MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST)

A method of forming an insulator and electrode member is disclosed, in its preferred form, as including an insulator having a first face supporting a uniform height conductive layer. A plurality of first electrode members are formed in the conductive layer by etching away or otherwise forming an array...     

A method of preparing transparent artworks by forming a predetermined topological relief pattern by way of local layer-by-layer removal of the material on the side of the masking layer which is translucent to actinic radiation, with concurrent measurement of the optical phase difference between actinic...     

A method is provided for producing flat substantially monocrystalline ribbons, e.g. silicon ribbons for use in making flat solar cells. The ribbons are produced by growing substantially monocrystalline flat hollow tubes, and then excising the edge portions of the tubes so that the flat sides of the tubes...     

Means and method for forming a raised metallic relief wherein a metal foil affixed to a support film is selectively etched, affixed to a wood surface, and then exposed to a scanning concentrated laser beam to vaporize the support film and wood in areas unprotected by the metal sheet. The metal design...     

The mask blank is provided with a transparent coating layer interposed between a transparent substrate and a mask metal layer. The transparent coating layer is made of material which is resistant to an etching solution.

A process of producing a parallel type of stripe filter comprises the steps of: (a) forming a metal layer (I) on a transparent base plate into a striped configuration. (b) forming thereon a dichroic layer having predetermined spectral characteristics, (c) further forming a metal layer (II) on said dichroic...     

A metal abrading material formed from acid etching with a resist pattern comprising a plurality of polygonal shapes with accentuated corners dispersed in a pattern chosen to intermix cutting points with planing edges.

After exposure to radiation photoresist may be developed by a dry process using a gas plasma, preferably an oxygen plasma. The process can be used for chemical milling, photolithography, printed circuit board and photomask manufacture and it is particularly advantageous in the manufacture of semiconductors....     

Multi-level nylon pile fabrics having a selectively etched surface and a process of developing an etched effect that comprises selectively applying a chemical fiber etching agent to the surface of a level pile fabric, controlling the depth of penetration into said fabric and heating in the presence of...     

A method for producing printed circuits. An epoxy resin reinforced with glass fiber is used as basis material, coated with copper, drilled and activated. In one embodiment, the circuit diagram is applied after covering the non-desired regions with a resistance, by screen or photo printing. A nickel,...     

The disclosure relates to a method of making a pair of die plates having raised lands which cooperate to cut or crease material pressed between them. A line drawing of the desired pattern of cuts and creases is converted to coded information which is fed to the memory of an automatic machine tool. The...     

Bodies having conical structures with dimensions on the order of the wavelength of visible light are prepared by a specific process. This process involves the formation of a mask by depositing a material that forms the mask onto the body to be etched and choosing the mask material so that it does not...     

A method for etching a metallic sheet and apparatus thereof with a first step of forming an anticorrosive pattern defining apertures on one surface of the metallic sheet and an anticorrosive pattern defining smaller apertures than the apertures on the other surface of the sheet; a second step of lightly...     

To improve the adhesion of a nickel layer to a valve metal layer in a thin film electronic circuit, a boundary layer is created between the valve metal and the nickel layer. The boundary layer is created by oxidizing the valve metal surface and applying the nickel layer by cathode sputtering with sufficiently...     

A pattern is formed in rapid and continuous manner on aluminized polymer film by printing the aluminum surface with a sodium hydroxide-resistant material, which may be pigmented, contacting the non-overprinted areas of the aluminum with hot aqueous sodium hydroxide solution to dissolve the aluminum rapidly...     

A bubble domain device and the method of manufacturing microcircuits having multi-level conductor patterns, which includes forming on a substrate a horizontally extended first level conductor material pattern in pre-configured, relatively overwidth channels defined by a first insulator material layer...     

This disclosure concerns a process for increasing the etch rate of an aluminum and aluminum alloy chem-milling composition while increasing the tank life of the composition by adding sodium nitrate to a composition containing sodium hydroxide as the principal active ingredient.

