Methods

A spreading-resistance silicon thermistor having high-precision values of resistance and temperature coefficient of resistance (TCR) is produced by a high-volume, low-cost, photolithographic technique, wherein multiple thin-film contacts are tested and selectively trimmed to permit computerized control...     

A laser-trimmed film resistor wherein the laser kerf terminates in an area outside the electrical current path across the resistor. FIELD OF THE INVENTION This invention relates to film resistors. More particularly, this invention relates to laser-trimmed thin and thick film resistors containing a laser...     

A ceramic green sheet material is metallized by laminating a thin organic material, preferably MYLAR, to a ceramic green sheet surface, and then employing an electron beam to define a predetermined pattern of openings extending through the organic material and selectively into and through the green sheet....     

A wafer of semiconductor material having a plurality of units defined on its face is subdivided by treating the wafer, on its back or reverse side, in the kerf regions between the units, where division of the units is desired, such that the material of the wafer in the treated kerf regions is converted...     

The speed and direction of rotation of an electronically commutated brushless D.C. motor is controlled by utilizing a resolver to provide both phase locked servo feedback and motor commutation. The resolver in response to orthogonal signal voltages on its primary coils, provides a signal whose phase...     

An opto-electronic apparatus for sensing the position or inspecting the condition of a target, which is capable of at least partially reflecting light in a scattered manner, includes an incident light source and means to direct light from the source in a narrow incident beam onto the target along an...     

Means and method for forming a raised metallic relief wherein a metal foil affixed to a support film is selectively etched, affixed to a wood surface, and then exposed to a scanning concentrated laser beam to vaporize the support film and wood in areas unprotected by the metal sheet. The metal design...     

An element of an integrated circuit, such as an ion implanted region or a metal layer, may be laser trimmed without exposing P-N junctions or other circuit elements not to be trimmed to damage by the laser through use of the present protection process and structure. In the process, an oxide through which...     

A method for laser trimming of resistors which includes sputter depositing or vaporizing resistor material in a limited area but the resistor geometry and trimming location is designed to achieve a maximum resistor trimming range with a minimum substrate area occupied by the resistor. A cermet resistor...     

A laser beam is used to provide rapid, clear and permanent marking of plastic lenses.

A laser-assisted machining process for the machining of materials which are normally difficult to work employs a laser source and associated reflecting means which focus the laser beam onto two distinct areas of the workpiece material to effect localized heating thereof and assist the formation of shavings...     

An electrode assembly for a compact high vacuum pulsed gas discharge laser comprises an elongated cathode and a coextensive anode spaced apart in a direction transversely of the flow of gas to define a discharge gap. Each of the electrodes is connected at a plurality of equally spaced points along its...     

An LSI fabrication process employs pulsed laser energy to selectively tailor individual logic elements of which the building blocks of an LSI array may be configured and to selectively interconnect these laser-configured building blocks. On an LSI chip, an array of universal logic devices or building...     

Repair of opens and shorts in semiconductor packages and chip metallurgy by initial conversion of shorts into opens by severing of lines about the shorts, followed by interconnection of conductor patch lines to the good circuit portions through an insulating layer.

Thin-film microcircuit structures passivated with silicon nitride are provided in which included electrical components containing nickel, chromium or other nitride-forming metals are encapsulated in an oxide material, preferably silicon oxide. The metal-containing components are thus prevented from reacting...     

A thin film polarizer for dividing electromagnetic energy into two mutually orthogonal components with a high degree of selectivity. A plurality of wire grids having an interelement spacing of less than one wavelength is supported by a substrate of electrically insulative material. The substrate is invisible...     

A method for producing a magnetic head, comprising the step of irradiating peripheral parts other than a track portion and/or a slider portion with a laser beam so as to selectively remove surface parts of the irradiated parts, thereby to form the track portion and/or the slider portion. According to...     

A process and apparatus for selectively removing a plastic layer laminated to a metal substrate. A high intensity laser beam is precisely directed to open areas of a thin metallic mask overlying the plastic layer. During removal of the plastic layer from the metal substrate, the system also removes the...     

Removing some of the insulating material between commutator bars of flat or cylindrical commutators, hereinafter referred to as "undercutting, " by exposing the commutator surface to one or more energy beams of a frequency and an energy level and for a time which are sufficient for removing the dielectric...     

Apparatus and methods for inscribing workpieces for the fabrication of masks and direct fabrication of microcircuits are described. The invention is primarily concerned with correcting for positional errors and to this end two coaxial beams (20,32) are directed towards a worktable from opposite sides...     

