Clamping device

6899262
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Inventors

Gaunekar, Ajit S.
Widdowson, Gary Peter

Application #

441859

Filed

May-19-2003

Published

May-31-2005

Current US Class

228/1.1
228/4.5
228/44.3
228/44.7

International Classes

B23K 037//00; B23K 001//06

Field of Search

228/11 228/45 228/443 228/447 228/180.5

Assignee

ASM Technology Singapore PTE LTD (Singapore, SG)

Examiners

Edmondson; Lynne R.

Attorney, Agent or Firm

Ostrolenk, Faber, Gerb & Soffen, LLP

US Patent References

6439448   Large wire bonder...
6513696   Wedge bonding he...
6783052   Clamp actuation m...

Referenced by:

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Citation

Cite This Patent

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Abstract
A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable between an open position and a closed position. An attraction device is operative to provide an attraction force between the clamping arms about the pivot point. The device includes biasing means that is operative to provide a biasing force in opposition to the attraction force about the pivot point, such that the biasing force is operative to bias the clamping ends towards the closed position. In a preferred embodiment, the biasing means comprises a flexure bearing.
 
Claims
1. A clamping device for clamping an object comprising:

a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable between an open position and a closed position;

an attraction device operative to selectively provide an attraction force between the clamping arms about the pivot point for moving the clamping ends or the clamping arms toward the open position;

a biasing arrangement operative to provide a biasing force in opposition to the attraction force about the pivot point for biasing the clamping ends of the clamping arms toward the closed position; and

a damping mechanism comprising a visco-elastic material coupled to one of the clamping arms at a position that is remote from the clamping ends of the clamping arms and operable to attenuate vibrations of the clamping arms.



Description
FIELD OF THE INVENTION

The present invention relates to a clamping device, especially but not limited to a clamping device in the form of a wire clamp used generally in wire bonding machines or wire bonders in the semiconductor assembly industry.

BACKGROUND AND PRIOR ART

In a wire bonding process, electrically conductive wires are bonded between electrical contact pads found on a semiconductor die and leads on a substrate onto which the die is attached, usually a semiconductor leadframe. The wire needs to be held firmly, fed to the bonding site and stripped off at appropriate junctures in the process. This is usually achieved using a wire clamp. Over the years, the operational speed of wire bonding machines has increased considerably, with the result that the wire clamp needs to be actuated at high speed while exerting controlled force on the wire being clamped, without damaging the wire.

Modern day wire bonders for making so-called "ball-bonds" are designed to execute a rocking motion of a bond-body which carries a bonding tool, about a suitably located pivot. Since the wire clamp is generally carried on the rocking bond-body, it needs to be made as light as possible. Its inertia about the bond-body pivot axis needs to be as small as possible in order to enable high speed bonding operation without need for an unduly large actuator or motor for actuating movement of the bond-body. Even so, the wire clamp needs to have high static and dynamic stiffness thus giving rise to high resonant frequencies of vibration. This ensures that any residual vibration of the wire clamp at the end of the bond-body stroke is of low amplitude and high frequency, and that it settles fast enough, to enable high speed bonding without adversely affecting the bond quality.
 
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