Chip inductor

4755784
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Inventors

Taoka, Mikio
Yamamoto, Hiromasa
Otake, Hiroshi
Arima, Hironori

Application #

879889

Filed

Jun-30-1986

Published

Jul-5-1988

Current US Class

029/605
029/855
336/192
336/65
336/96

International Classes

H01F 027/02; H01F 007/06

Field of Search

336/192 336/65 336/96 29/605 29/854 29/855 29/856

Assignee

Matsushita Electric Industrial Co., Ltd. (Osaka, JP)

Examiners

Echols; P. W.

Attorney, Agent or Firm

Stevens, Davis, Miller & Mosher

US Patent References

4427961   Chip type high freq...
4553123   Miniature inductor

Referenced by:

View Backward References

Other References

Patents Abstracts of Japan, vol. 9, No. 169 (E-328) [1892], Jul. 13, 1985; & JP-A-60 43 805 (Matsushita Denki Sangyo K.K.) 08-03-1985 (Cat. A)* Abstract*. Patents Abstracts of Japan, vol. 8, No. 74 (E-236) [1511], Apr. 6, 1984; & JP-A-58 223 306 (Toukou K.K.) 24-12-1983, *Abstract*.

Citation

Cite This Patent

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Abstract
A leadless chip inductor having metallic terminal plates and a coil element fixed to the metallic terminal plates, the metallic terminal plates being partially enclosed, together with the coil element, by a resin molded cover, the portions of the metallic terminal plates exposed to the outside of the molded outer cover being bent along the edge of the molded cover so as to form terminals for connection to an external circuit. The mechanical and electrical connection between the metallic terminal plates and the lead lines led from the coil is achieved by brazing or welding the lead lines to the undersides of a narrow strip-shaped tabs which is projected from each metallic terminal plate. With this arrangement, the coil lead lines are securely connected to the metallic terminal plates.
 
Claims
What is claimed is:

1. A chip inductor having opposing metallic terminal plates, a coil element connected to said metallic terminal plates, and a molded cover partially enclosing said metallic terminal plates and fully enclosing said coil element, portions of said metallic terminal plates exposed to the outside of said molded cover being bent along the edges of said molded cover, wherein the improvement comprises narrow strip-shaped tabs projected from respective metallic terminal plates, said coil element being fixed to the upper surfaces of opposing ends of said pair of metallic terminal plates so as to bridge the plates, coil lead lines extending from said coil element being connected to said metallic terminal plates by being fixed to the undersides of said tabs, wherein each of said tabs is provided with a notch which receives and catches said coil lead line which is to be laid on and fixed to the underside of said tab.



Description
BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a leadless chip inductor for use in various electronic devices, and also to a method of producing such a chip inductor.

2. Description of the Related Art

In recent years, there is a trend for reduction in the sizes of electronic devices, as a result of progress in the technology for the production of various electronic parts including semiconductors in the form of leadless chips.

On the other hand, the requirement for higher relaibility of these leadless chip parts is becoming more senere due to current progress in related technologies such as high-density packaging, reflow brazing and so forth, as well as diversification of function of the electronic devices.

A typical conventional chip inductor will be explained hereinunder with reference to the drawings.

Referring first to FIG. 1 which is a transparent perspective view of a chip inductor, a coil element is constituted by winding a coil 12 on a magnetic core 11 such as a drum-shaped core. This coil element is fixed to the upper surfaces of a pair of metallic terminal plates 13. Coil lead lines 14 are connected mechanically and electrically to the upper surfaces of the metallic terminal plates 13 by brazing or welding as at 15. A molded cover encloses a major part of the metallic terminal plates 13 including the connections 15 and coil element. The portions of the metallic terminal plates 13 outside the molded cover are suitably shaped by, for example, bending in conformity with the manner of packaging of the electronic devices on which the chip inductor is to be mounted.
 
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