder wave to extend up above the cover plate. Shield gas is supplied under the cover plate to blanket the solder wave and prevent air from contacting the solder wave and circuit boards passing through the solder wave....     

The base of solder bumps is preserved by converting the under-bump metallurgy between the solder bump and contact pad into an intermetallic of the solder and the solderable component of the under-bump metallurgy prior to etching the under-bump metallurgy. The intermetallic is resistant to etchants which...     

An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e.g.,...     

A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junction dipped into the container. The meniscus on...     

A coaxial bump for connecting a die to a substrate includes a center post and a ground ring surrounding and shielding the center post. The center post may be a center conductor line, and the ground ring may be generally torus-shaped, nearly closed or completely closed. The coaxial bump provides very...     

A cover plate extends over at least part of a solder reservoir and has a slot for a solder wave to extend up above the cover plate. Shield gas is supplied under the cover plate to blanket the solder wave and prevent air from contacting the solder wave and circuit boards passing through the solder wave....     

Printed circuit boards are wavesoldered by a method featuring the use of a plurality of elementary jets of molten solder to form a single flat soldering wave. Such a single flat wave is achieved by revolving those jets in an orbital motion such that the orbital motion is in a horizontal plane substantially...     

A printed wiring board having an electronic component mounted thereon is disposed with a land of pattern directed downward, and the land and a lead terminal of the electronic component are irradiated with a light beam emitted upwardly and supplied with a solder forwarded upwardly.

A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear...     

A circuit board assembly including a shielding housing mounted on a circuit board (1), the shielding housing being intended for radio-frequency shieldings. The shielding housing (2) having a wall inclined at an angle .alpha. to a plane orthogonal to the plane of the circuit board. The housing of the...     

An electrical connecting method connects a first contact of a first object to a second contact of a second object. The electrical connecting method includes the steps of coating a Ga system liquid metal on at least one of the first and second contacts, where the Ga system liquid metal includes a predetermined...     

A non-toxic, non-corrosive liquid soldering flux consists essentially of a solution of citric acid in water. This unique flux produces solder joints of high metallic luster and excellent quality. Disposal presents no health hazards, and clean-up of flux residues is accomplished using only water.