Internal photolysis reactor

4454835
Add to folder: View Folders  
Keywords to Highlight:

full-text

print

pdf

permalink

Inventors

Walsh, Peter J.
Bottka, Nicholas

Application #

417272

Filed

Sep-13-1982

Published

Jun-19-1984

Current US Class

118/50.1
118/712
118/719
118/723R

International Classes

C23C 013/08

Field of Search

118/50.1 118/719 118/723 118/688 118/689 118/712 427/54.1 427/38 427/39

Assignee

The United States of America as represented by the Secretary of the Navy (Washington, DC)

Examiners

Lawrence; Evan K.

Attorney, Agent or Firm

Beers; R. F., Skeer; W. Thom, Pritchard; Kenneth G.

US Patent References

4066037   Apparatus for depo...
4161418   Ionized-cluster-bea...
4183780   Photon enhanced r...
4223048   Plasma enhanced...
4226897   Method of forming...
4226898   Amorphous semico...
4262631   Thin film depositio...

Referenced by:

View Backward References

Citation

Cite This Patent

More From Subclass 719

6585823   Atomic layer depos...
5094885   Differential pressur...
5711813   Epitaxial crystal gr...
6562128   In-situ post epitaxia...
4810473   Molecular beam e...
5324361   Apparatus for coati...
5697749   Wafer processing a...
6290824   Magnetic film form...
5281295   Semiconductor fabr...
6712908   Purified silicon pro...
5569328   Silicon semiconduc...
5074245   Diamond synthesizi...
5016567   Apparatus for treat...
4048955   Continuous chemic...
5016562   Modular continuou...
6319327   MOCVD system
5785762   External combustio...
5302209   Apparatus for man...
5088908   Continuous vacuu...
5135635   Sputtering apparatus
6649020   Plasma processing...
6068088   Releasable semico...
5234528   Vertical heat-treatin...
6491802   Magnetic film form...
4276855   Coating apparatus
6503379   Mobile plating syst...
5268033   Table top parylene...
5910219   Can coating system
5423971   Arrangement for co...
5762745   Substrate processin...
5222074   Thermal decompos...
4624214   Dry-processing app...
4465416   Wafer handling m...
6749086   Pressurized liquid...
4936251   Vapor-phase reacti...
4803947   Apparatus for form...
5336325   Enhanced vertical t...
4825806   Film forming appa...
4403002   Vacuum evaporati...
6736016   Paint booth air dete...
6148761   Dual channel gas...
4613515   Fingerprint develo...
5424097   Continuous vapor d...
4450786   Grooved gas gate
5753092   Cylindrical carriag...
4649860   Vacuum evaporatio...
6808592   High throughput pl...
6054014   Exhaust apparatus
5445484   Vacuum processin...
6287386   Carousel wafer tra...
6379095   Robot for handling...
5851296   Vacuum processin...
6799910   Processing method...
5445675   Semiconductor pro...
6627039   Plasma processing...
6837936   Semiconductor ma...
6267820   Clog resistant inject...
4715316   Apparatus for plati...
4808291   Apparatus for coati...
5007372   Vacuum depositing...
5738771   Thin film forming...
 

More From Class 118

4626447   Plasma confining...
6468354   Semiconductor waf...
5234862   Thin film depositio...
3981791   Vacuum sputtering...
5103761   Coating apparatus
5720814   Photoresist coating...
5065692   Solder flux applica...
6440320   Substrate processin...
5089110   Data storage disk a...
4803947   Apparatus for form...
4094268   Apparatus for grow...
4159355   Foam bonding
 
Abstract
A method and apparatus which permits photolysis of compounds without use of indows to permit unlimited growth of epitaxial layers. Epitaxial layers can include growth of crystals such as iron. A two section reactor chamber with a common opening between the sections is used for the internal production of high energy ultraviolet light to carry out the photolysis. The first section of the reactor chamber containing the substrate to be coated is connected to a source of molecular compound vapor capable of undergoing a photolytic change. A feed system provides a rare gas flow through the second section at low pressure past an electrode discharge system to produce ultraviolet light. The ultraviolet light passes through the opening between the sections and interacts with the molecular compound causing photolytic decomposition of the molecular compound and deposition of the desired epitaxial layer on the substrate. Upon exiting the reactor chamber, the molecular compound used for the photolysis is recaptured via a cold trap while a residual gas analyzer permits the exhaust cycle in the reactor chamber to either be vented or recycled depending on the level of purity of the rare gas.
 
Claims
What is claimed is:

1. An apparatus for growing epitaxial layers by photolysis comprising:

a reactor chamber divided into two sections, said sections having a common opening between them;

a sample holder in the first of said two sections for holding a given substrate on which an epitaxial layer is to be grown;

an electrode discharge system in said second section of said reactor chamber for producing predetermined voltage potential;

means for supplying a rare gas to said second section of the reactor chamber, said rare gas emitting light of a desired spectrum range due to electrical discharge of said voltage potential through said rare gas;

means for supplying a molecular compound vapor to said first section of the reactor chamber for coating said substrate on said sample holder with a given molecular compound that undergoes a photolytic change when exposed to said desired spectrum through said opening; and



Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention pertains to methods of growing thin film layers. In particular, this invention pertains to growing layers of molecules using photolysis to deposit materials such as iron, silver, and compounds available through interaction of molecular compounds with ultraviolet light. Specifically, the present invention is for an apparatus using photolysis that does not require windows and can be used to produce sustained photolytic reactions.

2. Description of the Prior Art

An important technique for the control deposition of thin films of metal, semiconductors, or insulators is the decomposition of compounds containing the desired molecule. This decomposition must occur at or near a suitable substrate in a controlled atmosphere. Examples of the desired molecule are Ag, ZnS, and TiO.sub.2 for a metal, semiconductor, or insulator. The compounds containing the molecules should be relatively stable so they can be handled easily. Inorganic compounds containing the desired molecule have often been used as the deposition vehicle. It is desirable to have the compound and the vapor or gaseous phase so that it can be manipulated easily within pressure, flow, or vacuum systems.
 
  An improved magnetic gas gate is adapted to operatively interconnect two adjacent chambers, in the first chamber of which process gases are introduced...  A reduced capacitance electrode assembly for use in an alternating current plasma system provides reduced input capacitance to an associated tuning network....