A method for fabricating a precision fine-line die by chemical milling the working face of an etchable workpiece to form a plurality of raised die elements separated and bounded by a plurality of cavities, is comprised of the steps of forming an etchant-resistant surface pattern of boundary grooves penetrating...     

Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and a catalytic amount of pyrrolidone such as 2-pyrrolidone or N-methyl-2-pyrrolidone.

Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and a catalytic amount of .epsilon.-caprolactam.

Improved metal dissolution rates are obtained when using a solution containing sulfuric acid, hydrogen peroxide and certain primary diols.

A method for plasma etching of TiO.sub.2, using a mixture of oxygen and a fluorine-bearing species, preferably CF.sub.4. This mixture gives good selectivity over aluminum and photoresist, and approximately unity selectivity over silica or silicon nitride. Use of a chlorine-containing species is also...     

A television tube having an electron gun and an aperture mask with a plurality of line of sight openings in the aperture mask wherein the line of sight openings in the aperture mask are partially defined by material on the cone side surface of the aperture mask and partially defined by material on the...     

The invention relates to a method of manufacturing an optical grating from a body having a surface which is provided with equidistant grooves. In order to obtain cheap and deformation-resistant gratings, according to the invention a surface of a substrate is provided with a number of layers of substantially...     

A method of manufacture of a printed circuit board having plated-through holes interconnecting printed conductors formed on each of two external surfaces, includes the step of masking those areas of the external surfaces where solder will subsequently be required to adhere. The unmasked conductive areas...     

Formation of a plasma etch mask on a film on a substrate by photodecomposition of a gas at selective portions of the film's surface to deposit etch mask material and form the etch mask is disclosed. The photodecomposition by blanket illumination through a photomask and by direct write with a computer...     

In the interest of enhanced yield in the manufacture of "wafer-scale" integrated circuits an assembly of integrated circuit chips is made by placing chips on a substrate. Chips have beveled edges as produced by crystallographically anisotropic chemical etching, and the substrate has wells, grooves, or...     

A method of etching a plurality of identifying characters into a wire tag for macro-organisms is disclosed. The method includes the steps of coating the tag with photoresist, exposing a defined portion of the coated tag to light, the defined portion corresponding to the characters, removing a portion...     

A method for making an optical memory storage medium which has a transparent substrate with void cells of empty spaces and ablative material on the cell walls is disclosed. In one example, a base plate is coated with a masking layer. Pits are formed on the plate by mechanically stamping the masking layer...     

A computer aided printer-etcher has a computer connected electrically to a printer etcher unit, such that the printer etcher unit is controlled by the computer through the keyboard and computer memory. The printer etcher unit mounts an etching chamber within a cabinet. A conveyor within the cabinet defining...     

A method for making an optical memory storage medium which has a transparent substrate with void cells of empty spaces and ablative material on the cell walls is disclosed. In one example, a base plate is coated with a masking layer. Pits are formed on the plate by mechanically stamping the masking layer...     

A method for making an optical memory storage medium which has a transparent substrate with void cells of empty spaces and ablative material on the cell walls is disclosed. In one example, a base plate is coated with a masking layer. Pits are formed on the plate by mechanically stamping the masking layer...     

A process is disclosed which etches a workpiece, with an etching mask of a predetermined pattern formed on the surface of the workpiece, on an apparatus which includes a container for holding first and second electrodes opposite to each other and a magnetic field generator arranged on a side opposite...     

An improved method producing a lithium niobate waveguide device is described, and comprises; (i) providing an optical waveguide path on a lithium niobate substrate; (ii) depositing a layer of dielectric material on the substrate; (iii) depositing a layer of conducting material on the dielectric layer;...     

An improved metal etching process including preparation of a metal substrate, developing a photoresist on the substrate, coating the exposed substrate with electroless phosphorous nickel alloy, removing the developed photoresist and etching the then exposed substrate. The preparation for depositing the...     

