Heat pump cycle

6574977
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Inventors

Ozaki, Yukikatsu
Hotta, Tadashi
Yamaguchi, Motohiro
Yamanaka, Yasushi

Application #

909539

Filed

Jul-20-2001

Published

Jun-10-2003

Current US Class

062/210
062/222
062/238.6

International Classes

F25B 009/00

Field of Search

62/210 62/211 62/212 62/222 62/223 62/224 62/225 62/228.1 62/228.3 62/238.6 62/238.7 62/204

Assignee

Nippon Soken, Inc. (Nishio, JP); Denso Corporation (Kariya, JP)

Examiners

Tanner; Harry B.

Attorney, Agent or Firm

Harness, Dickey & Pierce, PLC

US Patent References

4492092   Combination refrig...
4680941   Waste heating reco...
4955207   Combination hot w...
5890370   Refrigerating syste...

Referenced by:

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Citation

Cite This Patent

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Abstract
In a heat pump cycle, a first high-pressure side heat exchanger is disposed to perform a heat exchange between refrigerant discharged from a compressor and a first fluid, and a second high-pressure side heat exchanger is disposed to perform a heat exchanger between refrigerant from the first high-pressure side heat exchanger and a second fluid having a temperature lower than that of the first fluid. Accordingly, a heat quantity obtained from the heat pump cycle is the sum of a heat amount obtained from the first high-pressure side heat exchanger and a heat amount obtained from the second high-pressure side heat exchanger.
 
Claims
What is claimed is:

1. A heat pump cycle comprising:

a compressor for compressing refrigerant to a pressure higher than critical pressure of refrigerant;

a first high-pressure side heat exchanger disposed to perform a heat exchange between refrigerant discharged from the compressor and a first fluid;

a second high-pressure side heat exchanger disposed to perform a heat exchange between refrigerant flowing from the first high-pressure side heat exchanger and a second fluid having a temperature lower than that of the first fluid;

a decompression unit for decompressing refrigerant flowing from the second high-pressure side heat exchanger, the decompression unit being disposed to control the pressure of refrigerant discharged from the compressor;



Description
CROSS-REFERENCE TO RELATED APPLICATION

This application is related to Japanese Patent Applications No. 2000-220910 filed on Jul. 21, 2000, and No. 2001-120160 filed on Apr. 18, 2001, the contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a super-critical (trans-critical) heat pump in which a discharge pressure of refrigerant from a compressor exceeds the critical pressure of the refrigerant in a heat pump cycle for transferring heat in a low temperature side to a high temperature side, and is effectively applied to the one using carbon dioxide as a refrigerant.

2. Description of Related Art

In a vapor compressing cycle described in U.S. Pat. No. 5,890,370, a discharge pressure of refrigerant from a compressor exceeds the critical pressure of refrigerant, and a high-pressure side refrigerant pressure is controlled based on a refrigerant temperature at an outlet side of a radiator (high-pressure side heat exchanger). In this connection, when the inventors built a prototype of a heat pump cycle for heating hot water in a high-pressure side heat exchanger using the vapor compressing cycle, the following problem occurred.
 
  In combination with a residential air conditioning system and a water fixture with a water recirculation loop, such as a swimming pool, a refrigerant-to-water...  A natural and environmentally friendly cooling system is disclosed. The cooling system comprises an insulating enclosure, a block of ice within the insulating...