Wire lead bonder

A segment of electrically conductive wire is extended through a collet in a capillary tool and is mechanically bonded at one extended portion to a circuit point. Thereafter, an electric current having a decreasing ramp-shaped waveform is applied to the portion of the wire between the bonded circuit point...     

A thermocompression, tailless wire bonder which permits the bonding operation to take place at any location along the path of the bonding tool without affecting the length of wire protruding below the bonding tool or the location of the end of the wire relative to the torch. A non-frictional wire tensioning...     

A wire bonding system connects wires between electrode pads on a semiconductor pellet fixed on a lead frame to the corresponding lead parts on the lead frame. The lead frame with the pellet fixed thereon is first set in a position beneath a projector, to obtain a magnified image of the pellet, from which...     

Apparatus operative in conjunction with a wire routing and bonding machine, or the like, to selectively penetrate a maze of parallel wires on a printed circuit board and expose an area on the board so that additional wires may be suitably bonded to the exposed area. Utilizing the pressure it experiences...     

A very-fine microcircuit interconnecting wire is passed through a central ifice in a capillary bonding head of a thermo-compression device which is used for pressing the balled end, or the body, of the microcircuit interconnecting wire to the metallized pads of a hybrid circuit chip. A pair of capillary...     

A wire bonder which includes a spool from which wire is drawn out, a capillary bonding head adapted to hold the wire and to extend the wire downwardly from the spool, and a tensioning mechanism. The tensioning mechanism includes a nozzle for directing a jet of gas against the wire with the nozzle being...     

A lead wire capillary bonding tool formed from a rod with a core, the rod having a shaped end upon which tungsten carbide or refractory metal is vapor deposited and then the core removed.

Apparatus for producing resistors wherein substantially round heads are heat-formed on the ends of the leads and molded, under a predetermined pressure, into electrical and mechanical contact with a quantity of resistive material to form an integral body.

A bonding tool for ultrasonically bonding wire leads is provided with a bonding tip having a pitted bonding surface thereby providing improved tool gripping action with respect to the lead that is being bonded.

Small electrical resistors, such as are used in circuits of comparatively low power, are automatically fabricated on a winding machine including a chuck assembly for facilitating the start and finish of a winding operation. The chuck assembly consists of a first jaw rotatably mounted with respect to...     

Wire-bonding equipment has jigs which may be secured on a mounting support whereat an electronic or other module may be loaded onto a jig and moved into a correct alignment observable on a television screen, and the jigs are transportable from the mounting support location to a positioning table location...     

A thermocompression welding device including a welding head having two tools for automatically and simultaneously effecting welds between a connecting wire and a pair of contact areas, one on a semiconductor chip and one on a housing for the chip. The weld head is transversed between consecutive weld...     

A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost...     

Improved wire bonds between circuit points of such apparatus as semiconductor devices and integrated circuit units are accomplished by bonding one end of a wire to one of the circuit points and then paying out from a tool through which the wire is threaded, a length of wire sufficient to form a loop...     

An apparatus for automatically positioning a wire bonding machine at a second bond position is provided with a plurality of individually adjustable second bond positioning devices set at second bond positions and cooperable with second bond positioning actuating means. After positioning a semiconductor...     

Difficulties in forming a ball on the end of a wire of aluminium or aluminium alloy for ball bonding are overcome by applying between the wire and an electrode a low voltage, typically 30 volts, and bringing the wire and electrode into temporary contact to fuse the wire and initiate a spark discharge...     

Conductor wires are laid in parallel, one between a respectively associated pair of the coils of a helically wound coil spring while the coils are separated. Thereafter, the coils are moved together so that the conductor wires are pinched between them. One end of each of the wires is fluxed and then...     

This invention relates to a method and apparatus for wire bonding a variety of metals in the interconnection of semiconductor chips to electronic package substrate circuitries. A pair of electrically conducting bonding tip members are provided which are electrically isolated from one another and which...     

An improved tailless wire-bonding apparatus for wedge-bonding fine wire used in the manufacture of semiconductor devices including adjustable linear actuating devices, such as solenoids, energized in the proper sequence by a solid state logic circuit, which operate as latching and releasing mechanisms...     

A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating bonding head. The...     

An apparatus for bonding wires on semiconductors is provided with a processor controlled vertical drive mechanism coupled to a novel bonding head of the type having a bonding tool mounted therein. The height of the bonding tool at the reset position and at the bonding position may be programmed into...     

A wire stringing apparatus interconnects terminals of electronic components mounted upon a circuit board. A wire stringing head, which is transported on an x-y mechanism driven by a controller, wraps an insulated wire about terminals and guide pins mounted on the circuit board. The insulated wire is...     

