Overlay control for laser peening

6841755
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Inventors

Dykes, Steven E.
Clauer, Allan H.
Dulaney, Jeff L.
Lahrman, David F.
O'Loughlin, Mark

Application #

372526

Filed

Feb-21-2003

Published

Jan-11-2005

Current US Class

219/121.6
219/121.85

International Classes

B23K 026/00

Field of Search

219/121.6 219/121.83 219/121.84 219/121.85 219/121.61 219/121.62

Assignee

LSP Technologies Inc. (Dublin, OH)

Examiners

Heinrich; Samuel M.

Attorney, Agent or Firm

Knuth; Randall J.

US Patent References

5735044   Laser shock peenin...
6094260   Holographic interfe...
6183882   In plane deflection...
6254703   Quality control plas...

Referenced by:

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Citation

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Abstract
A method of controlling the application of laser peening overlays on the surface of a workpiece to reduce the variability of shock waves generated therein, comprises applying an energy-absorbing overlay to a portion of the surface of a workpiece, measuring the thickness of the energy-absorbing overlay in at least one location on the energy-absorbing overlay, applying a transparent overlay material over the energy-absorbing overlay, measuring the thickness of the transparent overlay in at least one location on the transparent overlay, determining if the measured values for each overlay is within a specified range, and directing a pulse of coherent energy to the workpiece to create a shock wave therein when the measured values are within the specified range.
 
Claims
What is claimed is:

1. An apparatus for monitoring and controlling the thickness and uniformity of the energy absorbing overlay and the transparent overlay, in a laser peening system comprising:

a material applicator for applying an energy absorbing overlay onto the a workpiece;

a material applicator for applying a transparent overlay over said coated portion;

a measurement device to measure the thickness of said energy absorbing overlay and said transparent overlay;

a measurement device to measure the uniformity of said energy absorbing overlay and said transparent overlay;

a tamping device to alter said thickness and said uniformity of said energy absorbing overlay and said transparent overlay;



Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the use of coherent energy pulses, as from high-peak-power pulsed lasers used for the laser peening of solid materials and, more particularly, to methods and apparatus to control the application of the overlays applied for laser peening (also called laser shock peening, laser shock processing, and shock processing). The invention is especially useful for reducing the variability of the thickness of the overlays applied to the surface of the workpiece being laser shock peened.

2. Description of the Related Art

Old methods for shock processing of solid materials typically involve the use of high explosive materials or high-pressure gases, which are used to accelerate a plate, that strikes the solid material to produce shock waves therein. Such methods have several disadvantages. For example: (a) it is difficult and costly to shock process non-planar surfaces and complicated geometries, (b) storage and handling of the high explosive materials and high pressure gases pose a hazard, (c) the processes are difficult to automate and thus fail to meet some industrial needs and (d) high explosive materials and high pressure gases cannot be used in extreme environments such as high temperatures and high vacuum.
 
  Glazing panels such as vehicle glazing panels bonded to a supporting frame are released by firstly arranging light energy delivery means adjacent the panel...  A number of new laser patterns are defined by laser scribing the material. This produces new laser patterns which have not previously been known.