A process and solution for selectively etching copper. The etching is effected by a nonaqueous solution of dimethyl sulfoxide and a halocarbon compound.

A wet etching process wherein the etchant bath is ultrasonically vibrated, preferably while a carrier member holding the workpiece to be etched is slightly agitated. An apparatus for practicing the process includes a first vessel for holding a coupling fluid; a second vessel for holding an etchant solution;...     

A substantially nitrate-free solution for milling products of refractory metals, especially titanium, which solution comprises: (a) about 5-100 g/l of ammonium bifluoride; (b) up to about 90 g/l of hydrochloric acid; and (c) a balance of water and impurities. Preferred embodiments of this aqueous solution...     

A procedure for planarizing a group II-VI composition which includes a resist and etch-back procedure wherein a thick resist coating relative to the degree of non-planarity is spun over a non-planar group II-VI layer to provide a planar resist surface. The resist is then etched back to the group II-VI...     

A predetermined pattern of a dielectric polymer is formed on a substrate from a mixture of prepolymers which are ethers of the reaction products of (a) a dicyclopentadiene and a phenol and (b) a dialdehyde and 3 to 4 moles of a phenol.

A predetermined pattern of a dielectric polymer is formed on a substrate from a mixture of prepolymers which are the ethers of the oligomeric condensation product of (a) dihydric phenol and formaldehyde and (b) a dialdehyde and 3 to 4 moles of a phenol.

A method of accurately applying maskant to a workpiece using one or more scanned laser beams and a maskant delivery device. The method includes the interaction of the laser beams with the maskant material while the material is in transit to, and after it has reached the surface of, the workpiece. Other...     

A process in which concave surfaces to form undercut edges can be made and the application of such process to making micromechanical devices. Concave surfaces forming undercut edges are made in a wall of a stationary structure extending from a planar surface by growing a convex bumper into the wall....     

The present invention discloses texturing of the slider air bearing surfaces of the magnetic heads in disk drives to reduce stiction that retards take-off and displaces critical lubricant in a magnetic head system. One embodiment of the present invention utilizes nonuniform etching of chemically identical...     

A lithographic method and a lithographic apparatus ar disclosed in which the height of a silicon wafer making up an object of lithography is accurately measured. A lithographic apparatus such as an electron beam apparatus having a height-measuring instrument built therein is effectively used for forming...     

The present invention is directed to a method for fabricating a monolithic ink jet printhead. The printhead has a substrate with a major surface and a plurality of ink channels formed on the major surface, with the ink channels each having a nozzle at one end and an inlet communicating with an ink manifold...     

A substantially nitrate-free solution for milling products of refractory metals, especially titanium, which solution contains: (a) about 5-100 g/l of ammonium bifluoride; (b) up to about 90 g/1 of hydrochloric acid; (c) a hydrogen inhibitor which may be either sodium chlorate or ammonium peroxysulfate;...     

Processes for producing cutting dies disclosed herein comprise a step of forming on a steel plate a resist, a first etching step of etching this steel plate to form a convex portion having a prescribed height thereon, and a second etching step comprising removing the resist extending from both ends of...     

A substantially nitrate-free solution for milling products of refractory metals, especially titanium, which milling solution comprises: (a) about 20-100 g/l hydrofluoric acid; (b) a hydrogen inhibitor selected from the group comprising of: about 55-650 g/l of sodium chlorate, about 180-650 g/l of ammonium...     

A dry etching method, wherein a multilayer film including one selected from tungsten, molybdenum, and a silicide thereof, as the first layer, and polycrystal silicon as the second layer underlying is formed on a silicon oxide insulation film, a substrate having a mask pattern on the multilayer film is...     

There is provided a method for anisotropic etching of a fine resist pattern at a practically useful etching rate wherein micro-loading effects are suppressed. If a resist layer is etched using an NH.sub.3 /N.sub.2 gas mixture, while the temperature of a sample wafer is controlled to be not higher than...     