An improved laser-assisted machining process has special application to difficult-to-machine materials such as the titanium alloys and high temperature superalloys. A layer of material to be removed by a cutting tool is made weaker by drilling a series of holes using a pulse laser beam ahead of the cutting...     

A method for marking an identification at pre-selected intervals along a length of cable by laser marking device comprises the steps of sequentially moving longitudinally spaced-apart portions of the cable along a marking platen and positioning and operating the laser to mark the stationary cable portion...     

A method for patterning layers of material on a substrate without photoresist by using a selective sublimation process. Differences in thermal conductivity of materials underneath a layer of material to be patterned cause patterning by sublimation over areas of low thermal conductivity, initiated by...     

In order to provide a better way of kerfing a gemstone such as a diamond, a high energy, high pulse rate, low order mode, laser beam is employed to cut the kerf. Apparatus for kerfing a gemstone can in general comprise a laser, reflecting means which bends the incident beam through a substantial angle...     

The process provides a method of decorating spectacle frame parts by removing a jacket material from the core according to a decorative pattern, thus exposing a bright surface of the core. The jacket material is removed by a laser beam, the energy of which lies below the energy level required to weld...     

An electronic circuit package in which a resistor network is readily installed and remains accessible for laser trimming after final assembly of the package. A substrate is provided having a circuit pattern on a surface thereof and terminating in electrical terminals for connection to external circuitry....     

A method of and apparatus for machining a workpiece such as ceramic with an energy beam, e.g. a beam of energetic ions or a laser beam, produced by a beam generator. A carriage having the workpiece securely mounted thereon and the beam generator are relatively displaced to cause the beam to move in a...     

An electrical film resistor. The film resistor includes a substrate, resistive film, and first and second terminals. The first terminal includes a first electrode. The second terminal includes second and third electrodes. The second electrode is close to the first electrode, and the third electrode is...     

A resistor formed by a film of resistive material deposited on a dielectric substrate is trimmed by removing resistive material along a line such that the film is divided into at least two discrete areas, one, and only one, of which areas includes two terminal portions of the film.

A method for trimming precision resistors which includes forming a helical groove in a conductive film coating on a cylindrical core. Final trimming includes forming discrete circular depressions in the film coating by using a pulsed laser. This method enables the manufacture of precision resistors having...     

A process for the modification of substrate surfaces is described, wherein etching or deposition at a surface occurs only in the presence of both reactive species and a directed beam of coherent light.

Method of removing stock from difficult to machine workpieces comprising directing a first laser beam (LB.sub.1) at a workpiece along a first axis to produce a first kerf. A second laser beam (LB.sub.2) is directed at the workpiece along a second axis which intersects the first axis to produce a second...     

A dry etching method according to the present invention is composed of the steps of evacuating the reaction chamber in which a substrate to be etched is set, introducing etching gas into the reaction chamber, causing the substrate to adsorb the introduced etching gas and thereafter evacuate the etching...     

An electrical film resistor. The film resistor includes a substrate, resistive film, and first and second terminals. The first terminal includes a first electrode. The second terminal includes second and third electrodes. The second electrode is close to the first electrode, and the third electrode is...     

The invention contemplates use of a scanning laser characterized by ultraviolet radiation to achieve controlled ablative photodecomposition of one or more selected regions of a cornea. Irradiated flux density and exposure time are so controlled as to achieve desired depth of the ablation, which is a...     

An electronic device manufacturing method including a step of forming a layer member to be patterned, which is a conductive metal layer member, a laminate member of a transparent conductive layer and a non-transparent or reflective layer or a non-single-crystal semiconductor layer member, and a step...     

A conductor path is formed by providing an insulating substrate having a surface region which is formed of an insulating composition. The insulating composition contains an organic polymeric material and at least one metal source. The metal source is a metallic powder and/or an organic compound chemically...     

Materials whose elemental constituents are selected from groups III and V of the Periodic Table are photochemically etched in a reducing environment. Etching is carried out by illuminating a halogenated hydrocarbon gas, e.g. methyl iodide, with ultra-violet light in the vicinity of the material. The...     

In a method of isolating segments of contacts on a substrate by laser scribing, a laser is directed on portions to be removed through the substrate.

A fused silica glass optical fiber 10 is machined by a pulsed infrared laser beam 20 from a carbon dioxide laser 22 focussed by a germanium lens 24. The beam has a power density of about 70,000 watts per square centimeter at the focussed machining region b and is pulsed at about one pulse per second...     

