Liquid cooled

A cooling chamber is bonded to an electrical device to be cooled. The chamber includes a metal wall connecting the device into the working electrical circuit. A thinned portion of the metal wall forms a fuse which will burn out due to an excessive flow of current through the electrical device upon failure.

A semi-conductor cooling system formed of a container having a wall portion made of soft yieldable material which is adapted to contact the surface of a semi-conductor device. A porous member is disposed within the container adjacent the inner surface of the yieldable wall. A liquid medium partially...     

The invention contemplates a heat-transfer device or heat pipe characterized by integral screen-wick structure providing relatively great contact area between the internal working fluid or condensable medium and the heat input.

A semiconductor wafer is sandwiched between the ends of two heat pipes. One end of each heat pipe is in electrical and thermal contact with the wafer. The heat pipes are fastened together so that the wafer is held in compression between the two heat pipes. The ends of the heat pipe, are reinforced from...     

Metal plates of tungsten or molybdenum, having an optimum thickness of 1000 micrometers or less, are bonded to respective cathode and anode electrical coatings on the opposed major surfaces of a semiconductor wafer. The metal plates in turn are conductively bonded to the heat pipe walls which are used...     

A gas encapsulated cooling unit is provided for one or more heat generating components mounted on a substrate. A heat conductive cap is sealed to the substrate enclosing the heat generating components. The wall of the cap opposite the substrate contains elongated openings therein extending towards the...     

In a liquid cooled thyristor column in which disk thyristors are stacked along with heat sinks with the disk thyristors and heat sinks held elastically together each heat sink is equipped with a laterally projecting heat pipe having its free end emersed in a coolant line, with the free ends of the heat...     

A liquid rheostat includes a conductive element which surrounds multiple electrodes. The element provides a multiplicity of current paths between the electrodes at a given depth of electrolyte solution thus decreasing current concentration of the electrodes. In order to further decrease current concentration,...     

The chassis for an electronic assembly includes a plurality of cooling bars which are mounted parallel to each other and spaced apart to receive electronic assembly modules. The cooling bars have internal passages for the flow of coolant, and the bars have a plurality of slots formed in the sides thereof...     

A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient...     

A Minimum Delay Module Assembly, having unrestricted accessibility for servicing, that provides substantially constant electrical and thermal environments for all portions of the assembly regardless of configuration. The assembly comprises a plurality of vertical page modules in which each page module...     

A cooling capsule for a thyristor wherein the capsule is provided with a metallic core having at least one heat transfer surface and with a plurality of bores extending between surfaces of the core so as to form a meander-line-like flow path therethrough between an inlet opening and an outlet opening....     

An improved conduction cooled module of the type having at least one chip mounted on a substrate and having a housing surrounding the chips and sealed to the substrate. The housing having cylinders therein opposite the chips for containing pistons which are resiliently urged against the chip surface....     

Sensitive testing transducers are mounted to an internally threaded cap. A split-ring sleeve having external threads is positioned around the cold tip of a cryogenic refrigerator. An internal flange on the sleeve abuts a shoulder on the cold tip to hold the sleeve on the cold tip while permitting rotation...     

A matrix of small diameter holes are located in the module housing adjacent each of the integrated circuit chips to be cooled. A pin or rod is located in each of the holes and extends therefrom into contact with the exposed surface of the chip. A spring means is located between the housing and the pin...     

The thermal conduction module for removing heat from one or more chips located therein consists of a housing made of heat conductive materials forming a cap over the chips. The housing contains one or more openings, one opposite each of the chips. More than one heat conductive element is included in...     

A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module. The provision of thin leaf shaped members each having a relatively long thin planar surface in thermal contact with a planar surface of the chip to be cooled, said...     

A support rack is shown as constructed of stainless steel angle members permanently welded together so as to comply with seismic requirements for nuclear power plant components. The four basic sides of the rack form a rectangle with the longer sides vertically extended. Permanent stainless steel plates...     

Disclosed is a housing for a laser device. The housing is of cylindrical shape and comprises two semi-cylindrical housing halves connected by a hinge. Each housing half includes a cutout in a planar inner portion thereof extending in the housing half parallel to the axis thereof. The cutout base of a...     

A heat pipe formed by metal deposition, on porous metal wick parts, which forms the enclosure and provides both a metallurgical bond to the wick and a hermetic seal.