A method and apparatus for the production of prostheses used in orthopaedic and trauma surgery for pinning broken bones wherein the method includes the steps of predetermining the shape of the article required, selecting a sheet material blank from which the article is formed, processing the blank by...     

A method of applying a coating to a fiber end retained in the holder is disclosed. A master is formed having an external geometry substantially identical to the geometry of the holder. A mask is formed by applying a thin coating of a mask material onto the master with a hole formed through the material...     

An etch process for etching copper layers that is useable in integrated circuit fabrication is disclosed which utilizes halides to react with copper, preferrably using photoenergizing and photodirecting assistance of high intensity ultraviolet light, to produce a product which is either volatile or easily...     

A method for making a groove of a precise width in a substrate material. The groove may have any cross-sectional shape. The groove is formed by initially etching the substrate material. The groove width is then measured. The measured groove width is compared to the desired groove width. Oxide is grown...     

A novel method for fabricating nanometer geometry electronic devices is described. Such Josephson junctions can be accurately and reproducibly manufactured employing photolithographic and direct write electron beam lithography techniques in combination with aqueous etchants. In particular, a method is...     

A dry etching method for forming a connection opening in a insulating film of a silicon compound formed on an Al-based interconnection layer. The dry etching method consists in etching an SiO.sub.2 interlayer insulating film on an Al-1% Si layer, in a magnetic micro-wave plasma etching device capable...     

A method of manufacturing a semiconductor device, which comprises steps of providing a substrate, forming an oxide layer of a metal material, which includes a tantalum or an alloy mainly containing a tantalum on the substrate, placing the substrate into a first chamber, activating an etching gas which...     

A dry-etching method comprising the steps of forming carbon film on a substrate to be etched, forming a resist pattern on said carbon thin film, selectively etching said carbon film using said resist pattern as a mask by a plasma of a gas mixture of a gas containing fluorine atoms and a gas containing...     

The invention provides a method for substrate preparation prior to applying photoresist to the substrate. A substrate, such as a TEOS-based silicon dioxide or silicon nitride film, is selected and treated with reactive oxygen. The reactive oxygen can comprise ozone or ozone plasma, for example. After...     

Disclosed herein is a manufacturing method for a lead frame, including the steps of forming a lead element, forming masks on a first surface and a second surface of the lead element, etching the lead element, and removing the masks. According to this method, the lead frame can be manufactured at low...     

A method of flattening diamond, including: forming a flat coating comprising a material different from diamond, on a surface of diamond having unevenness; and removing the coating and the unevenness of the surface of diamond by dry etching under a condition such that both of the coating and the diamond...     

A method for etching a Pt film of the present invention includes the steps of: forming an etching resistant film on a Pt film, followed by patterning; etching the Pt film by using as an etching mask the etching resistant film and by using, as an etching gas, a mixed gas containing oxygen gas and chlorine...     

A process of producing a diffraction grating includes the steps of forming a coating layer on a first diffraction grating layer of a resin formed on a substrate without damaging the diffraction grating layer, removing a portion of the coating layer positioned on the first diffraction grating layer by...     

A mask (12) is applied to a silicon carbide substrate (11) in order to etch the substrate (11). The material used for the mask (12) has a Mohs hardness factor greater than 4 in order to prevent sputtering material from the mask (12) onto the substrate (11). An oxygen and sulfur hexafluoride plasma is...     

A pressure sensor (11) and its method of fabrication include etching a V-groove (19) in a first surface (16) of a first substrate (12), bonding a second substrate (24) to the first substrate (12), thinning the second substrate (24) to form a diaphragm (32) overlying the V-groove (19), and etching a port...     

An optical fiber support member is made by forming on a monocrystalline silicon substrate member (26) a first mask layer (27) of, e.g., silicon dioxide. The first mask layer is masked and etched to a first depth to define a pattern of first (29) and second (30) features, the first features defining the...     

