Scanning technique for laser ablation

5396045
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Inventors

Opdyke, Kenneth L.

Application #

166341

Filed

Dec-13-1993

Published

Mar-7-1995

Current US Class

219/121.69
219/121.8

International Classes

B23K 026/00

Field of Search

219/121.68 219/121.66 219/121.8 219/121.69 219/121.78

Assignee

Bausch & Lomb Incorporated (Rochester, NY)

Examiners

Evans; Geoffrey S.

Attorney, Agent or Firm

Krasnow; David M.

US Patent References

4455893   Method in produci...
4563565   Method for forming...
4965430   Method of laser ma...
5257706   Method of cleaning...
5331131   Scanning techniqu...

Referenced by:

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Citation

Cite This Patent

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Abstract
A target surface is photoablated by a laser beam by the steps of (a) directing a beam of pulsed UV radiation at a bisecting line on the target surface; (b) scanning the beam in a direction away from the bisecting line to a first edge of the target surface, (c) rotating the target 180 degrees, (d) returning the beam to the bisecting line on the target surface, (e) scanning the beam in a direction away from the bisecting line to the edge opposing the first edge of the target surface; and repeating steps (c), (d) and (e) such that the entire target surface is scanned. This scanning process simultaneously clears away deposited debris and avoids subsequent debris accumulation during the photoablation process.
 
Claims
I claim:

1. A method for photoablating a target surface comprising the steps of: a) directing a beam of pulsed UV radiation at a bisecting line on the target surface; b) scanning said beam in a direction away from said bisecting line to a first edge of the target surface; c) rotating the target in increments; d) returning the beam to said bisecting line on the target surface; e) scanning the beam in a direction away from said bisecting line to the edge opposing said first edge of said target surface; and repeating steps c), d) and e) in sequence such that the entire target surface is scanned.

2. A method for photoablating a target surface comprising the steps of: a) directing a beam of pulsed UV radiation at a bisecting line of the target surface; b) scanning said beam in a direction away from said bisecting line to a first edge of the target surface; c) rotating the target 180 degrees; d) returning the beam to said bisecting line of the target surface; and e) scanning the beam in a direction away from said bisecting line to the edge opposing said first edge of said target surface, such that the entire target surface is scanned.



Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to the field of laser modification of target surfaces through ablation and methods for smoothing surfaces using lasers, as well as targets modified by such ablative techniques.

2. Background of the Invention

The use of laser beams to modify surfaces is known. In the early 1980's, it was discovered that pulsed lasers emitting in the ultraviolet frequency range could affect a target surface through ablative photodecomposition (APD). Later it was found that by using APD, layers of target material could be removed on the order of about one micron of target material per pulse.

It was further noted that APD did not significantly alter the characteristics of the newly exposed material immediately below the ablated material. This phenomenon has been explained as being due to the UV laser providing enough energy in a short enough period of time to actually break the covalent bonds of the polymeric target materials without heating the substrate. (See U.S. Pat. Nos. 4,417,948 and 4,568,632). Further scanning techniques using APD are disclosed in U.S. Pat. No. 5,061,342.
 
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