A cooling fin assembly for mounting on a semiconductor package that includes a plurality of pins adapted to be affixed to a surface on the package, and a cooling fin means having a thin walled cellular configuration with the cells defining elongated openings in side-by-side relation that extend through...     

To cool electronic heat producing elements and components which are normally connected to a heat sink, an evaporator containing a circulating coolant is thermally connected to each of the heat producing components. The evaporator absorbs the heat from the heat producing element. The coolant is boiled...     

A rotatable rectifier assembly for use in a brushless generator. A housing 40 receives a stack of heat sinks 56-68 which are both thermally and electrically conductive and which sandwich diode wafers 78 making up a multiple phase, full wave rectifier. The requisite electrical connections are made by...     

A cabinet (1) for stowage of electronic printed circuit boards (2,3,4) for example, is adapted for permanent installation in a vehicle structure by allowing the boards to be readily removable. The cabinet can thus be readily cooled by both air and fluid jackets (10,13, and 13,12) which are permanently...     

A heat-conducting cooling module for cooling a semiconductor substrate in an integrated circuit package assembly in which a semiconductor substrate is mounted on a base board by small solder pellets, and which contains a single substrate or laminated substrates. A heat-conducting relay member is provided...     

The use, for heat transfer in evacuable or other equipment, of a thermally conductive fluid, confined by a flexible diaphragm, for heat transfer across the diaphragm between the fluid and a component placed in thermal contact with the diaphragm.

A semiconductor stack is composed of a GTO thyristor, cooling members and wiring conductors which are stacked and tightened together. The semiconductor stack is disposed horizontally in a cooling vessel, and the vessel is filled with a Freon liquid. A condenser is disposed above the cooling vessel and...     

There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink structure suitable for mounting semi-conductor chips such as IC's, hybrids, lasers, and power semi-conductors, said heat sink being made of metals, such as tungsten or Molybdenum; ceramics such as alumina, Beryllia, aluminum...     

A semiconductor power module includes a substrate formed of metallized ceramic, at least one semiconductor power component with a base surface soldered to the metallized ceramic, and at least one heat conduit integrated into the semiconductor power module. The heat conduit includes a condensation area...     

A cooling system for maintaining the temperature within electronic equipment has a circulation system for pumping a cooling liquid, such as water, through the electronic equipment where it picks up heat generated by the electronic equipment. The cooling liquid is pumped through a plurality of heat exchangers...     

A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations...     

Apparatus and method for removably mounting an integrated circuit package having a plurality of electrical pins wherein a plurality of mating pins each having a receptacle filled with liquid mercury are connected to the electrical pins of the integrated circuit package and the temperature reduced such...     

A thermally conductive module for locally extracting heat from an individual electrical component of a circuit board installation comprises a tubular metal housing of high thermal conductivity closed at one end and having at that end a screw-threaded stud for securing the housing to and in thermal contact...     

A cooling structure for cooling integrated circuits. The cooling structure includes integrated circuit cases inside which one of more integrated circuits are mounted. Cold plates are also included which are superimposed on heat radiation surfaces of the integrated circuit cases, respectively, the cold...     

An assembly for cooling an array of IC packages which have respective non-coplanar heat dissipating surfaces, comprises: a frame that is attachable to the array and has multiple beams, each of which is positioned to overlie some of the IC packages; respective liquid-cooling jackets for the IC packages...     

A cooling system for electronic components includes a substrate on which electronic components are mounted. A first layer made of adhesive material is provided on a surface of the substrate opposite the components and a second layer made of a material having a relatively low melting point is provided...     

The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer is provided at the surface part of the contact interface of a heat generating element or a heat sink element, and a liquid such as oil is contained...     

A semiconductor chip carrier package formed of a multi-layer circuit board having mounted therein a semiconductor chip support pad. The multi-layer circuit board is comprised of separate dielectric boards defining multiple conductive run layers including a signal layer and a plurality of power layers....     

A configuration of an electronics unit is disclosed wherein a plurality of circular circuit cards are arranged in an aligned, parallel relationship. Each card has a central circular inner opening formed therein. A plurality of inner and outer spacer elements support the respective inner and outer peripheries...     

