Wire-bonding equipment

4039114
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Inventors

Yoshida, Takekazu
Makizawa, Yoshiaki
Tanaka, Tamotsu

Application #

658014

Filed

Feb-13-1976

Published

Aug-2-1977

Current US Class

228/1.1
228/4.5
228/6.2
228/7

International Classes

H01L 021/607; B23K 021/02

Field of Search

228/1 228/179 228/180 228/110 228/111 228/4.5 228/6

Assignee

Matsushita Electric Industrial Co., Ltd. (JA)

Examiners

Jones, Jr.; James L.

Attorney, Agent or Firm

Wenderoth, Lind & Ponack

US Patent References

3946931   Methods of and ap...

Referenced by:

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Citation

Cite This Patent

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Abstract
Wire-bonding equipment has jigs which may be secured on a mounting support whereat an electronic or other module may be loaded onto a jig and moved into a correct alignment observable on a television screen, and the jigs are transportable from the mounting support location to a positioning table location whereat successive jigs are automatically moved in a requisite manner to bring successive terminals of modules loaded thereon to a position for bonding of wires thereto by a simultaneously actuated wire-bonder unit, after which successive jigs are transported back to the mounting support to permit unloading of a wired module and loading of a new module. Since the disclosed equipment permits use of ultrasonic bonding means, and requires only simple, easily observable actions by an operator, the equipment is particularly suited to wiring of microelectronic modules.
 
Claims
What is claimed is:

1. In equipment for bonding of wires to selected portions of successive elements, wire-bonding equipment comprising:

jig alignment and mounting support means fixedly mounted on said equipment and having an upper surface portion with alignment elements thereon for mounting of a jig on said support means in a required alignment with respect to said equipment;

at least one jig having a main body portion with a lower surface portion having alignment elements corresponding to and removably engagable with said alignment elements on said mounting support means, a head portion having an upper surface portion on which an element to be wired can be fixedly held, said head portion being movable with respect to said main body portion only upon application of external pressure to said head portion, normally unactuated holding means normally holding said head portion stationary with respect to said main body portion and actuable for releasing said head portion for permitting movement thereof only upon application of said external pressure;



Description
The present invention relates to a wirebonding equipment. More particularly the invention relates to equipment for automatic bonding of wiring connections of microelectronic modules or similar units.

In the field of microelectronics it is known to provide a complete circuit in a single independent unit, referred to below as a module, which is compact in size, and which may be assembled with other modules to constitute what is known as a package. Although such modules make it possible to dispense with a great number of separately provided interconnections such as are necessary in more conventional electric circuits, separate interconnection between various terminals of a module is sometimes necessary, and it is always necessary to provide separate connection means for connecting module terminals to external leads, such connection means generally being in the form of fine wires, on the order of 25.mu. for example which are bonded to the terminals. Because of the small overall size of a module element, the distance between terminals thereof is very small, for example on the order of 1-2 mm, and only slight displacement of a connection wire results in an incorrect or imperfect connection, whereby the module is unuseable or is less reliable in use.
 
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