Vacuum vapor deposition system

4552092
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Inventors

Yanagi, Kenichi
Taguchi, Toshio
Wada, Tetsuyoshi
Furukawa, Heisaburo
Wake, Kanji

Application #

652676

Filed

Sep-19-1984

Published

Nov-12-1985

Current US Class

118/718
118/725
118/726
118/730

International Classes

C23C 013/10

Field of Search

118/726 118/725 118/724 118/718 118/715 118/729 118/730 427/251

Assignee

Mitsubishi Jukogyo Kabushiki Kaisha (Tokyo, JP); Nisshin Steel Co., Ltd. (Tokyo, JP)

Referenced by:

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Abstract
A vacuum vapor deposition system including a high-vacuum vapor deposition chamber provided with a rotary cell around which band steel is wound as it is passed through the chamber. A crucible for molten metal has a hood for guiding vapor of said metal to a vapor deposition port opposed to the rotary cell, and arcuate covers connected to the hood at the entrance and exit positions of the band steel. The vapor deposition port is spaced slightly from the rotary cell so that the covers will not come into contact with the band steel. A heater is provided for heating the surface of the rotary cell up to a temperature equal to or higher than a reevaporation temperature of the metal under a vapor pressure of the vapor of the metal in the proximity of the rotary cell so that the metal will not be deposited onto the opposite end portions of the rotary cell which are not covered by the band steel. A heater is also provided for heating the surfaces of the hood and the covers up to a temperature equal to or higher than such reevaporation temperature of the metal so that metal will not be deposited onto the hood and the covers.
 
Claims
What is claimed is:

1. A vacuum vapor deposition system including a high-vacuum vapor deposition chamber provided with a rotary cell around which band steel is wound as it is passed through the chamber, a crucible for melting metal, a hood connected to said crucible for guiding vapor of said metal, a vapor deposition port of which is opposed to said rotary cell, and arcuate covers connected to said hood on a band steel entrance side and on a band steel exit side, respectively, of said vapor deposition port as spaced slightly from said rotary cell so that the covers may not come into contact with the band steel wound around said rotary cell; Characterized in that said system comprises means for heating the surface of said rotary cell up to a temperature equal to or higher than a reevaporation temperature of said metal under a vapor pressure of the vapor of said metal in the proximity of said rotary cell so that said metal may not be deposited onto the opposite end portions of said rotary cell around which said band steel is not wound, and means for heating the surfaces of said hood and said covers up to a temperature equal to or higher than a reevaporation temperature of said metal under a vapor pressure of the vapor of said metal in the proximity of said hood and said covers so that said metal may not be deposited onto said hood and said covers.



Description
The present invention relates to a vacuum vapor deposition system for vapor-depositing metal onto band steel, and more particularly to improvements in such vacuum vapor deposition system such that surplus metal vapor which is not used for vapor deposition onto the band steel may not be produced.

Heretofore, a vacuum vapor deposition system for vapor-depositing metal onto band steel as shown in FIG. 1, has been known. In FIG. 1, reference numeral 1 designates band steel, numeral 2 designates a vacuum envelope, numeral 3 designates a crucible for melting metal and holding molten metal 5, numeral 4 designates a heater for heating the crucible 3, numeral 7 designates a hood for guiding metal vapor evaporated from the molten metal 5 to a vapor deposition port, and numeral 8 designates a heater for heating the hood 7. However, the vacuum vapor deposition system having such structure had a shortcoming that metal vapor would surplusly spurt out through the vapor deposition port 6, resulting in deposition of the metal onto the surface of the band steel 1 on the side which is not to be subjected to vapor deposition, or resulting in deposition of the metal onto the inner wall surface of the vacuum envelope.
 
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