An electronic control apparatus for use in an automobile has a base of a good thermal conductivity having one side disposed in contact with engine cooling water. Semiconductor devices are disposed on the other side of the base so that the semiconductor devices are maintained at the temperature of the...     

A packaging and cooling structure for integrated circuit chips in electronic equipment is provided in which the chips are resiliently mounted on wafers which are centrally located in chambers within a housing. A liquid coolant is forced through orifices to spray the coolant on the wafers behind the chips...     

An expandable and contractable sealed environment is provided by a rigid frame member and a pair of deformable heat transfer elements fixed to the frame member. The frame member is located between two heat-producing electronic assemblies. A coolant agent is pumped into the sealed environment to flex...     

A one-piece, substantially flat and very thin heat exchanger core in accordance with this invention has two flat and parallel surfaces, with each of said surfaces being suitable as a mounting surface for a number of heat producing electronic chips. These surfaces are closely spaced and separated by a...     

A sealed module includes a cold plate having a passage through which a cooling medium flows, a plurality of bellows structures having first ends which communicate with the passage in the cold plate to form a thermal conduction type cooling system and a plated printed circuit having a substrate and a...     

A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with understanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant....     

A flexible liquid ribbon cooler for use with electronic components which includes a plurality of elongate thermo-conductive members, which are circular in cross-section, and which are positioned side by side. A bottom and a top layer of thermo-conductive material enclose the bottom and tops of the elongate...     

Flexible cooling paths are connected to semiconductor elements which are heated members. A cooling apparatus comprises cooling blocks connected to cooling blocks, coolant flow paths through which the coolant flows, coolant branching mechanisms provided in the coolant flow paths and connecting mechanism...     

A system for cooling, positioning and supporting phased array microwave modules within a phased array radar system wherein the modules are disposed in cooling tubes, the cooling tubes being arranged to permit coolant to continuously pass in close proximity thereto along channels formed in a coldplate....     

A thin multi-passage cooler that produces an isothermal heating surface, high heat transfer coefficients, without producing an excessive pressure drop across the coolant passages. The cooler having a plurality of first passages in fluid communication with a plurality of second passages. A coolant flows...     

A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant....     

A plurality of semiconductor elements are mounted on a substrate. A plurality of cooling elements are inserted between a thermal conductor for conducting a heat generated from the semiconductor elements to a cooling medium and the semiconductor elements. A channel for conducting the generated heat of...     

A liquid cooled integrated circuit assembly including a plurality of integrated circuit packages for housing and electrically interconnecting integrated circuits, a printed circuit board for mounting the integrated circuit packages, and flexing tubing for supplying coolant to the integrated circuit packages....     

An LSI temperature controlling system has closed LSI cooling water circuit, and a refrigeration circuit including a motor-driven refrigerant compressor, a first heat exchanger for exchanging the heat of the LSI cooling water and the refrigerant and a second heat exchanger for exchanging the heats of...     

The invention is a cooling system for electronic circuit modules such as a printed circuit boards. In detail the invention comprises a housing assembly having first and second opposed plates. The opposed plates include a plurality of spaced guide rails thereon. A plurality of electronic modules each...     

A high intensity heat exchanger that uses a solid copper heat sink having a lurality of integral pins formed on one side thereof, and an electrical insulator comprised of thin film of aluminum nitride (AlN) or diamond-like carbon (C) deposited on the other side. A device to be cooled, such as a computer...     

A multi-layered cold plate is customized for cooling a plurality of electronic components to be arranged in thermal communication with the cold plate by dividing the cold plate into a plurality of hypothetical cooling zones, determining the cooling needed for the respective cooling zones for cooling...     

A hold down interconnection stick is provided which is fastened to the ou walls of a container of an electronic system and to the electronic printed circuit boards which form a part of the electronic system. The stick is also provided with heat dissipating means to carry away the heat generated during...     

ATE is mounted directly to a support surrounding and removably receiving probe cards of differing thickness. An electrically heated chuck having a variable heat transfer coefficient heat exchanging face confronting a liquid nitrogen supplied plenum exhibits a temperature that varies with electrical heater...     

A system and method of cooling which uses both jet impingement and conduction cooling. Conduction cooling is accomplished by placing a cluster of pistons in contact with each chip. The pistons have a rectangular foot at the bottom which contacts the chip. A dielectric coolant, such as liquid nitrogen...     

