Wire bonding

A microcircuit adhesion testing method and fixture for uniform placement and soldering of a preselected length of wire above a film pad on a microcircuit substrate with consistent substrate-to-wire spacing, comprising a holder for the substrate, finger spacers attached to the holder, and a member for...     

An ultrasonic wire bonding chuck includes first and second jaws for squeezing therebetween and clamping securely thereto said state frames utilized in forming microintegrated circuit solid state devices by ultrasonic bonding techniques. A clamping finger is provided for each lead on the frame secured...     

Leads are bonded to a substrate by interposing between the substrate and the leads a conductor portion having substantially the same thickness as the thickness of the leads. In the preferred embodiment, the conductor portion is an end portion of the lead which is folded back on the lead and which is...     

A thermocompression welding device including a welding head having two tools for automatically and simultaneously effecting welds between a connecting wire and a pair of contact areas, one on a semiconductor chip and one on a housing for the chip. The weld head is transversed between consecutive weld...     

A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost...     

Improved wire bonds between circuit points of such apparatus as semiconductor devices and integrated circuit units are accomplished by bonding one end of a wire to one of the circuit points and then paying out from a tool through which the wire is threaded, a length of wire sufficient to form a loop...     

An alloy comprising silver plus one or more additives taken from the class consisting of gold, platinum, osmium, iridium, palladium, ruthenium and rhodium is disclosed. Each additive metal is present in an amount of from 0 to 1% by weight of the alloy. The total amount of additive is at least 0.05% by...     

A thermocouple assembly is provided wherein dissimilar metals are joined at a hot junction within a protective annular shield transparent to radiation. The hot junction is formed in situ so as to be in intimate contact with the ID of said shield. When the assembly is mounted on a phase change cup, one...     

A machine for welding a conductor to a terminal in which a pair of elongated conductive electrodes having adjacent ends are mounted for axial movement toward and away from each other on opposite sides of the terminal. The opposite ends of a cable are attached to the electrodes for moving same toward...     

To permit ball-bonding of wires of aluminium or aluminium alloy to small electrical circuits or components, a spark discharge is created between the end of the wire and an electrode in a shielding atmosphere with a peak current density in the wire section which is from 40 to 450 times that used for ball-bonding...     

A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a simiconductor and is accelerated toward the electrode. Shortly before the bonding tool reaches the electrode,...     

A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The...     

A new wire bonding capillary design is employed in which the bonding and cutting surfaces of the bonding capillary are separated. The bonding capillary tip has an annular bonding surface and an annular cutting ridge raised from the bonding surface and of smaller diameter.

To permit accomplishment of wire bonding at a depth that precludes the use of the conventional clamp adjacent to the bonding tool, a new tool is provided which includes a means for preventing bowing of the wire and a method of using such a tool which substantially obviates any need to feed wire by pushing....     

A wire bonder apparatus for use in connecting a conductor wire to a conductive element on a work piece, such as a microelectronic chip or wafer. The bonder apparatus includes a work piece support station adapted to support a work piece observable through a microscope viewing arrangement, and a bonding...     

A conductive connection between a metallized outer surface of a film of plastics material, such as a polyimide film and a metal or metallized surface of a substrate to which the film is attached. The connection comprises a flexible conductor secured to the substrate and a second film of plastics material...     

A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the wire bonding apparatus, a wire guide unit moving both vertically and transversely, independently of a bonding...     

A method of soldering electrical lead strands (of a width at least 0.3 inch) to a printed electrical path is disclosed. The path is planted on an alumina ceramic substrate and a solder pad is attached to a portion of the path. A flat surface portion of each lead strand is forced into full interengagement...     

Circuit elements and lead connecting metal pieces are set on a conductor circuit formed on a ceramic substrate and are bonded to the conductor circuit by reflow soldering. A head of a lead is set on each of the metal pieces and connected thereto by setting electrodes in contact with the lead head and...     

A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.

A wire bonding method and device in which a bonding tool for holding the leading end of a bonding wire and a wire clamp for clamping the bonding wire at a position between the bonding tool and a bonding wire supply spool are vertically moved independently of each other, thereby electrically interconnecting...     

