Two-axis magnetically coupled robot

5656902
Add to folder: View Folders  
Keywords to Highlight:

full-text

print

pdf

permalink

Inventors

Lowrance, Robert B.

Application #

548945

Filed

Oct-26-1995

Published

Aug-12-1997

Current US Class

118/719
318/568.1
318/568.12
318/640
901/20

International Classes

G21K 005/10; B25J 009/14

Field of Search

318/560-646 414/744.1 414/732 414/749 414/225 414/744 156/643 156/345 198/471.1 198/476.1 204/298

Assignee

Applied Materials, Inc. (Santa Clara, CA)

Examiners

Ip; Paul

Attorney, Agent or Firm

Kenyon & Kenyon

US Patent References

4813846   Inserting device for...
4819167   System and method...
4908095   Etching device, an...
4955590   Plate-like member...
5007784   Dual end effector r...
5065495   Method for holding...
5080549   Wafer handling sys...
5092728   Substrate loading a...
5121705   Loading lock for ch...
5178512   Precision robot app...
5178638   Pressure-reduced c...
5195866   Conveying apparat...
5229615   End station for a p...
5292393   Multichamber inte...
5310410   Method for processi...
5324155   Wafer handling sys...
5445491   Method for multich...
 

Referenced by:

View Backward References

Citation

Cite This Patent

More From Subclass 719

5324361   Apparatus for coati...
4699082   Apparatus for che...
5083364   System for manufa...
5470389   Apparatus for form...
6627039   Plasma processing...
5102279   Continuous vacuu...
5413663   Plasma processing...
6979367   Method of improvin...
4357364   High rate resist pol...
5626677   Atmospheric pressu...
5911834   Gas delivery system
4622918   Module for high va...
 

More From Class 118

5863327   Apparatus for form...
4787550   Automatic solderin...
5020475   Substrate handling...
6605320   Streak-reducing co...
5431737   Interchangeable C...
4401054   Plasma deposition...
5777300   Processing furnace...
5460851   Spray deposition of...
5976312   Semiconductor pro...
5090361   Coating apparatus
4539933   Chemical vapor de...
5238517   Production of lami...
 
Abstract
A robot having a pair of magnetic couplings that each couple a motor in a cylindrical first chamber to an associated cylindrical ring closely spaced from the cylindrical wall of said first chamber. The robot includes a mechanism to convert rotation of each of these rings into separate motions of the robot. In the preferred embodiment, these separate motions are radial and rotational.
 
Claims
I claim:

1. A robot comprising:

a motor chamber;

first and second arm member assemblies, each supported by the motor chamber at a first end thereof for circumferential movement about a common axis;

the first and second arm member assemblies each having a second end coupled to a common robot element; and

a drive mechanism mounted in the motor chamber, the drive mechanism having drive members, each coupled to a respective one of the first and second arm member assemblies to controllably move the first ends of the first and second arm assemblies:

i) in a same circumferential direction to cause the common robot element to revolve around the common axis, and



Description
In the figures, the first digit of a reference numeral indicates the first figure in which is presented the element indicated by that reference numeral.

BACKGROUND OF THE INVENTION

This invention relates in general to robots for use in integrated circuit production and relates more particularly to a robot that is magnetically coupled to reduce particulate contamination within one or more process chambers.

Integrated circuit processing technology is continuously concerned with reducing the feature size of circuits to increase the amount of circuitry that can be packed onto an integrated circuit of a given size and to increase the speed of operation by reducing the distance that signals need to travel within such circuits. Particulates of diameter even several times smaller than the feature size of a component can cause failure of the IC if a particulate was present at a critical location in the IC during an important process step. This problem is particularly acute for large area ICs such as microprocessors and >4 megabit memories because such ICs have an increased area over which a critical defect can occur.
 
  A plasma processing apparatus comprising: a vacuum container; an evacuation means for keeping the interior of the vacuum container at a pressure not higher...  A film forming apparatus includes a film forming chamber in which a film is formed on a substrate at a film forming position, a plurality of load lock...