The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a...     

A wafer cooling chuck (10) uses 3M micro-channel stock (12). A coolant manifold (14) surrounds ends (16) and (18) of the stock (12). A vacuum manifold (17) surrounds the coolant manifold (14) at end (16). A heat transfer fluid supply manifold (15) surrounds the coolant manifold (14) at end (18). A first...     

A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation....     

An article provides sealing of an electronic component connected to a mating fluid heat exchanger by providing a diaphragm with an opening shaped to fit about the heat exchanger, the opening forming a sealing lip. A clamping ring, which expands and contracts as a function of temperature is placed around...     

In a liquid cooling system comprising cold plates attached to their respective circuit modules, quick couplers are provided for connecting flexible hoses to these cold plates, a supply duct and a return duct to form strings of cold plates connected between the supply duct and the return duct. Valved...     

A multi-channel module with a plurality of chips is mounted on a multilayer circuit board and has a simple and highly reliable structure cooling system for cooling the heat generated by the chips consuming a large amount of electric power. The cooling system uses in the horizontal direction a coolant...     

ATE is mounted directly to a support surrounding and removably receiving probe cards of differing thickness. An electrically heated chuck having a variable heat transfer coefficient heat exchanging face confronting a liquid nitrogen supplied plenum exhibits a temperature that varies with electrical heater...     

A heat transfer member has a heat transfer unit mounted on a mounting sheet. The heat transfer unit comprises a plurality of layers of wire mesh laminated and bonded together and to the mounting sheet. The spaces between the wires of the mesh layers of the heat transfer unit permit liquid to pass through...     

A method that stress assembled circuit boards well beyond normal operational limits both with respect to supply voltages and temperature cycling. The circuit boards are transferred between a cold bath of inert liquid and a hot bath of inert liquid while the power voltages are being applied for short...     

Heat dissipating devices for electronic component semiconductor chips are provided in the form of channels or grooves which are either integrated in the underside of the semiconductor chip or are formed in an additional thin semiconductor chip which has larger dimensions than the component chip and which...     

The invention provides increased surface contact area for circuit board heat removal, without exposing the circuit board components to the coolant fluid. This is accomplished by compressing a heat conductive flexible membrane between adjacent circuit boards. The flexible membrane contains coolant fluid...     

A miniature heat exchanger. A small housing provides a heat exchanger surface, contains a spray shower head. A cooling fluid enters through a base plate and is sprayed through holes in the shower head on to the underside of the cooling surface. The heated coolant exists through exit holes in the nozzle...     

A system provides convective transfer from a workpiece to a flowing fluid. A gap is formed between the workpiece and a facesheet containing fluid supply nozzles and fluid return nozzles. The fluid is fed to the supply nozzles, travels a short distance within the gap adjacent to the facesheet, and exits...     

A three-dimensional microelectronic package for semiconductor chips includes alternating layers of wafer interconnect stacks and chip carrier modules. The wafer interconnect stacks provide electrical interconnections in the x, y, and z directions. The wafer interconnect stacks have conductive segments...     

An assembly for mounting circuit cards having high power electrical and optical alloy MCM chip devices installed thereon. The assembly has a central vertical coolant supply pipe extending from a pump to a heat exchanger unit through a refrigeration unit separated from the heat exchanger unit by circuit...     

A system provides for convective transferring of material between a workpiece and a flowing fluid which chemically reacts with the workpiece. A gap is formed between the workpiece and a facesheet. The fluid is fed to supply nozzles, travels a short distance within the gap adjacent to the facesheet and...     

A plurality of heat sinks assembled to form a rack in a lightweight box accommodate printed circuit cards between the heat sinks and circulate cooling oil through the heat sinks to drain the test heat from the boards quickly. Each heat sink includes a porous metal foam core configured in zigzag shape...     

A cooling system for a plurality of circuit boards, each circuit board having a substantially planar thermally conductive thermal sink having longitudinal sides and being in thermal contact with a plurality of electronic components dissipating heat, includes a heat exchanger for delivering heat to a...     

An arrangement for cooling electronic components in a system. Several circuit boards are connected to a backplane electrically and through heat pipes, which are mounted on the boards and provide connections between the electronic components on the board and the cooling system. The circuit boards, including...     