A simple method of upgrading memory boards containing soldered memory chips by upward pin compatible memory chips with more memory. The new memory chips are soldered over the original memory chips after the power pins of the original chips have been disconnected and insulated from the original chips....     

The present invention relates to a thermosonic wire bonding technique for forming high quality wire interconnections in semiconductor devices. The technique includes using palladium or palladium alloy lead wires to form the wire interconnections between the components of a semiconductor device. The technique...     

This wire bonding method is preferably applied to wire bonding for an elongated semiconductor chip. This method includes a first step of chucking a semiconductor chip by a chuck table to conduct bonding between the bonding pads and electrodes within a bonding region of a wire bonder, a second step of...     

An apparatus is provided with a capillary having a plurality of through holes. A plurality of bonding wires are delivered through the plurality of through holes at the same time from a wire supply unit. The apparatus connects a plurality of bonding wires to an element subject to bonding at the same time.

In accordance with one embodiment of the invention, a process for interconnecting the circuitry of two substrates comprises the step of terminating the circuitry on bonding pads that are arranged in parallel rows with the first row of each substrate being nearest an edge of the substrate. The bonding...     

Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long dimensions all...     

The present invention is directed to a packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors extending through the encapsulating material which are adhesively joined to the semiconductor chip, preferably...     

The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad, and a second wire is bonded on the position where the first wire has been bonded. Bonding of a subsequent wire...     

Laser soldering in a tape automated bonding procedure is carried out on outer ends of a number of high density leads (72) printed on a film (78) of mylar and having inner ends connected to a circuit chip (70). The outer ends of the leads are soldered, without the use of flux, by application of heat and...     

A method of connecting a relatively large diameter, multistrand wire with a relatively small diameter wire. The method comprises: (1) Flattening a portion of the large diameter, multistrand wire into a body of reduced first transverse dimension and an increased second transverse dimension. Simultaneously,...     

An improved means and method for bonding closely spaced parallel wires for applications in electronic devices, circuits and assemblies is described herein. A wire guiding means is provided located between a bonding wedge and a releasable wire clamp of a conventional wire bonder. The wire guide means...     

A wire bonding method for connecting a first bonding point and a second bonding point via a wire including the steps of first connecting the wire to the first bonding point, raising a capillary slightly and moving it slightly away from the second bonding point, raising the capillary further by an amount...     

An electrical joint using spheroidal tipped leads improves the strength of a connection regardless of the material used to bond the connections. Axial leads of a component are formed into spheroids using an appropriate heat source to melt a small portion of the lead tip. Melting a portion of the lead...     

A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter...     

A bonding method including the steps of dividing a substrate into a plurality of regions along its length, storing substrate feeding data and bonding pattern data for the respective regions into a data memory, feeding the substrate underneath a bonding tool in accordance with the substrate feeding data,...     

A wire bonding method in which a bonding wire is pressed against bonding surfaces by a bonding tool so that bonding is performed by applying ultrasonic vibrations to the bonding tool which makes scrubbing actions to smoothen the bonding surfaces while the bonding is being performed.

A method of bonding an electrical conductor to a contact of an integrated circuit (IC) device comprises bonding the conductor to a support member and to a contact of the IC device. The conductor is then severed to release the IC device and conductor from the support. This allows the IC device to be tested...     

A wire bonding method wherein a bonding tool is lowered in a pre-loaded state, and bonding is performed under a bonding load which is smaller than the pre-loading load. The pre-loading load is changed to the bonding load before the bonding tool contacts a bonding point, and the bonding tool contacts...     

A wire bonding method for connecting a chip electrode on a semiconductor chip and a lead through metal wire is described. The wire bonding method includes transmitting a first ultrasonic oscillation to the metal wire before the contact time of the metal wire, and transmitting a second ultrasonic oscillation...     

A method for increasing accuracy and reducing the time required to teach the target bonding points on a reference semiconductor device and its associated lead frame comprises manually approximately locating at least a first target bonding point and at each approximately located bonding point causing...     

A wire bonding method in which a bonding tool is lowered fast toward a bonding surface and the lowering speed of the bonding tool is then reduced at a speed-change point near the bonding surface, wherein a bonding level at which the bonding tool contacts with the bonding surface is detected and stored...     