A bonding system comprising a solder head; a tip unit for receiving wire to be soldered; a heater for heating the tip unit; drive means for moving the head toward and away from a member to be soldered and for increasing the force of the tip unit on the member to be soldered; means for enabling the drive...     

The following specification discloses a parts handling and storage system that can be directed toward the handling and storage of electronic components. The storage portion comprises a movable cabinet on wheels having a plurality of elongated tubular members or channels that receive components or parts...     

To permit ball-bonding of wires of aluminium or aluminium alloy to small electrical circuits or components, a spark discharge is created between the end of the wire and an electrode in a shielding atmosphere with a peak current density in the wire section which is from 40 to 450 times that used for ball-bonding...     

A continuous thru-wire welding machine for welding a conductor to a terminal comprising a stationary support, first and second elongate arms having known weights, a pair of flexible plates for pivotally connecting first ends of each of the first and second arms to the stationary support with the arms...     

A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a simiconductor and is accelerated toward the electrode. Shortly before the bonding tool reaches the electrode,...     

In a wire bonding apparatus in which, by identifying recognition marks of a pellet or leads displaced from a reference position in wire-bonding a pellet of a semiconductor device to leads within a field of view of a television camera, the displacements of the bonding positions of the pellet and the lead...     

An automated welding system takes initially randomly oriented negative glow lamps and welds a resistor to each lamp. Lead wires are trimmed to desired lengths and the physical strength of the weld between the lamp and the resistor is tested.

A new wire bonding capillary design is employed in which the bonding and cutting surfaces of the bonding capillary are separated. The bonding capillary tip has an annular bonding surface and an annular cutting ridge raised from the bonding surface and of smaller diameter.

To permit accomplishment of wire bonding at a depth that precludes the use of the conventional clamp adjacent to the bonding tool, a new tool is provided which includes a means for preventing bowing of the wire and a method of using such a tool which substantially obviates any need to feed wire by pushing....     

A wire bonder apparatus for use in connecting a conductor wire to a conductive element on a work piece, such as a microelectronic chip or wafer. The bonder apparatus includes a work piece support station adapted to support a work piece observable through a microscope viewing arrangement, and a bonding...     

A wire bonder is frequently used for assembling the electronic parts of a semiconductor device or the like and exhibits an effect in the electric connections of the aforementioned electronic parts with a fine metal wire. The wire bonder according to the present invention comprises a clamper for clamping...     

A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the wire bonding apparatus, a wire guide unit moving both vertically and transversely, independently of a bonding...     

A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.

A method and circuits are described for sensing and detecting bond attempts and weld attempts during bonding and welding of lead wire. The method and circuitry are particularly applicable for detecting missed ball bonds and missed wedge bonds during bonding of lead wire between the die pad of a microcircuit...     

Apparatus is provided for monitoring the bond condition of a fine aluminum wire being ultrasonically bonded to an electrode pad. The apparatus comprises a counter for generating a start and stop signal indicative of a predetermined plurality of cycles from the ultrasonic generator of the ultrasonic bonder....     

Apparatus is provided for monitoring conditions of a fine wire interconnection during a bonding operation. The apparatus comprise a system which is capable of being installed on new automatic wire bonders or retrofitted into existing automatic wire bonders of the type which employ a main bonding processor...     

A sonic, lead wire bonding tool has both bonding elements and wire cutting elements formed on its working face and a bail which limits lateral movement of the bonding wire and aids in forming the lead wire as it is payed out between between bonds. The bonding tool applies sonic energy to complete the...     

A wire bonding method and device in which a bonding tool for holding the leading end of a bonding wire and a wire clamp for clamping the bonding wire at a position between the bonding tool and a bonding wire supply spool are vertically moved independently of each other, thereby electrically interconnecting...     

A wire-bonding apparatus which employs a belt-and-pulley driven, spring-returned Z-motion plate to appropriately locate a wire-axis-aligned, solenoid operated, wire feed-and-tear apparatus so that bonds can be quickly and effectively made upon devices located on an X-Y movement table.

The present invention provides a new and improved workstation for holding a semiconductor device opposite the bonding tool of an automatic wire bonder during a bonding operation. The workstation is mounted on a retractable pedestal which is vertically and rotationally movable by a high speed vertical...     

A bonding apparatus for bonding lead wires to a semiconductor surface includes a supply spool that contains a supply of the bonding wire that is fed to a capillary that is made of a non-conductive material. An electric arc forms a ball on the tip of the arc and the ball is retracted into the capillary....     

