Adsorption-type cooling apparatus

6474099
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Inventors

Tanaka, Masaaki
Inoue, Satoshi
Sato, Hideaki
Ishii, Katsuya
Nagashima, Hisao
Honda, Shin
Suzuki, Takahisa

Application #

734845

Filed

Dec-11-2000

Published

Nov-5-2002

Current US Class

062/476
062/480

International Classes

F25B 017/08

Field of Search

62/480 62/481 62/476 62/477 62/335 62/101 62/106

Assignee

Denso Corporation (Kariya, JP)

Examiners

Esquivel; Denise

Attorney, Agent or Firm

Harness, Dickey & Pierce, PLC

US Patent References

5157938   Three-stage sorptio...
5351493   Thermally driven r...
5463879   Heat cascading re...
5775126   Adsorptive-type refr...

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Abstract
The present invention provides an adsorption-type cooling apparatus comprising first, second, third, and fourth adsorption devices filled with a coolant and contain adsorbents which adsorb evaporated coolant and desorb the adsorbed coolant during heating. Adsorption cores provide heat exchange between the adsorbents and a heat medium, and evaporation and condensation cores provide heat exchange between heating medium and the coolant. A cooling device in which heating medium cooled in the evaporation and condensation cores circulates and cools the object of cooling. A heating means supplies a high-temperature heat medium to the first-fourth adsorption devices. A cooling means supplies a low-temperature heat medium which has a temperature lower than that of the high-temperature heat medium to the first-fourth adsorption devices. Also, a switching control means is provided which switches between multiple states.
 
Claims
What is claimed is:

1. An adsorption-type cooling apparatus comprising:

first, second, third, and fourth adsorption devices, each of said first, second, third, and fourth adsorption devices are filled with a coolant and contain an adsorbent which adsorbs evaporated coolant and desorbs adsorbed coolant during heating, each of said first, second, third, and fourth adsorption devices having an adsorption core, each said adsorption core providing heat exchange between a respective said adsorbent and a heating medium;

evaporation and condensation cores providing heat exchange between a heating medium and the coolant;

a cooling device in which heating medium cooled in said evaporation and condensation cores circulates and cools an object of cooling;



Description
CROSS REFERENCE TO RELATED ART

The present invention is related to Japanese patent application No. Hei. 11-359761, filed Dec. 17, 1999; 2000-56055, filed Feb. 28, 2000; the contents of which are incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to an adsorption-type cooling apparatus, and more particularly to an adsorption-type cooling apparatus that is suitable for application to air conditioners.

BACKGROUND OF THE INVENTION

The assignee has filed an application relating to an adsorption-type cooling apparatus containing at least four adsorption devices (Laid-open Japanese Patent Application 9-303900 hereby incorporated by reference). However, in the above-mentioned openly described invention, the apparatus is difficult to control.

SUMMARY OF THE INVENTION

In view of the above, the present invention provides an adsorption-type cooling apparatus containing four adsorption devices. The present invention provides an adsorption-type cooling apparatus comprising first, second, third, and fourth adsorption devices. These devices are filled with a coolant and contain adsorbents which adsorb evaporated coolant and desorb the adsorbed coolant during heating. Adsorption cores provide heat exchange between the adsorbents and a heat medium, and evaporation and condensation cores provide heat exchange between heating medium and the coolant. A cooling device in which heating medium cooled in the evaporation and condensation cores circulates and cools the object of cooling. A heating means supplies a high-temperature heat medium to the first-fourth adsorption devices. A cooling means supplies a low-temperature heat medium which has a temperature lower than that of the high-temperature heat medium to the first-fourth adsorption devices. Also, a switching control means is provided which switches between multiple states. In a first state, a heat medium is circulated between the cooling device and evaporation and condensation cores of the first and second adsorption devices. The low-temperature heat medium is circulated to the adsorption core of the first adsorption device and heating medium exiting the cooling device is circulated to the adsorption core of the second adsorption device. Meanwhile, the high-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption devices and the low-temperature heat medium is circulated to the evaporation and condensation cores of the third and fourth adsorption devices. In a second state, a heat medium is circulated between the cooling device and evaporation and condensation cores of the first and second adsorption devices and the low-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices. Meanwhile the high-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption devices and the low-temperature heat medium is circulated to the evaporation and condensation cores of the third and fourth adsorption devices. In a third state, the low-temperature heat medium is supplied to the inlet openings of evaporation and condensation cores of the first and second adsorption devices and the high-temperature heat medium is supplied to inlet openings of the adsorption cores of the first and second adsorption devices. Meanwhile, the low-temperature heat medium is supplied to the inlet openings of the adsorption cores of the third and fourth adsorption devices and heating medium exiting the cooling device is supplied to the evaporation and condensation cores of the third and fourth adsorption devices. In a fourth state, the low-temperature heat medium is circulated to the evaporation and condensation cores of the first and second adsorption devices and the high-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices. Meanwhile, the low-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption devices and when the evaporation and condensation cores of the third and fourth adsorption devices were filled with heating medium that exited the cooling device, the circulation of this heat medium is terminated. In a fifth state, a heat medium is circulated between the cooling device and evaporation and condensation cores of the third and fourth adsorption devices, the low-temperature heat medium is circulated to the adsorption core of the third adsorption device, and heating medium exiting the cooling device is circulated to the adsorption core of the fourth adsorption device. Meanwhile, the high-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices and the low-temperature heat medium is circulated to the evaporation and condensation cores of the first and second adsorption devices. In a sixth state (VI), a heat medium is circulated between the cooling device and evaporation and condensation cores of the third and fourth adsorption devices and the low-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption device. Meanwhile, the high-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices and the low-temperature heat medium is circulated to the evaporation and condensation cores of the first and second adsorption devices. In a seventh state (VII), the low-temperature heat medium is supplied to evaporation and condensation cores of the third and fourth adsorption devices and the high-temperature heat medium is supplied to the inlet openings of adsorption cores of the third and fourth adsorption device. Meanwhile, low-temperature heat medium is supplied to the inlet openings of the adsorption cores of the first and second adsorption devices and heating medium exiting the cooling device is supplied to the evaporation and condensation cores of the first and second adsorption devices. In an eighth state (VIII), the low-temperature heat medium is circulated to the evaporation and condensation cores of the third and fourth adsorption devices and the high-temperature heat medium is circulated to the adsorption cores of the third and fourth adsorption device. Meanwhile, the low-temperature heat medium is circulated to the adsorption cores of the first and second adsorption devices and when the evaporation and condensation cores of the first and second adsorption devices were filled with heating medium, exiting the cooling device, circulation of this heat medium is terminated. Accordingly, the switching control means has a first switching control pattern in which the states are switched in the following order: first state (I).fwdarw.second state (II).fwdarw.third state (III).fwdarw.fourth state (IV).fwdarw.fifth state (V).fwdarw.sixth state (VI).fwdarw.seventh state (VII).fwdarw.eighth state (VIII).fwdarw.first state (I).
 
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