A wire bonding method that uses plurality of bonders so that each samples treated by the respective bonders are collected via single sample correcting line, in which bonders perform bondings at different points on the samples and/or performs marking bonds at different points thereon, resulting in that...     

A wire bonding method for connecting an electrode pad on a semiconductor chip and an inner lead of a lead frame through a metal wire is described. The wire bonding method is performed by moving a bonding tool holding the wire metal. The method comprises the steps of calculating the height difference...     

In a bonding method used in manufacturing semiconductor devices, after a bonding wire is connected to a first bonding point, a capillary is moved straight up and then moved away from a second bonding point, thus making a first reverse action. From there, the capillary is again raised and a second reverse...     

A wire bonding apparatus for connecting a chip electrode of a semiconductor chip and an inner lead of a lead frame through a bonding wire is described. The apparatus is provided with an X-Y table having a bonding head. An ultrasonic horn is attached rotatably to the bonding head, and extends in the Y...     

A first piece (22) is bonded to a second piece (24) at a selected location (45) by positioning the first piece (22) and second piece (24) between a pair of bonding tools (36 and 38), with the bonding tools at the selected location (45) of the first piece (22) and the second piece (24) where bonding is...     

A wire bonding apparatus includes a capillary tip through which a fine metal wire passes, a first clamp disposed above the capillary tip for clamping the fine metal wire, a second clamp disposed above the first clamp for clamping the fine metal wire, a first moving mechanism for moving the capillary...     

In wire bonding performed in assembling, for example, semiconductor devices, the joining or bonding strength between a ball formed at an end of bonding wire and a bonding point is brought to a satisfactory level because of the use of small diameter balls with a little variation in diameter, and the bonding...     

The present invention provides real time feedback interconnect system which allows real-time detection and control of bond force exerted on the bond site. A force sensor is provided in the bond system, which detects the bond force exerted by the bond tool. The force sensor provides a force signal to...     

A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding...     

In order to avoid an excessive wire loop curvature at a second bonding point, a wire bonding is performed with the steps of: moving the capillary, after the wire is connected to a first bonding point, toward the second bonding point, and right before the capillary comes above the second bonding point,...     

A method of bonding an end of an aluminum wire to a lead comprises the steps of: forming a plurality of parallel bonding grooves on a surface of the lead; pressing the wire end against the grooved surface of the lead with the wire end held in parallel to the bonding grooves; and applying ultrasonic vibration...     

In a wire bonding apparatus and method which reduces variances of the length of tails of bonding wires without increasing the total wire cutting time, a capillary and a wire cutting clamp are moved up fast 10 and then slowly 11, after the wire is bonded to a second bonding point 1, to a-point slightly...     

A bonding apparatus including a motor, a cam, a capillary, and a biasing means. The motor rotates both ways, the cam on the output shaft of the motor is rotated by the motor, and the capillary is moved downwardly when the motor and cam rotate forward. The biasing means urges the cam to rotate in a reverse...     

Apparatus for monitoring the length of a fine wire tail made after the second bond of a fine wire interconnection includes a continuity circuit and a wire bond monitoring system (WBMS) in an automatic wire bonder. The Z axis position of the bonding tool is sensed to determined the height of the bonding...     

An improved method for teaching the location of a bond site on a selected lead finger of a semiconductor leadframe during a wire bonding process is provided. Initially, the location of the lateral edges and terminal edge of a tip portion of the lead finger is sensed by an automated vision system of a...     

An ultrasonic wire bonding method that uses an ultrasonic oscillation output from a non-rotatable form, wherein the ultrasonic oscillation output used for bonding the leads that extend in an X-direction which is perpendicular to the axial direction of a horn is set to be larger than the ultrasonic oscillation...     

A multi-level fine wire tensioning apparatus is provided for use in high speed automatic wire bonders. The tensioning apparatus which surrounds the fine wire is mounted close to the bonding capillary and is adapted to apply one of a plurality of tension forces on the wire depending on the phase of the...     

An improved fine pitch bonding tool for use in automatic gold ball bonders for bonding fine gold wires onto closely spaced pads on semiconductors comprises a cylindrical body portion which fits into an ultrasonic transducer and is provided with a bottle-neck working tip on the other end of the body portion...     