A flexible heat transfer device includes a closed flexible envelopment which is made of a plastic film and which has a receiving space provided therein. The envelopment has a first section and a second section spaced from the first section. The receiving space of the envelopment contains a heat transfer...     

A plug-in circuit card assembly for mounting high power electrical and optical components. The apparatus comprises a printed wiring circuit mounting high power electrical and optical components and connectors with conducting paths interconnecting the components and ones of the components with the connectors....     

A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which...     

A cooling hat for transferring heat from a surface or plurality of heat generating components to a flowing fluid includes a coldsheet, a plurality of manifold layers and springs. The coldsheet is typically a medium-thin metal sheet usually with fine fins or grooves to readily transfer heat to a coolant....     

A cooling structure for integrated circuits including a plurality of integrated circuits, and a wiring substrate for mounting these integrated circuits and forming connections to a power source and signals. A plurality of cylindrical pistons are provided, with each having an open upper portion, a pair...     

The pistons of a cold plate frame orient themselves as a result of being free to move along one axis and about two other axes by the reflowing of solder tinning on the external surfaces of the pistons and the walls of the recesses within which the pistons reside. As the pistons are permitted to move...     

A temperature controller to accurately control the temperature of a device under test (DUT) including a heat exchanger in heat exchange relationship with the DUT. A temperature sensor is received within the heat exchanger and is thermally isolated therefrom. This temperature sensor measures the temperature...     

A combination conductive and convective heatsink for use in an electronic module including a heatsink member having first and second major planar surfaces; each surface adapted for thermally engaging with an adjacent electronic circuit element. The heatsink member also includes a plurality of flow-through...     

A cooling structure for an integrated circuit that uses a liquid coolant to absorb heat directly from the integrated circuit includes a wiring substrate, an integrated circuit mounted on the wiring substrate, and a hollow cooling block, in which liquid coolant accumulates, disposed on a heat radiating...     

A heatsink or cold plate is provided with which power electronic components mounted to a surface of the cold plate can be cooled with a cooling fluid flowing through the cold plate. The cold plate generally consists of a relatively planar structure through which one or more passages are formed for directing...     

A cooling structure for integrated circuits including a plurality of integrated circuits, and a wiring substrate for mounting these integrated circuits and forming connections to a power source and signals. A plurality of cylindrical pistons are provided, with each having an open upper portion, a pair...     

A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and...     

A liquid-coolant cooling element for cooling heat-generating disk-shaped components includes a main body which is provided with at least one cooling plate. The cooling plate has a cooling channel led in a double spiral, the ends of which channel open respectively into a collecting chamber. The main body...     

A liquid cooled cooling device wherein occurrence of vibrations is controlled, the power for feeding water is lowered, and further, temperature variations around a heat generating section are prevented. The cooling device comprises: a jacket portion covering the outer peripheral portion of the heat generating...     

An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks....     

A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and...     

This invention relates to a vacuum processing method and apparatus. When a sample is plasma processed under a reduced pressure, a sample bed is cooled by a cooling medium kept at a predetermined temperature lower than an etching temperature, the sample is held on the sample bed, a heat transfer gas is...     

An apparatus and method for controlling the temperature of an object, in particular a semiconductor wafer support structure in a wafer processing chamber. A gas gap is created between the two adjacent objects of different temperatures. The pressure in the gap is adjusted to control the thermal conductivity...     

A miniature thermo-electric cooled cryogenic pump for removing residual water molecules from an inlet sample prior to sample analysis in a mass spectroscopy system, such as ion cyclotron resonance (ICR) mass spectroscopy. The cryogenic pump is a battery operated, low power (<1.6 watts) pump with a...     

A modular microchannel heat exchanger for cooling a heated region and a method for making the device. A first section of the device features an array of thin copper sheets which are etched with rows of elongated holes that pierce the sheets, coated with silver and held together with the holes aligned....     

A cooling system for a small computer has one or more heat transfer devices (12, 30) in intimate, heat-exchanging contact with heat-producing computer components. Liquid coolant is circulated through conduits from a reservoir (48) to the devices (12, 30). A radiator (42) is mounted on the outside of...     

A substrate holding apparatus is provided with a plate-shaped substrated holding unit including a first surface having plural protruding portions coming into contact with a plate-shaped substrate. The apparatus is a substantially flat second surface and adapted to support the substrate on the substrate...