In a method of making an electronic device having at least a transparent conductive layer, which includes at least a step of forming a transparent conductive layer member and a step of forming a transparent conductive layer by patterning the transparent conductive layer member using a spot-shaped or...     

Electrical circuitry 32 is comprised of a plurality of layers 30, 100, each layer 30, 100 including one or more electrical pathways 36, 38, each layer 30, 100 also including insulation 34 for insulating at least part of one layer 30 from another layer 100. The pathways 36, 38 comprise repeating patterns...     

An apparatus and method for machining heat softenable materials such as metals, alloys and certain thermoplastic materials. In one form, radiation generated by a laser or electron gun is directed against a portion of a workpiece immediately adjacent that portion thereof which is being machined by a cutting...     

A process for providing terminations at the ends of chips for multilayer capacitors such a MLC capacitors includes applying thin films of metallization at the opposite ends of each chip and over the surface of the chip between the ends, and thereafter removing a porton of the thin films of metallization...     

Improvements are provided in the structures of cutting tools and methods for producing such tools. The tool structures include providing a select portion or portions of a cutting tool, such as one or more portions adjacent a cutting or forming portion or edge or plurality of edges of a tool, of amorphous...     

A method of manufacturing a photovoltaic device, in which a plurality of photoelectric conversion elements comprising a first electrode layer, a semiconductive layer and a second electrode layer are laminatedly arranged on an insulative surface of a substrate and said photoelectric conversion elements...     

A method of laser trimming an electronic component to achieve a desired electronic characteristic including entering into a controller the desired value of the characteristic of the component being trimmed, measuring the beginning value of the characteristic of the component being trimmed, determining...     

A distributed wye resistor network fabricated on an integrated circuit substrate includes a resistive body coupled between two terminal elements. The resistive body includes a plurality of slots extending therethrough between the terminal elements to form a plurality of discrete resistive links. The...     

A laser scribing system and method is described. In the system, a film formed on a substrate is irradiated with laser beam which is focused on a limited portion of the film in order to remove the portion and produce a groove. Laser beam used for eliminating the portion of film formed on a substrate is...     

In a method of making an electronic device having at least a transparent conductive layer, which includes at least a step of forming a transparent conductive layer member and a step of forming a transparent conductive layer by patterning the transparent conductive layer member using a spot-shaped or...     

A laser scribing method is described. A laser beam is deprived of its tail which appears along a groove which is engraved by scribing. The scribing can be performed without forming protrusion along the edge of grooves engraved by the scribing. The depriving of the tail is accomplished by coating the...     

A shorted component 10 is provided on a module 18 whereby the shorted component 10 is trimmed to either a capacitor 22 or an inductor 30. In the same step, the capacitor or inductor is further trimmed to a predetermined value of reactance.

This invention relates to a proces of manufacturing and adjusting a compound resistor. The compound resistor is formed of a resistive material forming a predominant portion of the resistance and having a small negative temperature coefficient of resistance coupled with an adjustment material having an...     

A laser trimming apparatus calibration system including controlling a laser beam positioning mechanism to move a laser beam to a desired nominal laser position, imprinting a mark on a medium to establish an actual laser position, comparing the imprinted mark with the desired nominal position and producing...     

A laser peening apparatus and method for peening a workpiece utilizing a laser beam is described. The system includes a foil aligned with a surface of the workpiece to be peened and lasing the aligned foil surface. The foil absorbs energy from the beam and a portion of the foil vaporizes, which creates...     

The surface of the resin on a semiconductor device is subjected to a marking by a pulsed laser having an energy density of 3 to 60 J/cm.sup.2 and a pulse width of 0.1 ms or less. By applying the laser beam to the surface a resin encapsulation, the resin can be instantaneously burnt and vaporized, as...     

A method of machining a workpiece at a plurality of working positions, employing a pulsed laser under external control, comprises effecting continuous relative movement of the workpiece and the laser the rate of movement being synchronized with the laser firing so that on successive laser pulses the...     

This invention relates to a method for manufacturing a highly reliable stress detector. Conventionally, a step of bonding and securing magnetic elements (4) to a driven shaft (1) receiving a stress was needed, so that a high technique was needed to secure the magnetic elements (4) uniformly at the entire...     

A small scintillation crystal has a surface which is coated with a thin layer of aluminium or cobalt. The aluminium is etched with identification markings, as by a laser.

In a method of making an electronic device having at least a transparent conductive layer, which includes at least a step of forming a transparent conductive layer member and a step of forming a transparent conductive layer by patterning the transparent conductive layer member using a spot-shaped or...     

