Vapor deposition apparatus

4226208
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Inventors

Nishida, Keijiro
Kakei, Mitsuo
Kamiya, Osamu
Sekimura, Nobuyuki

Application #

928435

Filed

Jul-27-1978

Published

Oct-7-1980

Current US Class

118/50.1
118/503
118/504
118/706
118/719
118/724
118/725
118/726
118/730
118/733
414/939

International Classes

C23C 013/08

Field of Search

118/706 118/719 118/724 118/725 118/730 118/733 118/50.1 118/503 118/504

Assignee

Canon Kabushiki Kaisha (Tokyo, JP)

Examiners

Pianalto; Bernard D.

Attorney, Agent or Firm

Toren, McGeady and Stanger

US Patent References

3981791   Vacuum sputtering...

Referenced by:

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Citation

Cite This Patent

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Abstract
An apparatus for vacuum deposition of a thin film onto the surface of a substrate includes a vacuum container formed by a base plate, a cylindrical side wall and a top plate to accommodate at least four movable sealing caps each having a space adapted to confine a batch of substrates on a carrier of dome shape. The caps move around the center of the base plate. When the caps are stopped to cover respective openings provided through the base plate, there are established a pre-heating, a vapor depositing, a cooling and an air locking chamber, and the batch of processed substrates in the air locking chamber is moved to the outside of the apparatus without disturbing the vacuum in the container. Next, the air locking chamber, after having received a new batch of unprocessed substrates at the space of the cap thereof, is sealed from the ambient atmosphere, and all the caps are advanced one step ahead. The controlled atmosphere in the lower section of the vapor depositing chamber remains almost unchanged during this time to insure that uniform, thin-film layers of deposited material are applied to the substrates. Further, to eliminate fluctuation in quality among manufactured lots, there is provided a novel evaporant feeding mechanism.
 
Claims
What is claimed is:

1. A vacuum processing apparatus comprising:

(a) a housing forming a main vacuum container;

(b) a driving shaft;

(c) vacuum chamber forming means for forming a plurality of independent vacuum chambers located within said main vacuum container, said vacuum chamber forming means comprising:

(i) cover means located within said housing and being rotatively mounted on and controlled by said driving shaft for forming said independent vacuum chambers, said cover means at least being covered by a vacuum within said main vacuum container, and

(ii) sealing means for keeping said independent vacuum chambers air tight;

(d) hanger means for supporting articles to be processed within each of said independent vacuum chambers;



Description
BACKGROUND OF THE INVENTION

This invention relates to an apparatus for depositing a thin-film layer upon an optical or electric circuit element or magnetic substrate, and more particularly to improvements of such apparatus with respect to uniform film characteristics.

It is known to provide a vapor deposition apparatus capable of processing a number of batches of substrates continuously at one cycle of bell jar operation in a turret form, as, for example, disclosed in Japanese Utility Model No. Sho 38-25633 issued Nov. 27, 1963. In FIG. 1, a sectional view of this apparatus appears. The apparatus includes a vapor depositing chamber 1 mounted on the under surface of a round base and communicating the interior 2 of an enclosure 17, in the form of a bell jar, through an opening which is provided through the wall of the base. A shaft 6 which protrudes through the base at the center of the area thereof rotatably supports a turret 8 on which a number of batches of substrates 10 in carriers of dome shape 12 are situated to be coated. After the interior 2 and chamber 1 have been evacuated by a pump 14, each of the batches of substrates 10 is heated to a predetermined temperature by a respective radiant energy heater 18, then advanced one step ahead to lie above the vapor depositing chamber 1, and then an evaporant material is heated by a heater 4 to form an evaporant. After a thin-film layer has been applied on the surface of each of the substrates above the chamber 1, the turret 8 is rotated one step to process the next batch of substrates 10. The completion of coating of all the batches of substrates 10 is followed by a cooling step which is then followed by the opening of the bell jar 17 with the help of an oil hydraulic machine 19 to remove the batches of processed substrates 10 and replace them with a number of new batches of unprocessed substrates. Thus, the turret type vapor depositing apparatus has disadvantages of consuming a long time per one substrate to be processed and of making it difficult to control the properties of the applied thin-film layer produced in different cycles of bell jar operations due to the repeated evacuation and exposure to the ambient atmosphere of the vapor depositing chamber. To avoid these disadvantages, coating apparatus of the in-line type have been proposed in U.S. Pat. Nos. 3,568,632 and 3,656,454 to Cawthon and Schrader respectively in which a coating chamber, evacuated chamber, heating chamber, cooling chamber and vacuum tight chamber are positioned in line, and individually sealed by valve plates so that the chambers have respective atmospheres controlled independently of each other. This arrangement is, however, associated with an alternate disadvantage of increasing the size of the apparatus.
 
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