A twin wire splitter system comprises an X-Y table for mounting a printed circuit board thereon; a wire bonding device for continuously bonding a twin wire to a plurality of wire connecting positions on the printed circuit board; a feeding device for feeding the twin wire; a splitting device provided...     

An ultrasonic generator for providing power to a bonding apparatus having a bonding horn which is brought into contact with respective conductive pads and which carries a wire to be dispensed for interconnection therebetween includes a circuit for applying a voltage at an ultrasonic frequency to the...     

Apparatus for ultrasonically welding a wire to a wire terminal. A stationary anvil forms the lower horizontal wall of a work chamber into which a wire workpiece is inserted. The vertical walls of the work channel are formed by the walls of a slot in a relatively movable horizontal support plate cantilevered...     

This wire bonding method is preferably applied to wire bonding for an elongated semiconductor chip. This method includes a first step of chucking a semiconductor chip by a chuck table to conduct bonding between the bonding pads and electrodes within a bonding region of a wire bonder, a second step of...     

An improved automatic wire feed system for supplying a fine wire to a capillary bonding tool or to a wedge bonding tool is provided. The wire feed system includes a novel wire feed slack loop device which is mounted on the wire bonder between the bonding tool and the source of fine wire. The novel wire...     

An apparatus is provided with a capillary having a plurality of through holes. A plurality of bonding wires are delivered through the plurality of through holes at the same time from a wire supply unit. The apparatus connects a plurality of bonding wires to an element subject to bonding at the same time.

A bonding head (10) of a wire bonding machine for bonding wire to electronic or electronical components comprises a bonding tool (18) connected to an ultrasonic transducer (16), a wire spool (22) mounted at the opposite side of the head to the transducer (16), and (optionally) a guide (60) including...     

The absence of a wire (40) in proper position under the bonding tool (32) of an ultrasonic wire bonder is detected by energizing the bonder transducer (14) while the wire is pulled to break it after the second bond (B) has been made. The pulling of the wire to break it changes the transducer impedance,...     

The invention relates to an apparatus for ultrasonic wire bonding, whereby bonding loci can be interconnected by wire straps, by means of ultrasonic welding; in particular an apparatus in which bonding wire is guided and handled. According to the invention the bar (3) bearing the bonding head (2) has...     

The invention relates to an apparaus for ultrasonic wire bondings whereby the contact loci can be connected by wire straps, by means of ultrasonic welding, e.g. for connecting terminals on component mounts or the like to bonding islands on semiconductor chips. The inventive apparatus has means for combined...     

An automatic ultrasonic wire bonder employs a compliant motion servo (17, 119, 239, 200) on its Z axis drive to maintain a known, constant and steady force applied by the bonding tool (13) to the wire. The tool is resiliently mounted to a carriage (15) that is driven by a force control servo (17, 119,...     

A wire bonding device including a camera for producing image signals corresponding to a field of view including an object having plural target patterns on which wire bonding is to be performed, a displacement device for altering the field view of the camera by varying the relative positioning between...     

The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad, and a second wire is bonded on the position where the first wire has been bonded. Bonding of a subsequent wire...     

A wire bonding apparatus which bonds electrodes and external leads of a semiconductor integrated circuit element, a bonding head, a heat block having a lead frame which supports the semiconductor integrated circuit element in a bonding position, and an ultrasonic horn fixed to the bonding head and generating...     

An apparatus for manual wire bonding, comprising an ultrasonically energizable and/or thermocompression wedge (11) for pressing the wire (34) against a bonding pad, wherein the wedge (11) is part of a bonding head (10) adapted to be moved towards and away from said bonding pad, especially in up/down...     

A manufacturing apparatus has a clean air supply means provided integrally with a part thereof for supplying clean air toward at least an area in which a workpiece exists, and an air discharge means disposed so as to face the clean air supply means across the workpiece and adapted to discharge the air...     

A ball bonding apparatus is provided with a "flame off" electrode which is positioned, during flame off, around and above the capillary tool so that the spark for melting the wire passes in close proximity to the end of the capillary tool. The flame off electrode is preferably mounted on the capillary...     

An improved means and method for bonding closely spaced parallel wires for applications in electronic devices, circuits and assemblies is described herein. A wire guiding means is provided located between a bonding wedge and a releasable wire clamp of a conventional wire bonder. The wire guide means...     

A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter...     

An ultrasonic wire bonder includes first and second ultrasonic wave applying devices, the direction of vibration of the first ultrasonic wave being orthogonal to that of the second ultrasonic wave. One of the first and second ultrasonic waves or a composite ultrasonic wave thereof is applied to a capillary...     

