Superabrasive wheel with active bond

6485532
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Inventors

Andrews, Richard M.
Buljan, Sergej-Tomislav
Ramanath, Srinivasan
Geary, Earl G.

Application #

748563

Filed

Dec-21-2000

Published

Nov-26-2002

Current US Class

051/297
051/307
051/309

International Classes

B24D 011/00

Field of Search

451/56 451/541 451/544 451/548 51/297 51/307 51/309

Assignee

Saint-Gobain Abrasives Technology Company (Worcester, MA)

Examiners

Rachuba; M.

Attorney, Agent or Firm

Porter; Mary E.

US Patent References

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4180048   Cutting wheel
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4334895   Glass bonded abra...
4362535   Sintered metal bon...
4378233   Metal bonded grin...
4471026   Ternary alloys in br...
4534773   Abrasive product a...
4591364   Abrasive materials
4624237   Diamond saw
4655795   Abrasive tool for ho...
4671021   Grinding tool
4685440   Rotary dressing tool
4798026   Thermostable abra...
4951427   Refractory metal ox...
5102621   Ternary brazing al...
5104424   Abrasive article
5313742   Highly rigid comp...
5385591   Metal bond and m...
5505750   Infiltrant for metal...
5512235   Supported polycryst...
5573447   Method and appar...
5791330   Abrasive cutting tool
5832360   Bond for abrasive t...
5846269   Wear resistant bon...
5855314   Abrasive tool contai...
6012944   Quick connector an...
6019668   Method for grindin...
6056795   Stiffly bonded thin...
6093092   Abrasive tools
6102789   Abrasive tools
6200208   Superabrasive whe...
 

Referenced by:

View Backward References

Other References

K. Subramanian, T.K. Puthanangady, S. Lui, "Diamond Abrasive Finishing of Brittle Materianls An Overview" Supertech Superabrasives Technology, 1996, World Grinding Technology Center, Norton Company Worcester, MA pp. Cover sheet-25.* Stasyak, L.F., Kizikov, E.D., Kushtalova, I.P. "Structure and Properties of a Diamond-Containing Composition Material with a Tungsten-Free Matrix for a Truing Tool" Metal Science and Heat Treabement, vol. 28, No. Nov.-Dec. 1986, pp. 835-839.* Mathewson, W.F., Ratterman, E., Gillis, K.H. "An Analysis of the Coated Diamond/Bond System" Diamond Business Section, General Electric, Detroit, Michigan.* Kushtalova, I.P., Stasyak, L.F., Kizikov, E.D., "Development of a Diamond Containing Material with a Tungsten-Free Matrix for Dressing Tools", Soviet Journal of Superhard Materials, v 8 n Nov. 01, 1986 pp. 48-51.* K. Subramanian, T. K. Puthanangady, S. Liu, "Diamond Abrasive Finishing Of Brittle Materials An Overview," Supertech Superabrasives Technology, 1996, World Grinding Technology Center, Norton Company, Worcester, MA, pp. Cover sheet-25. Stasyuk, L.F.; Kizikov, E.D.; Kushtalova, I.P.; "Structure and Properties of a Diamond-Containing Composition Material with a Tungsten-Free Matrix for a Truing Tool", Metal Science and Heat Treatment, vol. 28 No. Nov.-Dec. 1986 pp. 835-839. Mathewson, W.F.; Ratterman, E.; Gillis, K.H.; "An Analysis of the Coated Diamond/Bond System" Diamond Business Section, General Electric, Detroit, Michigan. Kushtalova, I.P.:Stasyuk, L.F.; Kizikov, E.D.; "Development of a Diamond Containing Material With a Tungsten-Free Matrix for Dressing Tools ", Soviet Journal of Superhard Materials v 8 n 1, Nov., 1986 pp. 48-51.

Citation

Cite This Patent

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Abstract
A straight, thin, monolithic abrasive wheel formed of hard and rigid abrasive grains and a sintered bond including a metal component and an active metal component exhibits superior stiffness. The metal component can be selected from among many sinterable metal compositions. The active metal is a metal capable of reacting to form a bond with the abrasive grains at sintering conditions and is present in an amount effective to integrate the grains and sintered bond into a grain-reinforced composite. A diamond abrasive, copper/tin/titanium sintered bond abrasive wheel is preferred. Such a wheel is useful for abrading operations in the electronics industry, such as cutting silicon wafers and alumina-titanium carbide pucks. The stiffness of the novel abrasive wheels is higher than conventional straight monolithic wheels and therefore improved cutting precision and less chipping can be attained without increase of wheel thickness and concomitant increased kerf loss.
 
Claims
What is claimed is:

1. A method of cutting a work piece comprising the step of contacting the work piece with an abrasive wheel comprising a straight, grain-reinforced abrasive disk having a uniform width in the range of about 20-2,500 .mu.m, consisting essentially of about 2.5-50 vol. % abrasive grains and a complemental amount of a bond comprising a metal component and an active metal which forms a chemical bond with the abrasive grains on sintering, the active metal and abrasive grains being present in an amount effective to produce a grain-reinforced abrasive disk having an elastic modulus value of at least 10% higher than the elastic modulus value of an abrasive disk of same composition but free of active metal.



Description
FIELD OF THE INVENTION

This invention relates to thin abrasive wheels for abrading very hard materials such as those utilized by the electronics industry.

BACKGROUND AND SUMMARY OF THE INVENTION

Abrasive wheels which are both very thin and highly stiff are commercially important. For example, thin abrasive wheels are used in cutting off thin sections and in performing other abrading operations in the processing of silicon wafers and so-called pucks of alumina-titanium carbide composite in the manufacture of electronic products. Silicon wafers are generally used for integrated circuits and alumina-titanium carbide pucks are utilized to fabricate flying thin film heads for recording and playing back magnetically stored information. The use of thin abrasive wheels to abrade silicon wafers and alumina-titanium carbide pucks is explained well in U.S. Pat. No. 5,313,742, the entire disclosure of which patent is incorporated herein by reference.

As stated in the No. '742 patent, the fabrication of silicon wafers and alumina-titanium carbide pucks creates the need for dimensionally accurate cuts with little waste of the work piece material. Ideally, cutting blades to effect such cuts should be as stiff as possible and as thin as practical because the thinner the blade, the less waste produced and the stiffer the blade, the more straight it will cut. However, these characteristics are in conflict because the thinner the blade, the less rigid it becomes.
 
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