A full duplex radio having improved properties is obtained by using asymmetric surface acoustic wave (SAW) filters, the filters are composed of series and parallel coupled SAW resonators. Asymmetry is obtained by covering either of the series or parallel resonators of each filter with a dielectric layer...     

This invention concerns a method of fabricating a surgical cutting tool and a tool fabricated by such method. The surgical cutting tool (20) comprises a base (21) and an upstanding cutting blade (22), fabricated by locating a mask (32) of a shape corresponding to that of the required cutting blade on...     

A processing method comprises: a first step of depositing on a substrate which is a specimen a film of any one of a semiconductor, a metal and an insulator; a second step of subjecting the surface of the film deposited in the first step, to irradiation with a beam having a given energy to produce a physical...     

The present invention provides a pattern formation method comprising the steps of forming a plating film of a metal insoluble in an etching solution on a substrate, forming a photoresist film on the plating film, forming a photoresist pattern by exposing the photoresist film to light using a predetermined...     

A resistivity map is prepared depicting the sheet resistance of a resistive film formed on a wafer as a function of position on the wafer. The resistivity map includes a plurality of zones each of which encompasses a specific range of resistivities of the resistive film. A mask containing numerous patterns...     

A method of manufacturing a semiconductor device including the steps of: (a) transporting a semiconductor wafer into a plasma process system, the semiconductor wafer having a semiconductor layer, a field insulating film and a gate insulating film formed on the semiconductor layer, said gate insulating...     

A hybrid stamp structure for lithographic processing of features below 1 micron is described, comprising a deformable layer (14) for accommodating unevenness of the surface of a substrate, and a patterned layer on the deformable layer in which a lithographic pattern is engraved. The stamp structure is...     

A small glass electrode and process for preparation thereof, the small glass electrode having a bonded structure and comprising a reference electrode composed of silver/silver chloride, a glass substrate having a pad embedded therein, the pad being composed of gold or platinum and circuit-connected to...     

A single stage expose/etch partial etching process fabricates at least two areas of differing remaining thicknesses in a substrate. The process comprises (a) applying a resist mask to the substrate; (b) patterning the mask in a first area with a plurality of first mask openings and first mask land features...     

This invention relates to a method of making fiber optic interferometers. First, a plurality of optical fibers are bundled and placed into a sleeve. The bundle is then encased in the sleeve and the fiber ends are cut and polished. An area of cladding is stripped back from the polished fiber ends and...     

A method of making a dielectric substrate array for conducting a plurality of reactions in parallel in a number of wells, the method comprising: forming a first passage and a second passage each extending through a dielectric substrate, the substrate having a first surface and an opposing second surface;...     

A method for fabricating a dielectric device including a capacitor, a pyroelectric infrared detector, and the like is disclosed. The method comprises the steps of etching a dielectric substance film formed on a substrate to form a predetermined pattern with an etchant comprised of hydrofluoric acid and...     

A method for making an electro-optic device or electro-optic display system having enhanced performance over conventional flat-panel displays, wherein a planarizing polymeric resin layer is spin-cast on a flat-panel backplane containing pixel circuitry. The spin-cast layer is cured to provide a flat...     

Apparatus for assembling microstructures onto a substrate through fluid transport. The apparatus includes a vessel that contains the substrate, a fluid, and microstructures. The substrate has at least one recessed region thereon. The microstructures being shaped blocks self-align into the recessed regions...     

A method for preparing the air bearing surface of a slider for etch patterning including the steps of applying a first thin film to a carrier, applying a second thin film to the carrier, the first thin film and the second thin film separated by a recess, each of the first and second thin films having...     

A method for manufacturing phase-shifting masks utilizing a photolithographic process and sidewall spacers to fabricate a phase-shifting layer. The method provides precise control over the shape and size of the resulting phase-shifting layer, and thus, simplifies photomask production.

Disclosed is a method of fabricating electronic components on a semiconductor substrate by etching features in the substrate through a mask including apertures which are separated by a prescribed spacing. Etching is continued until the etched features merge into a single channel. This technique can be...     