The disclosure relates to a wire bonding capillary having a body with a cylindrical upper portion and a contiguous lower tip portion, the tip portion having an exterior inward taper and an internal bore extending through the body, the bore having a first substantially constant cross sectional region...     

A damping layer of a material and a mounting plate is mounted between an optics tube on a wire bonder and the X-Y table, and between the optics tube and the bond head to dissipate vibrations caused when stepping motors move the X-Y table.

An apparatus for assembling semiconductor devices includes a transportation line for transporting partially fabricated articles such as lead frames with a semiconductor chip mounted thereon; a working unit disposed in the transportation line for processing the partially fabricated articles by wire bonding...     

An apparatus for manufacturing semiconductor devices wherein a curing oven cures samples of dies bonded to lead frames by adhesives, a wire bonder which is installed adjacent to and in line with the curing oven wire-bonds the samples which have been cured in the curing oven, and a sample feeding mechanism...     

A wire bonding device is disclosed. The device has a capillary which causes a wire to make press-contact to a bonding face, a driving motor for raising and lowering the capillary, a storage, means for storing data on a capillary height when making contact to the bonding face or a capillary height with...     

A wire bonder for bonding semiconductor packages that require a deep access to bond between the semiconductor device bond pads and the bonding area on the package to avoid interference between the bond head and the package pins, the bonder including a bellows actuated wire clamp, a reverse venturi to...     

A wire bonding apparatus in which an air guide blows air against a bonding wire so that tension is applied to the bonding wire between a wire spool and a bonding tool so that the bonding wire comes in contact with a wire-contact. An optical sensor is provided near the wire-contact so that the sensor...     

A bonding wedge (1) for an ultrasonic bonder, in particular an aluminium thick wire bonder, with a wire guide in the form of a through-passage (3) extending in the wire direction obliquely from above to the pressing face (2). A plastics sleeve (11) through which the bonding wire (4) is guided is introduced...     

An ultrasonic welding device for mounting wire ends or wire loops on terminal lugs, particularly on terminal lugs or lamellas of drum-shaped commutators for rotating electrical machines, the arrangement comprises a sonotrode, an anvil against which terminal lugs abut during a welding process, and supporting...     

A bonding method for bonding inner leads on a film to electrodes of semiconductor elements is performed by the steps of: individually positioning the film and semiconductor elements at a predetermined bonding position; individually recognizing the positions of the inner leads and electrodes; selecting...     

A wire bonding apparatus including a horn with a bonding tool at one end and a vibrator at the other end, an automatic tracking type ultrasonic oscillating power supply which supplies power to the vibrator and tracks changes in the resonance frequency of the horn by feeding back the error voltage generated...     

A motor-driving circuit is used for driving a motor which is of a type including a rotor whose rotating shaft has a permanent magnet used for generating magnetic fluxes, and an armature having three-phase windings wound around an iron core to form Y-connection windings. The motor-driving circuit includes...     

A voice coil actuated wire tensioner is used on a wire bonder in conjunction with a primary wire clamp to provide accurate control of the bond wire and looping of the bond wire between ball bonding of one end of a bond wire and stitch bonding of the other end of the bond wire.

A wedge bonding tool having a shank and a tapered work end including a narrow bonding tip for holding a wire against a surface to which it is to be bonded, a shank secured to said tapered work end for guiding wire to the rear of the tapered work end, and a wire guiding channel or passage for guiding...     

Wire bonding inspection equipment includes a judging unit for judging whether or not wire bonding of a semiconductor device is acceptabe and for producing a defect signal when the semiconductor device is judged to be defective. In response to the defect signal wires of the defective semiconductor device...     

To provide the necessary vertical motion of a wire- bonding head (20) mounted on a flexural pivot (16), a wire-bonding machine (10) includes an actuator comprising a permanent magnet (56) mounted on the flexural pivot (16) and extending into the central passage (49) of a ferromagnetic sleeve (46) in...     

A bonding head for an automatic wire bonding machine, comprises a flame-off electrode which is adapted to be lifted away from an operative position in which it is used to form a ball on the end of the bonding wire, and a capillary through which the bonding wire is supplied to the flame-off electrode....     

In a wire bonding method in which a capillary is raised from a first bonding point after bonding and then moved in a direction opposite to a second bonding point, thus making a reverse action, such a reverse action is made in a circular-arc shape around a neck part of the wire at the first bonding point....     

A wire bonding device which comprises a height detector that detects the surface height of a semiconductor pellet, a position detector that detects the two-dimensional position of the semiconductor pellet, and a bonding head controller that controls a bonding tool, which changes the search height for...     