In a method of making an electronic device having at least a transparent conductive layer, which includes at least a step of forming a transparent conductive layer member and a step of forming a transparent conductive layer by patterning the transparent conductive layer member using a spot-shaped or...     

A method of modifying the reflectivity and emissivity of a surface of a material comprises the steps of irradiating the surface with a beam of coherent pulsed radiation at a power sufficient to generate a surface plasma and scanning said beam across said surface. Successive pulses of radiation are caused...     

A layer of material is removed from a surface of a bonded abrasive product by directing a laser beam at the surface, causing the laser beam to traverse the surface to damage the surface to a desired depth and removing the damaged material remaining on the surface, for example by lapping. The bonded abrasive...     

A method of forming a metallization pattern on a solar cell substrate having an outer layer of a selected dielectric such as silicon nitride, silicon dioxide, or glass, by removing selected portions of the dielectric layer with a laser beam. This laser exposure drives portions of the P/N junction positioned...     

A method of manufacturing a circuit board, comprising the steps of providing an electric conductor on one surface of a substrate made of flexible synthetic resin and selectively irradiating a laser beam onto the substrate from the other surface of the substrate so as to sublimate a portion of the substrate...     

A process for polishing a contact lens surface with a laser beam without substantial ablative photodecomposition and with the fluence of the laser beam being less than 0.3JCM.sup.-2 and the number of applied pulses greater than 200.

Techniques for adjusting the surface acousic wave velocity of a packaged SAW device are described. A first technique involves depositing a film from a cover of the device onto a surface wave propagating surface thereby providing a localized region on said surface where the acoustic properties and, hence,...     

The relative photoemission threshold properties of conductive materials are used as a basis for selectively etching conductive materials in the presence of other conductive materials. An irradiation beam of pre-selected wavelength is used to generate photoemitted electrons locally which in turn create...     

Resist (402) is exposed by a beam of positrons (320) is an apparatus (300) similar to an electron beam lithography machine.

A hot forged article of a preselected profile is produced by heating a forging blank to elevated temperature and forging the blank at the elevated temperature between closed dies, to produce a forging of about the preselected profile of the final forging, but having flashing thereon. The flashing is...     

A structure for use in making an easy open package comprises a thermoplastic sheet material. The sheet material has a strip of reflective metal on one surface. Over the metal strip on the opposite surface of the sheet material is a score line. The score line may be formed by a laser. The metal strip...     

Laser marker apparatus for marking indicia onto a substrate includes an exit lens having a focal length, a plurality of lasers, a plurality of turning mirrors, and at least one directing mirror. The surface of the substrate to be marked is positioned generally at the focal plane of the lens. The plurality...     

Disbonded two-level (bimetal) metal interconnections are removed by first vaporizing metal in the lower level that is exposed by the narrower metal on the upper level using a pulsed laser beam having an energy density above a vaporization threshold in a first beam width and then vaporizing the remaining...     

A golf ball is marked by directing laser light to a selected surface portion of the ball, thereby causing the exposed surface layer portion to change its color. The discolored portion forms an identification mark on the ball surface. The mark is durable and aesthetically attractive while the ball maintains...     

A laser marking apparatus comprises a pulse laser oscillator which emits a linearly polarized laser beam; a transmission type liquid crystal mask which displays a pattern to be marked on an article in one of a positive pattern display mode and a negative pattern display mode by dots arranged in a matrix...     

A consumable laser mask for forming a visual lens, especially a contact lens, in which at least a portion of the light passing through the lens is focussed by diffractive means. The laser mask is shaped to provide the diffractive means in the finished lens, and is made from a polymeric material with...     

A non-contact method to impart a texture to a surface using laser irradian uses an excimer laser to illuminate a sample immersed in a halocarbon ambient thereby initiating a photo/thermal chemical reaction which etches the sample only in the area illuminated with sufficient laser fluence. The resulting...     

A method for forming a curved edge on a lens comprising the steps of providing an annular laser beam and irradiating a first peripheral region of the lens with the laser beam to remove a layer of lens material from the first peripheral region through ablative photodecomposition. Next, a second peripheral...     

Improved methods for modifying target surfaces through ablation which result in a reduction of ablation debris redeposition on the target surface are disclosed.

A consumable laser mask for forming a visual lens, especially a contact lens, in which at least a portion of the light passing through the lens is focussed by diffractive means. The laser mask is shaped to provide the diffractive means in the finished lens, and is made from a polymeric material with...     