A method of fabricating nanometric structures on a substrate by dry etching includes setting the substrate at a temperature at which condensation of etching gas products of etching gas decomposed, recombined and reacted, or products of reactions between the etching gas and substrate material starts to...     

Techniques for fabrication of small-scale metallic structures such as microinductors, microtransformers and stents are described. A chemically active agent such as a catalyst is applied from an applicator in a pattern to an exterior surface of an article, metal is deposited according to the pattern and...     

Surface micromachining and bulk micromachining are employed for realizing a porous membrane with bulk support for a microparticle filter. The filter is manufactured by a process employing a thin film etch-stop, in which the bulk substrate is etched using a first etching process followed by etching of...     

A method for etching of sub-quarter micron openings in insulative layers for contacts and vias is described. The method uses high resolution DUV photolithography. By using a thin layer of photoresist to pattern a hardmask, full advantage of the high resolution can be attained. The hardmask in turn, is...     

A method for producing a tapered waveguide is produced using an undercut-type shadow mask having an overhanging part. The shadow mask includes a photoresist layer having the overhanging part and a metal layer for supporting the photoresist layer on a substrate. After the shadow mask is provided on the...     

The present invention provides a substrate treatment method to be performed after the steps of forming a desired resist pattern on a substrate and etching thereof, wherein said method comprises steps of: (I) removing the resist pattern on the substrate using a remover solution principally containing...     

A single-mask process for fabricating enclosed, micron-scale subsurface cavities in a single crystal silicon substrate includes the steps of patterning the substrate to form vias, etching the cavities through the vias, and sealing the vias. Single cavities of any configuration may be produced, but a...     

A magnetoresistive sensor fabricated by creating first antiferromagnetic layers on the upper surfaces of a lower-gap layer the antiferromagnetic layer having first and second exposed portions separated by a track width formed by the upper surface of the lower-gap layer. Then, a free magnetic layer, a...     

Micromechanical component and a method for its production having vertically arranged layers made of metallic materials, with the layers adhering firmly to one another at least in part. The layers of the micromechanical component are attached to each other via intermediate layers, with the intermediate...     

A novel method of dual damascene etching is disclosed. It is shown that the performance of ULSI circuits can be improved by shrinking interconnect dimensions through the use of dual damascene processes, using hard-masks to achieve vertical walls and hence smaller spaces in the damascene structures, introducing...     

In a method for producing a semiconductor dynamic sensor, an anisotropic etching mask is formed on a (100) crystal orientation silicon substrate with a main portion and form-compensation portions formed at the corners of the main portion. Each of the form-compensation portions has a rectangular shape...     

A method of fabricating a contact window. On semiconductor substrate having a conductive region, a dielectric layer is formed to cover the substrate and the conductive region. A gettering layer is formed on the dielectric layer. A hard mask layer is formed on the gettering layer. The hard mask layer...     

A method of producing a circular island even if pollution by dirt or dust affects a mask pattern. A circular island is formed by etching silicon oxide film formed on a silicon substrate using a resist mask, and an acute angle portion of unevenness of the pattern outline comprising silicon oxide film...     

Multicurved copper films having fine-line elements suitable for radome applications can be improved by cutting the elements with reproducible precision to close tolerance (typically line widths of 3-10.+-.0.25 mil) using an etchant comprising a concentrated saline solution of CuCl.sub.2.

A substrate is coated with a chemically amplified negative resist, thereby forming a resist film on the substrate. The chemically amplified negative resist includes: a polymer containing an acrylic acid as a polymerization unit; an acid generator for generating an acid when irradiated with extreme ultraviolet...     

An entire surface of a semiconductor substrate is coated with photoresist and baked. A circuit pattern area in the region excluding a peripheral region of the semiconductor substrate is subjected to normal exposure while a non-circuit area (photoresist remaining area) in the peripheral region of the...