Hidden surface laser shock processing

6566629
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Inventors

Dulaney, Jeffrey L.
Clauer, Allan H.
Toller, Steven M.
Walters, Craig T.

Application #

307117

Filed

May-7-1999

Published

May-20-2003

Current US Class

219/121.74
219/121.85

International Classes

B23K 026/00

Field of Search

219/121.74 219/121.85 219/121.68 219/121.69

Assignee

LSP Technologies, Inc. (Dublin, OH)

Examiners

Evans; Geoffrey S.

Attorney, Agent or Firm

Knuth; Randall J.

US Patent References

4303137   Method for making...
4475027   Optical beam hom...
4476374   Rotary indexing la...
4885751   Device for modulati...
5131957   Material properties
5160556   Method of hardeni...
5225650   Process and device...
5371767   System and method...
5525429   Laser shock peenin...
5571575   Laser shock metho...
5601737   Surface treating pr...
5719376   Method for laser he...
5846054   Laser shock peene...
6002102   Hidden surface las...
 

Referenced by:

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Citation

Cite This Patent

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Abstract
A laser processing method for processing a hidden surface of a workpiece, the hidden surface being disposed within a recess having an opening. The method includes inserting a reflective member into the recess and directing a pulse of coherent energy to reflect off of said reflective member and impact the hidden surface of a workpiece to create a shock wave. Alteratively a surface of the recess may be modified to laser shock process the hidden surface. In one particular embodiment, the reflective member is specifically shaped toprovide diction of a pulse of coherent energy to a hidden surface so that a substantially uniform energy density is applied to the hidden surface. In an additional embodiment, the method is optimized for preventing damage to the reflective member. In one particular embodiment, the reflective member is composed of a fluid.
 
Claims
What is claimed is:

1. A laser shock peening method for processing a hidden surface of a workpiece, the hidden surface disposed within a recess having an opening, the method comprising the steps of:

inserting a reflective member into the recess;

providing means for minimizing damage to the reflective member; and

directing a pulse of coherent energy to reflect off of the reflective member and impact the hidden surface of the workpiece to create a shock wave therein.

2. The laser shock peening method of claim 1, wherein said step of providing means for preventing damage to the reflective member includes the step of filling a majority of the opening with the pulse.



Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the use of coherent energy pulses, as from high power pulsed lasers, in the shock processing of solid materials, and, more particularly, to methods for improving properties of solid materials by providing shock waves therein where the laser beam impacts the solid material on a hidden surface. The invention is especially useful for enhancing or creating desired physical properties such as hardness, strength, and fatigue strength.

2. Description of the Related Art

Known methods for shock processing of solid materials, particularly laser shock processing solid materials, typically using coherent energy as from a laser, orient the laser beam normal, i.e., perpendicular to the workpiece.

When particular constraints of processing are created, based on the shape of the material or other geometric factors such as when attempting to laser shock harden integrally bladed rotors (IBR's), blind bores, slots, or dovetail sections, the laser beam may not have a direct, line of sight access to the area to be shock processed.
 
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