The spots to be bonded are determined by a light intensity controller as data and bonding is carried out in accordance with the data. The data obtained are stored in a memory or disk memory. In the case of storing the data in the memory, the data is transmitted to a wire bonder as occasion demands, and...     

A process for manufacturing electronic components known as TAB method comprises a process employing a single apparatus for forming bumps in a chip, a process of inner lead bonding for bonding said bumps to leads of a film carrier, and a process of outer lead bonding for bonding the leads to a circuit...     

In a bonding method and apparatus, a vertical movement of a bonding arm holder that has a capillary at the tip end is detected by a linear sensor and data based upon such a detection is outputted by the sensor. The output date in a predetermined range is checked if it is within a permissible range. If...     

A wire bonding apparatus includes a capillary tip through which a fine metal wire passes, a first clamp disposed above the capillary tip for clamping the fine metal wire, a second clamp disposed above the first clamp for clamping the fine metal wire, a first moving mechanism for moving the capillary...     

The disclosure relates to a bonding tool tip bonding electronic interconnects having a shank portion formed of a relatively hard, stiff material having a high modulus of elasticity and a foot portion formed of polycrystalline diamond bonded to the shank portion. The shank portion is preferably formed...     

In a bonding apparatus for semiconductor devices, etc., a linear sensor is mounted on a bonding head frame. An arm holder which has a bonding capillary at one end is pivotally mounted to the bonding head frame, and the linear sensor is positioned so that it faces a middle portion of the arm holder which...     

The present invention provides real time feedback interconnect system which allows real-time detection and control of bond force exerted on the bond site. A force sensor is provided in the bond system, which detects the bond force exerted by the bond tool. The force sensor provides a force signal to...     

In a wire bonding method and apparatus for connecting first and second bonding points by a wire, a wire clamper, that is made up of an immovable member and a movable member which is driven by a linear motor, is used. The linear motor is actuated so that the clamper first acts in a direction of clamping,...     

In order to minimize the size of an aluminum pad in a method of forming a bump, a metal wire is wedge-bonded on the aluminum pad, a necessary amount of the wire is left on the aluminum pad, and the metal wire is disconnected by a clamp. The width of a collapsed portion of the wire on the aluminum pad...     

A wire bonding apparatus in fabricating, for example, semiconductor devices including a bonding arm that is vertically and horizontally movable and has a capillary through which a bonding wire is passed. The bonding arm is provided with a piezoelectric element which transmits a vibration to the capillary...     

A low mass self-aligning wire clamp jaw assembly is provided which may be employed as a replaceable wire clamp jaw assembly or as a complete integrated wire clamp assembly with an actuator. The novel self-aligning wire clamp jaw assembly comprises a wire clamp jaw mounting arm which is adapted to be...     

A wire bonder comprises a pattern recognition mechanism. The pattern recognition mechanism includes a TV camera head, a camera control unit, a program research unit, and a bonder controller. The bonder controller includes a microcomputer, a control circuit, and a servo drive unit. The TV camera head...     

In a wire bonding apparatus and method which reduces variances of the length of tails of bonding wires without increasing the total wire cutting time, a capillary and a wire cutting clamp are moved up fast 10 and then slowly 11, after the wire is bonded to a second bonding point 1, to a-point slightly...     

A bonding apparatus including a motor, a cam, a capillary, and a biasing means. The motor rotates both ways, the cam on the output shaft of the motor is rotated by the motor, and the capillary is moved downwardly when the motor and cam rotate forward. The biasing means urges the cam to rotate in a reverse...     

A pair of clamping arms of a wire clamper used in a wire bonding apparatus being opened and closed via the electric strain effect or magnetic strain effect of a piezoelectric element. With the use of a piezoelectric element that expands when energized to open the clamping arms so as to release the wire...     

Apparatus for monitoring the length of a fine wire tail made after the second bond of a fine wire interconnection includes a continuity circuit and a wire bond monitoring system (WBMS) in an automatic wire bonder. The Z axis position of the bonding tool is sensed to determined the height of the bonding...     

A wire bonding apparatus for semiconductor devices has a supporting block for holding a workpiece to which wires are bonded, a drive for driving the supporting block for holding the workpiece, the drive being capable of vertically moving and stopping the supporting block at a predetermined position,...     

An ultrasonic bonding apparatus including a piezoelectric element which transmit a vibration via the electric strain or magnetic strain effect to a capillary which is mounted to a non-resonant bonding arm, a microcomputer which outputs frequency data and amplitude data and an open-loop control circuit...