A wire bonding apparatus has a sealed casing having an opening which can be opened and closed, a device for gas-tightly dividing the casing into first and second chambers, a sealing device that is movable for communicating the two chambers with each other, a device for supplying an inert gas into the...     

A wire bonding apparatus and method which enable fully automatic wire bonding between a connecting electrode on a circuit board and an external lead terminal while saving space to prevent enlargement of the package size. The wire bonding method has the steps of welding one end of a ribbon shaped flat...     

A novel bonding tool is designed for use in conventional ultrasonic transducers. The bonding tool body is mounted in the ultrasonic transducer at an angle or in an offset holder so that the working face of the bonding tool is offset and out from under the end of the ultrasonic transducer. The axis of...     

In a bonding method for bonding with a wire a first bonding point and then a second bonding point, a capillary that carries the wire is moved in a direction which is opposite from the first bonding point at the same time that an ultrasonic vibration is applied to the capillary during bonding to the second...     

A novel high-speed capillary/wedge bonding tool is provided for use on an automatic fine wire bonder which has either a rotating bonding head or a workstation which rotates relative to the bonding head. The novel working tip of the novel bonding tool is provided with two closely spaced parallel sides...     

A device for applying tension to a bonding wire installed between a wire spool and a capillary of a wire bonding apparatus including a nozzle for blowing out a gas for applying tension to the wire and a single gas guide plate installed along the direction of the flow of the gas blown out of the nozzle...     

A wire bonding method includes the steps of a lowering a capillary tool supplying a wire, restraining the lowering of the capillary tool, and wire bonding the wire to a bonding face. The inertial force of the capillary tool is reduced to almost zero by restraining the lowering of the capillary tool....     

A wire bonding method and apparatus for manufacturing semiconductor devices automatically correcting, after predetermined times of bonding executions, any shifts occurring via heat, etc. in an offset distance set between a capillary through which a bonding wire passes and a camera that takes images of...     

A multifunctional chip includes first and second electrically isolated bonding pads. The chip also includes a control circuit coupled to the second bonding pad. The control circuit commands the chip to perform the first function if the first and second bonding pads are coupled. Alternatively, the control...     

The wire bonding method of the present invention comprises a step of removing a thin surface layer of an electrode comprising a copper layer and a nickel layer formed on the surface of the copper layer and coated with gold on the surface, to thereby remove nickel hydroxide and nickel oxide present on...     

A multiple face angle wire bonding capillary of the present invention has an elongated hole therethrough terminating at one end of the capillary tip, and a face on the end of the capillary tip extending away from the hole at multiple angles of increasing magnitude.

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased...     

In a bonding station, a tooling principle is provided wherein first and second tool parts respectively hold first and second apparatus parts, each apparatus part having fine conductor periodicity edge bonding regions, in superpositioned registration with the tool parts providing space and accessability...     

A multi-resonance frequency ultrasonic transducer has a plurality of useful resonance frequencies for wire bonding operation and comprises an integral unibody with a rectangular aperture in the center of its mass. A multi-frequency stack of transducer drivers is mounted in the rectangular aperture with...     

A wire bonding head supported for movement upwardly and downwardly having a wire bonding tool connected to an ultrasonic driver in order to sonically bond a wire to an underlying electrical component. The wire is fed to the bonding tool, and fed broken and clamped by a linkage connected to at least one...     

A micropositioner affording the ability to precisely move the tip of an ultrasonic bonding tool relative to a miniature workpiece such as a microcircuit includes a pantograph-like input manipulator mechanism coupled by a single ball joint coupling to a follower mechanism which supports an ultrasonic...     

In a wire bonding apparatus in which images of workpieces placed on a heating block so as to be bonded are taken by a camera through an optical path housing in which an optical path from the workpiece to the camera is established, heaters are installed on the optical path housing so as to heat the optical...     

A method of bonding wires which includes providing at least a first and second pair of bonding locations, one of each pair of bonding locations being subject to flexure in response to the application of a force thereagainst. A clamping force is applied against at least one of the bonding locations subject...     

