Ultra-pure, non-reactive, elevated-temperature seal assembly

5971402
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Inventors

Northrop, Clay W.
Dunn, Michael R.

Application #

961954

Filed

Oct-31-1997

Published

Oct-26-1999

Current US Class

277/608
277/611
277/627
277/650

International Classes

F16J 015/16

Field of Search

277/608 277/611 277/627 277/628 277/650 277/946 277/915 392/489 392/331 392/325 219/546 285/911 285/125.1

Assignee

Trebor International, Inc. (West Jordan, UT)

Examiners

Knight; Anthony

Attorney, Agent or Firm

Madson & Metcalf

Referenced by:

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Citation

Cite This Patent

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Abstract
Sealing assemblies are illustrated for heaters, pumps, conduits, and the like for handling process fluids used in the semiconductor-processing industry. Clean, particle-free, nonreactive, non-trapping, ultra-pure, thermally tolerant, sealed systems are required to maintain process fluids with contaminant levels below parts per billion, or even trillion. A lip seal connects a tube, having a lip at each end, to a face of a creeping material. A creeping fluorocarbon sealing material may form the interface for reducing stress concentrations on the tube, and for providing a consistent reliable seal between the lip and the creeping face. A face seal between creeping faces may be effected by a creeping sealant there between. The faces may be loaded entirely by their own creeping structural materials. No flanges are required. In certain embodiments, retaining rings may be provided for preventing unrestrained creep of sealing assemblies. Heat soaking may accelerate primary creep and expanded fluorocarbon materials may provide creeping sealants having inherent dimensional stability in at least one dimension without relying on fillers or fibers of other materials.
 
Claims
What is claimed and desired to be secured by United States Letters Patent is:

1. An apparatus for sealing connections between ultra-pure, non-reactive conduits, the apparatus comprising:

a conduit comprising a wall having a wall thickness and a wall center, the wall being formed of a high purity, non-reactive material for conducting a fluid maintained in a highly purified condition;

a header formed of a high purity, non-reactive, polymeric material for exchanging the fluid with the conduit;

a sealant, formed of a first creeping material positioned to extend between the conduit and the header and to extend from a position inside the conduit to an ambient external to the conduit, the creeping sealant being free to creep toward a joint region between the conduit and the header in response to pressure of the fluid in the conduit;



Description
BACKGROUND

1. The Field of the Invention

This invention relates to semiconductor processing technology and, more particularly, to novel systems and methods for sealing joints, conduits, pumps, and heaters carrying ultra-pure fluids for processing operations.

2. The Background Art

Chemically clean environments maintained for handling pure de-ionized (DI) water, acids, chemicals, and the like, must be maintained free from contamination. Leakage into or out of a liquid must be eliminated. Moreover, leaching and chemical reaction between any contained fluid and the carrying conduits must be eliminated.

In particular, the semiconductor manufacturing industry relies on numerous processes. Many of these processes require transportation and heating of DI water, acids and other chemicals. Whereas other industries may require purities on the order of parts per million of contaminants, the semiconductor industry may require purities on the order of parts per trillion.
 
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