Liquid cooled cooling device

5555928
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Inventors

Inaba, Hitoshi
Ohmi, Tadahiro

Application #

961936

Filed

Jan-4-1993

Published

Sep-17-1996

Current US Class

165/101
165/169
165/47
165/80.4
165/96

International Classes

F25D 031/00; F25D 001/02; F28D 007/00; F28D 007/10

Field of Search

165/168 165/169 165/46 165/142 165/47 165/96 165/80.4 165/101

Assignee

Ohmi; Tadahiro (Miyagi-ken, JP); Takasago Netsugaku Kogyo Kabushiki Kaisha (Tokyo, JP)

Examiners

Ford; John K.

Attorney, Agent or Firm

Baker & Daniels

US Patent References

4213498   Low-cost flexible pl...
4498446   Diesel fuel heater
4628991   Wafer scale integra...
4763722   Modular element h...
5005640   Isothermal multi-pa...

Referenced by:

View Backward References

Other References

Melz, et al. "Precise Temperature Control with a Secondary Circuit Layout" 279 Kunstsoffberator 33 (1988) May No. 5 p. 42.

Citation

Cite This Patent

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Abstract
A liquid cooled cooling device wherein occurrence of vibrations is controlled, the power for feeding water is lowered, and further, temperature variations around a heat generating section are prevented. The cooling device comprises: a jacket portion covering the outer peripheral portion of the heat generating section so as to surround it in order to modify the cooling liquid feeding construction and to modify the temperature conditions at flow-in and flow-out portions of the cooling liquid and the relationship between the temperature of the cooling water and the atmospheric temperature around the heat generating section and so forth, and provided at one end thereof with the flow-in portion and at the other with the flow-out portion, the said flow-in portion communicating with the flow-out portion; an insulating member covering the substantially entire peripheral portion of the jacket portion; and a temperature control means for setting the temperature of the cooling liquid flowing into the flow-in portion at a temperature lower than the atmospheric temperature in the space where the heat generating section is provided and for having the temperature of the cooling liquid flowing out of the flow-out portion coincide approximately with the atmospheric temperature.
 
Claims
We claim:

1. A liquid cooled cooling device for cooling a heat generating section, comprising:

a double jacket portion defining a space for locating a heat generating section and covering an outer peripheral portion of said heat generating section, said double jacket portion including an inner portion and an outer portion which are arranged in series flow communication, said inner portion comprising an inner plurality of coolant passage cells and said outer portion comprising an outer plurality of coolant passage cells, said inner and outer pluralities of coolant passage cells arranged in parallel flow communication, each said inner coolant passage cell provided with an entrance pore, each said outer coolant passage cell provided with an exit pore, a flow-in portion for coolant arranged at one end of said inner portion, and a flow-out portion for cooling liquid arranged at one end of said outer portion, the flow directions of coolant in said inner portion and said outer portion being opposite; and



Description
BACKGROUND OF THE INVENTION

FIELD OF THE INVENTION

The present invention relates to a liquid cooled cooling device which is attached to the heat generating section, for example, of a semiconductor device fabrication apparatus, and which is used for the cooling of the heat generating section using a cooling liquid such as cold water.

In, for example, a fabrication apparatus for semiconductor devices, countermeasures to the vibration and temperature accompanying an increase in the degree of integration of semiconductor integrated circuits, and furthermore, to the operating costs thereof, present difficult problems. For example, in processes for the formation of an integrated circuit with a superfine pattern on a wafer, even slight vibrations, which do not normally present a problem, can have a large adverse effect. In particular, superprecision apparatuses such as EB exposure apparatuses, which are necessary steps in the fabrication of superfine semiconductor devices, have an extremely large number of sources which generate vibration. There are various ways by which these vibrations may be propagated. In addition, the superprecision apparatus includes heat generating sections which generate a large amount of heat. A slight vibration caused by the sources that generate vibration and a change in temperature caused by the heat generating sections cause a slight variation, thermal expansion in an alignment stage, variation in the index of refraction of the optical path, etc. This can have extremely large effects on the accuracy of alignment. In addition, it is necessary to provide for heat dissipation with respect to heat generating sections, so that a cooling device is necessary.
 
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