There is provided a method of bonding inner leads of lead frames to electrodes of semiconductor chips, including the steps of (a) pictorially recognizing bonding sites of inner leads a semiconductor chip through wires for the certain number of lead frames among a plurality of lead frames and analyzing...     

A semiconductor assembling method joins a bonding wire with a bonding object by pressing the bonding wire against the bonding object with a bonding pressurizing tool and by effecting at least either one junction process of thermal junction or ultrasonic junction. The method includes steps of measuring...     

A method for forming a bump on, for instance, an electrode of a semiconductor device out of a wire comprising the steps of forming a ball at the end of the bonding wire, pressing the ball against the electrode, and separating the ball from the wire by cutting the wire by a pair of cutters that advance...     

A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and defined by the bore and the exterior surface, the bore terminating at an end portion (9) of said body. The wall...     

A method for connecting a first bonding point and a second bonding point with a wire comprising the steps of: raising a capillary through which the wire passes slightly after the second reverse operation that involves the movement of the capillary in the opposite direction from a second bonding point,...     

A method for moving a capillary so as to connect wire to a first bonding point and then to a second bonding point in manufacturing, for instance, semiconductor devices, including the steps of moving the capillary in a opposite direction from the second bonding point after moving the capillary away from...     

The invention includes an XYZ stage 100 for positioning an object 140 in an X direction, a Y direction orthogonal to said X direction, and a Z direction orthogonal to both said X and Y directions. The stage 100 comprises a generally horizontal movable stage 104, a stationary X motor connected to said...     

The pin for electronic assemblies according to the present invention consists of a core alloy with 0.2 to 1.5 wt. % Ag, the remainder copper, whereby at least the contact surface of the pin is provided with one or several highly conductive and/or easily solderable coatings. With this not only a higher...     

In a ball forming method used in manufacturing semiconductor devices, a ball is formed at the end of a bonding wire, this ball is pressed against an electrode of a semiconductor device and bonded to the electrode, a capillary is raised by a predetermined amount, and an ultrasonic vibration is applied...     

In a wire bonding apparatus that includes an air-blower connected to a compressor via an electromagnetic valve so as to provide a bonding wire with back tension by blowing air to the bonding wire, a preparatory tank which can store air is installed between the air-blower and the electromagnetic valve...     

A wire bonding method for bonding a first bonding point and then a second bonding point by bonding wire that passes through a capillary including a reverse operation that moves the capillary in a direction opposite from a second bonding point after the bonding is done to the first bonding point, a damper...     

A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current of the AC signal flowing to the bonding tool and a current of the AC signal returned from the bonding tool....     

In a wire bonding method, particularly a method for forming a ball at an end of a bonding wire that has an intended ball size, a tail length of the bonding wire extending from the lower end of a capillary is determined according to the size of the intended ball and the internal shape of the lower end...     

An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased...     

A ball is formed at the tip of a wire projecting from a capillary. The capillary is positioned above an interconnection, and ball bonding forms a bump on the interconnection. The capillary is then moved next to the bump and wedge bonding is carried out. Next, the capillary is moved upward and another...     

A wire bonding method in the manufacture of, for instance, a semiconductor device in which first bonding points or pads of a chip and second bonding points or leads of a lead frame are connected by wires, and the bonding by wires is initiated from one end of the row of the first bonding points (pads)...     

A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire...     

A wire bonding method comprising the steps of raising a capillary after bonding a ball formed on the tip end of the wire extending from the tip end of a capillary to a first bonding point, moving the capillary to a position located at an upward inclination in the direction of a second bonding point,...     

A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and defined by the bore and the exterior surface, the bore terminating at an end portion (9) of said body. The wall...     

An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a...     

In a bonding apparatus such as a bump bonding apparatus, tape bonding apparatus or the like, a positioning claw which is used for positioning a semiconductor pellet on a bonding stage of the bonding apparatus is provided on a bonding head or on an XY table on which the bonding head is installed.

So as to obtain constant heights and shapes of a plurality of loops of bonded wires regardless of the position on the semiconductor chip where bonding is performed, the height position of a bonding tool at a bonding point when the first wire is bonded between first and second boding points is taken as...