Printed circuits which reside on three dimensional surfaces are disclosed. Using a first technique, a three dimensional surface is formed on a substrate having a high melting point or permitting a high degree of infrared energy transmittance. The surface contains a layer of metalization maintained at...     

Improved methods of modifying target surfaces through ablation are disclosed resulting in a reduction of debris redeposition on the target surface.

A needle machining apparatus which presents a stock needle to a device for boring a hole in the needle. The apparatus also includes a needle feeding apparatus which provides high speed feeding of blank needles for the needle machining apparatus. A method for high speed feeding of needles for subsequent...     

A target surface is photoablated by a laser beam by the steps of (a) directing a beam of pulsed UV radiation at a bisecting line on the target surface; (b) scanning the beam in a direction away from the bisecting line to a first edge of the target surface, (c) rotating the target 180 degrees, (d) returning...     

An apparatus for preparing a medium for use in a printing process supports the medium (2) for rotation about an axis. A head (6) is mounted for movement parallel to the axis and includes means to direct a laser beam onto the surface of the medium. The laser beam engraves or exposes the series of cell...     

A system for for removing a band of coating material from a first end of a coated cylinder having a second opposite end including ablating the band of coating material with a laser beam and directing an annular curtain of compressed fluid against the band in a direction away from the second opposite...     

A process and product and apparatus are disclosed wherein a laser is used to form a conical tapered tip on a catheter product. The catheter is placed on an insertion needle prior to the formation process, thus eliminating the problems associated with wearing out forming tooling. The process and product...     

The method (10) of the present invention includes a first step of designing an image to be reproduced by the stamp pad (12). A pre-inked rubber material (14) derived from an ink and plasticizer premix is then super-cooled to immobilize the ink constituents (28) and harden the pre-inked material (14)....     

A phantom cornea for calibrating surgical lasers is formed by superimposition of thin-films of alternating colors. After ablation by a laser beam, the resulting spherical cavity appears as a pattern of nested circles whose concentricity and spacing reflect the alignment and intensity of the laser beam....     

A method of providing a clear image on a component including the steps of providing a transparent member having first and second opposite sides, providing a layer of opaque material on the second side of the transparent member and ablating away a predetermined pattern of the opaque layer by directing...     

A laser ablation apparatus and method removes undesired portions of a workpiece. An industrial laser generates a beam of optical energy and directs the beam at the workpiece. A mechanism in the path of the beam for shapes the cross-section of the beam and includes first and second linear actuators on...     

In a method for forming a lead frame (1) from a metallic plate, a metallic plate (11) is first etched to form outer leads (4) and outer portions (3b) of inner leads of the lead frame (1). Inner portions (3a) of the inner leads (3) are then laser-cut under the condition that a joint portion (7) is left...     

Laser marking of pigmented fluoropolymer substrates is enhanced by using titanium dioxide pigment coated with organo silane.

There is disclosed a substrate reclaim method comprising directing laser energy at a coating covering a part of an outer surface of a substrate, wherein the outer surface has a shiny finish, thereby removing with the laser energy all of the coating on the outer surface and etching with the laser energy...     

This invention relates to the modification of lasing medium surfaces, such as crystals, to reduce the internal reflections that contribute to amplified spontaneous emission (ASE) losses. A laser ablation treatment involves focusing an optical irradiation means on a target surface having desired ablation...     

A semiconductor capacitor used to test for contaminants in a fabrication line is created by: forming a layer of insulating material on a semiconductor substrate, forming a layer of conductive thin film on the layer of insulating material, and laser patterning an area of the conductive thin film. Laser...     

A method and an apparatus for making a moving body of material (26). The method includes the steps of directing at the moving body a high energy density beam (46,58), concentrating the beam so as to produce an illuminated spot at a location on or within the moving body, and moving the spot in accordance...     

The present invention provides a dual-laser deposition process for thin film deposition. Specifically, the present invention provides a method of laser deposition for the growth of in-situ particulate free films. The preferred embodiment includes the spatial overlap on a target of two laser pulses of...     

A die having a metallic block with a depression, the depression having at least one cross-sectional transition zone, at least one laser shock peened surface encompassing at least a portion of the zone, a region having deep compressive residual stresses imparted by laser shock peening (LSP) extending...     

The invention relates to a method of manufacturing a replication master tooling article suitable for manufacturing replicated articles by machining a substrate surface with laser energy to produce a plurality of geometric structures in the substrate, the geometric structures having side surfaces extending...