Circuit board installation

4753287
Add to folder: View Folders  
Keywords to Highlight:

full-text

print

pdf

permalink

Inventors

Horne, David

Application #

111265

Filed

Oct-22-1987

Published

Jun-28-1988

Current US Class

165/185
165/80.3
165/80.4
257/713
257/719
257/722
257/E23.084
257/E23.094
361/705

International Classes

B22D 023/06

Field of Search

165/80.2 165/80.3 165/80.4 165/185 361/386 361/387 357/81

Assignee

BICC plc (London, GB2)

Examiners

Yeung; James C.

Attorney, Agent or Firm

Parkhurst & Oliff

US Patent References

4193445   Conduction cooled...
4235283   Multi-stud thermal...
4246597   Air cooled multi-ch...

Referenced by:

View Backward References

Citation

Cite This Patent

More From Subclass 80.4

4734820   Cryogenic packagi...
5050036   Liquid cooled integ...
5166606   High efficiency cry...
7019971   Thermal manage...
4138692   Gas encapsulated...
6313994   Extended surface a...
6038129   Cooling electronic...
5057968   Cooling system for...
5841634   Liquid-cooled baffl...
6234240   Fanless cooling syst...
5115858   Micro-channel waf...
5970729   Cooling apparatus
5329425   Cooling system
6041850   Temperature contro...
5097207   Temperature stable...
6666261   Liquid circulation...
3984861   Transcallent semic...
4977444   Semiconductor cool...
4971144   Liquid ribbon cooler
6212073   Heat sink
6845625   Reversible two-pha...
6688381   Multiscale transport...
6648064   Active heat sink
6749013   Heat sink
6530420   Heat carrier
6942020   Heat dissipation de...
6955214   Radiator with seam...
5343358   Apparatus for cooli...
6377457   Electronic assembl...
4149218   Minimum delay m...
6967842   Electronic device
4682566   Evacuated equipm...
5022462   Flexible finned hea...
4226281   Thermal conductio...
5028989   Semiconductor cool...
6457321   Spray cooling system
5673750   Vacuum processin...
6853554   Thermal connectio...
4107641   Liquid rheostat
6966363   Heat collector with...
6856510   Efficient cooler
4235283   Multi-stud thermal...
6867974   Heat-dissipating de...
6631077   Heat spreader with...
6822865   Cooling device for...
5245508   Close card cooling...
6452799   Integrated circuit c...
4912600   Integrated circuit p...
6795316   WDM add/drop mu...
5764482   Integrated circuit h...
6994829   Fluid processing d...
6648062   Heat sink-type cooli...
5539617   Liquid-coolant cool...
4193445   Conduction cooled...
6462949   Electronic enclosur...
6519149   Radiator mechanis...
4768352   Cooling structure fo...
6961243   CPU heatsink faste...
6064572   Thermosyphon-pow...
6639797   Computer having c...
5424916   Combination cond...
6529376   System processor h...
6292364   Liquid spray coole...
6501653   Arrangement of a...
6873526   Quiet "fan"
5390076   Cooling structure fo...
6991024   Electroosmotic micr...
5321888   Integrated lightwei...
 

More From Class 165

6691766   Cabinet cooling wit...
6515859   Heat sink alignment
5727618   Modular microcha...
4903756   Heat generator
5816314   Geothermal heat ex...
5934365   Heat exchanger
5503219   Gutter thawing arr...
6832644   Cooling module wit...
5165467   Heat storage means
4020896   Ceramic structural...
4833567   Integral heat pipe...
6404640   Liquid-cooled electr...
 
Abstract
A thermally conductive module for locally extracting heat from an individual electrical component of a circuit board installation comprises a tubular metal housing of high thermal conductivity closed at one end and having at that end a screw-threaded stud for securing the housing to and in thermal contact with a thermal conductor. A spring-loaded metal piston of high thermal conductivity is slidably mounted in the bore of and protrudes from the housing and has a throughbore extending through and opening into the exposed end face of the piston. A grease-like medium of high thermal conductivity is contained in the closed bore of the housing. When the housing is secured in thermal contact with a thermal conductor and the exposed end face of the piston is brought into thermal contact with an electrical component from which heat is to be extracted, the piston is urged against the action of its associated coil spring and grease-like medium exudes from the throughbore and flows between the exposed end face of the piston and the electrical component to provide an effective thermal contact therebetween.
 
Claims
What I claim as my invention is:

1. A thermally conductive module for locally extracting heat from an individual electrical component of a circuit board installation, which module comprises a tubular housing which is made of a material of high thermal conductivity and which is closed at one end; means at said closed end of the tubular housing for securing the housing to and in thermal contact with a thermal conductor; a spring-loaded piston of a material of high thermal conductivity slidably mounted in and protruding from the tubular housing, which piston has at least one throughbore extending through and opening into the exposed end face of the piston; spring means urging said piston in a direction away from said closed end of the tubular housing; and, contained in the bore of the tubular housing between said piston and said closed end of the tubular housing, a grease-like medium of high thermal conductivity, the arrangement being such that, when the tubular housing is secured to and in thermal contact with a thermal conductor and the exposed end face of the piston is brought into thermal contact with an electrical component from which heat is to be extracted, the piston is urged against the action of said spring means and said grease-like medium will exude from said at least one throughbore opening into the exposed end face of the piston and will flow between said exposed end face and the electrical component to provide an effective thermal contact between said electrical component and the exposed end face of the piston.



Description
BACKGROUND OF THE INVENTION

This invention relates to cabinets, cases and other enclosures for housing sub-racks or card frames carrying circuit boards and/or modules carrying other electrical components. A cabinet or other enclosure including such sub-racks or card frames and/or modules will hereinafter, for convenience, be referred to as a "circuit board installation of the kind described".

The developement of silicon chips has resulted in a substantial increase in the component density of individual circuit boards and/or modules of a circuit board installation of the kind described and the increased component density of each circuit board and/or module of the installation has resulted in a greater power output and hence higher operating temperatures.

Conventional methods of controlling the temperature of the enclosure of a circuit board installation of the kind described include normal convection, forced convection, e.g. fan cooling, liquid cooling, various forms of heat conductor or sink, and a combination of two or more of these methods.
 
  A cabinet (1) for stowage of electronic printed circuit boards (2,3,4) for example, is adapted for permanent installation in a vehicle structure by allowing...  A plug-in circuit card assembly for mounting high power electrical and optical components. The apparatus comprises a printed wiring circuit mounting high...